SPI Digital Isolator 500VAC 8 Channel 25kV/µs CMTI 48-TFSOP (0.240", 6.10mm Width) #CommonPartsLibrary #Isolator #Digital #ISOFACE #ISO1I811

3D accelerometer and 3D gyroscope The LSM6DS3TR-C is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 0.90 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DS3TR-C supports main OS requirements, offering real, virtual and batch sensors with 4 kbyte for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element. The LSM6DS3TR-C has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. High robustness to mechanical shock makes the LSM6DS3TR-C the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DS3TR-C is available in a plastic land grid array (LGA) package. Features  “Always-on” experience with low power consumption for both accelerometer and gyroscope  Power consumption: 0.90 mA in combo highperformance mode  Smart FIFO up to 4 kbyte based on features set  Android M compliant  Hard, soft ironing for external magnetic sensor corrections  ±2/±4/±8/±16 g full scale  ±125/±250/±500/±1000/±2000 dps full scale  Analog supply voltage: 1.71 V to 3.6 V  Independent IO supply (1.62 V)  Compact footprint, 2.5 mm x 3 mm x 0.83 mm  SPI & I2C serial interface with main processor data synchronization feature  Pedometer, step detector and step counter  Significant motion and tilt function  Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click  Embedded temperature sensor  ECOPACK®, RoHS and “Green” compliant #CommonPartsLibrary #Sensor

10/100Mb SPI Ethernet controller with TCP/IP stack, LQFP-48 WIZnet Ethernet controller LQFP*7x7mm*P0.5mm*

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

±20% SPI 2.7V~5.5V 100kΩ SOT-23-8 Digital Potentiometers ROHS TPL0501-100DCNR SOT-23-8_L3.0-W1.7-P0.65-LS2.8-BL LCSC Part Number: C131323 JLCPCB Part Class: Extended Part Manufactured by TI(德州仪器)