PIC PIC® 16F Microcontroller IC 8-Bit 20MHz 14KB (8K x 14) FLASH 40-PDIP The PIC16F877A-I/P is a high-performance 8-bit microcontroller from Microchip Technology, based on a Harvard architecture with separate program and data memory buses. It is designed for a wide range of embedded applications requiring reliable processing, multiple communication interfaces, and analog capability. The device integrates Flash program memory, EEPROM data storage, and numerous peripherals including ADC, timers, serial communication modules, and PWM functions. Packaged in a 40-pin PDIP form factor, it is widely used in industrial automation, consumer electronics, and educational development systems. Core Features 8-bit PIC microcontroller architecture Harvard architecture with RISC instruction set Operating frequency up to 20 MHz Single-cycle instruction execution (except branches) Memory Program Memory: 8K words (Flash) Data Memory (RAM): 368 bytes EEPROM Data Memory: 256 bytes I/O Features Up to 33 programmable I/O pins Multiple input/output ports (PORTA, PORTB, PORTC, PORTD, PORTE) High current sink/source capability on selected pins Analog Features 10-bit Analog-to-Digital Converter (ADC) Up to 8 analog input channels Programmable voltage reference Timers and Control Three timers (Timer0, Timer1, Timer2) Capture/Compare/PWM (CCP) modules Watchdog Timer (WDT) Power-on Reset (POR) and Brown-out Reset (BOR) Communication Interfaces USART (Universal Synchronous/Asynchronous Receiver/Transmitter) SPI (Serial Peripheral Interface) I²C (Inter-Integrated Circuit) via MSSP module Electrical Characteristics Operating Voltage: 4.0V to 5.5V Operating Temperature Range: -40°C to +85°C (Industrial grade) Low power consumption modes available Package Information Package Type: PDIP (Plastic Dual Inline Package) Pin Count: 40 pins Mounting Type: Through-hole Applications Industrial control systems Embedded automation Consumer electronics Sensor interfacing and data acquisition Educational and prototyping platforms #commonpartslibrary #integratedcircuit #microcontroller

The Wio-WM1110 is a fusion positioning module for developing low-power, long-range IoT applications. It's embedded with Semtech LR1110 and Nordic nRF52840, features Semtech's LoRa technology for long-range wireless communication, GNSS, Wi-Fi, and Bluetooth for location tracking services.

The Wio-WM1110 Dev Kit is an all-in-one solution for developing low-power, long-range IoT positioning applications. Based on Wio-WM1110 Wireless Module, features Semtech's LoRa® technology for long-range wireless communication, GNSS, and Wi-Fi for location tracking, and also supports Bluetooth Low Energy, Bluetooth mesh, NFC, Thread, and Zigbee.

332 kOhms ±0.1% 0.063W, 1/16W Chip Resistor 0603 (1608 Metric) Anti-Sulfur, Automotive AEC-Q200 Thin Film The RGT1608P-3323-B-T5 is a surface-mount thick film chip resistor designed for general-purpose electronic applications. It features a compact 0603 (1608 metric) package, offering stable electrical performance, high reliability, and suitability for automated assembly. This resistor is commonly used in signal conditioning, voltage division, and current limiting circuits across consumer and industrial electronics. Key Features Compact 0603 (1608 metric) SMD package Thick film resistor technology High reliability and stability Suitable for reflow soldering RoHS compliant and lead-free Electrical Characteristics Resistance Value: 332 kΩ Resistance Tolerance: ±0.1% (B) Temperature Coefficient: ±25 ppm/°C (typical for precision grade) Rated Power: 0.1 W (1/10 W) Maximum Working Voltage: 75 V Maximum Overload Voltage: 150 V Mechanical Characteristics Package Size: 0603 (1608 Metric) Length: 1.6 mm Width: 0.8 mm Height: ~0.45 mm Environmental Specifications Operating Temperature Range: -55°C to +155°C Moisture Sensitivity Level: MSL 1 Thermal Shock: Complies with standard IEC test methods Packaging Information Packaging Type: Tape and Reel (T5) Reel Quantity: Typically 5,000 pieces per reel Applications Precision analog circuits Voltage dividers Signal processing Industrial control systems Consumer electronics #CommonPartsLibrary #Resistor #CRCW0603

