JST XH Connector Header Through Hole 2 position 0.098" (2.50mm) B2B-XH-A(LF)(SN) is a 2-position, 2.50 mm pitch, through-hole shrouded male PCB header from the JST XH Series. It is designed for reliable wire-to-board connections in consumer electronics, industrial equipment, power supplies, battery packs, and embedded systems. The connector features a polarized shrouded housing to prevent incorrect mating and supports secure, dependable electrical connections with easy PCB assembly. Key Features: 2-position wire-to-board header 2.50 mm contact pitch Through-hole (THT) PCB mounting Straight vertical orientation Shrouded housing with polarization to prevent misalignment Rated for up to 3 A current and 250 V AC/DC Tin-plated brass contacts for reliable conductivity Operating temperature range: -25°C to +85°C Compatible with JST XH Series crimp housings and terminals Ideal for power and signal connections in compact electronic assemblies. #JST #XHSeries #PCBHeader #WireToBoard #Connector #ThroughHole #THT #ShroudedHeader #2Position #25mmPitch #Electronics #EmbeddedSystems #IndustrialElectronics #PowerConnector #PCBDesign

Bluetooth, WiFi 802.11b/g/n/ax, Bluetooth v5.4 Transceiver Module 2.4GHz Integrated, Chip Surface Mount Silicon Labs SiWG917 module is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 module includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 16 x 21.1