HC-05 module is an easy to use Bluetooth SPP (Serial Port Protocol) module, designed for transparent wireless serial connection setup. Serial port Bluetooth module is fully qualified Bluetooth V2.0+EDR (Enhanced Data Rate) 3Mbps Modulation with complete 2.4GHz radio transceiver and baseband. It uses CSR Bluecore 04-External single chip Bluetooth system with CMOS technology and with AFH(Adaptive Frequency Hopping Feature). It has the footprint as small as 12.7mmx27mm. Hope it will simplify your overall design/development cycle #Module #Bluetooth #SPP

CPLD MAX II Family 980 Macro Cells 201.1MHz 0.18um Technology 2.5V/3.3V 144-Pin TQFP #CommonPartsLibrary #IntegratedCircuit #Embedded #CPLDs #MAX® II #EPM1270

ASMT-YTC7-0AA02 http://www.mouser.com/datasheet/2/678/V02-2583EN_DS_ASMT-YTB2-0BB02_2018-03-26-1359910.pdf Broadcom ASMT-YTB2-0BB02, 470 / 530 / 622 nm 3 RGB LED, PLCC 6 SMD package Avago Technologies ASMT-YTB2-0BB02 630-ASMT-YTB2-0BB02 https://www.mouser.co.uk/ProductDetail/Broadcom-Avago/ASMT-YTB2-0BB02?qs=wmFqszA%252Be7NbgAs1Z53pjg%3D%3D

3.5 F (EDLC) Supercapacitor 5.5 V Radial, Can 160mOhm @ 1kHz 1000 Hrs @ 65°C Supercapacitor – SCM Series (3.5F, 5.5V) General Information Manufacturer: Sruite Electronic Technology (US) Series: SCM Part Status: Active Packaging: Bulk Electrical Characteristics Capacitance: 3.5 F Tolerance: -20% / +80% Rated Voltage: 5.5 V ESR (Equivalent Series Resistance): 160 mΩ @ 1 kHz Reliability Lifetime: 1000 hours @ 65°C Mechanical Characteristics Mounting Type: Through Hole Termination: PC Pins Package Type: Radial, Can Physical Dimensions Lead Spacing: 5.50 mm (0.217") Body Size (L × W): 20.0 mm × 10.0 mm Height (Max): 22.0 mm (0.866") Environmental Conditions Operating Temperature Range: -25°C to +70°C Compliance / Classification Grade: Not specified Qualification: Not specified #CommonPartsLibrary #EDLC #SCM

TOPSwitch-JX Family, 43W Output Power, eSIP-7C Integrated Off-Line Switcher with EcoSmart™ Technology PowerIntegrations?eSIP?7C*

TOPSwitch-JX Family, 43W Output Power, eDIP-12B Integrated Off-Line Switcher with EcoSmart™ Technology PowerIntegrations?eDIP?12*

Nuclear Event Detector HSN-1000 Flatpack Package. Maxwell Technologies’ HSN-1000 radiation-hardened Hybrid Nuclear Event Detector (NED) senses ionizing radiation pulses generated by a nuclear event, such as the detonation of a nuclear weapon, and rapidly switches its output from the normal high state to a low state with a propagation delay time of less than 20ns. The active low Nuclear Event Detection signal (NED) is used to initiate a wide variety of circumvention functions, thus preventing upset and burnout of electronic components. The NED output is also used to initiate both hardware and software recovery. This high-speed, 14-pin hybrid detector is used in electronic systems as a general-purpose circumvention device to protect memory, stop data processing, and drive power supply switches as well as signal clamps.

Bipolar Transistors - BJT BFP740H6327XTSA1 SOT343_L2.0-W1.3-P1.30-LS2.1-BL LCSC Part Number: C152627 JLCPCB Part Class: undefined Manufactured by Infineon Technologies AG

The BP2866C, manufactured by 晶丰明源半导体, is a high precision buck constant current LED driver designed for universal input offline LED lighting applications. Operating in critical conduction mode, this component is suitable for 85Vac~265Vac input and integrates a 500V power MOSFET. It features patented demagnetization detection technology and high-voltage JFET power supply technology, eliminating the need for a VCC capacitor and starting resistors, thereby minimizing system cost and size. The BP2866C offers precise output current and excellent line regulation through a patent-pending current control method. It includes robust protection functions such as LED short circuit protection, VCC under voltage protection, and thermal regulation. Available in a SOP7 package, it ensures a +5% LED output current accuracy and is ideal for applications like LED candle lights and bulbs.

N-Channel 30 V 47.1A (Ta), 162A (Tc) 4.8W (Ta), 57W (Tc) Surface Mount PowerPAK® 1212-8SH 30 V N-channel TrenchFET® Gen V MOSFET that combines very low on-resistance (RDS(on)), high current capability, and a thermally efficient compact package. It is optimized for applications where high efficiency, low power loss, and small PCB footprint are critical. This device is built using advanced trench MOSFET technology, enabling low conduction and switching losses, which improves overall system efficiency in power electronics designs. N-channel MOSFET (enhancement mode) Low RDS(on): ~1.2 mΩ @ 10 V → minimizes conduction losses High current capability: 47.1 A (ambient) up to 162 A (case) 30 V drain-source voltage (VDS) Low gate charge (Qg) → fast switching performance Wide operating temperature: −55 °C to +150 °C Compact PowerPAK® 1212-8 package for high power density #CommonPartsLibrary #Transistor #FET #Mosfet #SISS52

The IA611 SmartMic is an "always-on" Audio Processor featuring Voice Wake and Voice ID keyword detector, a two-second buffer', and Knowles' proven high performance acoustic SiSonic™ MEMS microphone technology in a single, miniature, top-port package. The IA611 offers flexibility by supporting the most relevant audio and data interfaces. Its integrated programmable DSP with 248 kBytes of RAM is available for customer and 3rd party algorithms, enabling unlimited creativity. The solution pushes the system performance to ultra-low power with its custom core design, and accelerates time to market with its highly integrated combination of hardware, software, and firmware.

CoolSiC™ 1200 V SiC MOSFET G2 : Silicon Carbide MOSFET with .XT interconnection technology Features • VDSS = 1200 V at Tvj = 25°C • IDDC = 34 A at TC = 100°C • RDS(on) = 40 mΩ at VGS = 18 V, Tvj = 25°C • Very low switching losses • Overload operation up to Tvj = 200°C • Short circuit withstand time 2 µs • Benchmark gate threshold voltage, VGS(th) = 4.2 V • Robust against parasitic turn on, 0 V turn-off gate voltage can be applied • Robust body diode for hard commutation • .XT interconnection technology for best-in-class thermal performance • Suitable Infineon gate drivers can be found under https://www.infineon.com/gdfinder Potential applications • General purpose drives (GPD) • EV Charging • Online UPS/Industrial UPS • Solar power optimizer • String inverter • Energy Storage Systems (ESS) • Welding #CommonPartsLibrary #Transistor #FET #Mosfet #CoolSiC™ G2 IMZC120R040M2H

IC RF TxRx + MCU Cellular CDMA, GSM, HSPA, LTE, TD-SCDMA, WCDMA 100kHz ~ 3.8GHz 261-SMD Module The LMS7002M is a Field Programmable RF (FPRF) transceiver that can both transmit and receive radio signals over a very wide frequency range. It integrates most of the RF front-end and baseband processing functions into a single chip, minimizing the need for external components. Frequency range: 100 kHz to 3.8 GHz Architecture: Dual transceiver (2 TX + 2 RX) supporting 2×2 MIMO Bandwidth: Up to ~120–160 MHz RF bandwidth depending on configuration Technology: CMOS-based for low cost and power consumption Integrated blocks: ADCs & DACs (12-bit) LNAs and PA drivers Mixers, PLL synthesizers Filters and gain control On-chip DSP and microcontroller Transmit path: Digital baseband → DAC → filtering → RF upconversion → output Receive path: RF input → LNA → downconversion → filtering → ADC → digital processing This zero-IF (direct conversion) architecture simplifies design and supports wideband operation. #CommonPartsLibrary #IntegratedCircuit #LMS7002

240 Position Connector High Density Array, Male Surface Mount Gold The ADM6-60-01.5-L-4-2-A-TR is a compact board-to-board (BTB) mezzanine connector designed for high-density, low-profile interconnections between printed circuit boards (PCBs). It is commonly used in applications where space is limited but reliable multi-pin connectivity is required. Connector Type: Surface-mount, dual-row board-to-board connector Pitch: 1.5 mm Number of Positions: 60 pins Rows: 2 (30 pins per row) Mounting Style: SMT (Surface Mount Technology) Orientation: Typically vertical (mezzanine stacking) Contact Type: Female receptacle (usually mates with a corresponding male header) Compact Design: Optimized for space-constrained PCB layouts High Pin Density: 60 contacts in a small footprint Reliable Contact: Designed for stable electrical and mechanical connection Tape & Reel Packaging (TR): Suitable for automated assembly processes Stack Height: Fixed (around 4 mm, depending on variant) #CommonPartsLibrary #Connector #AcceleRate® ADM6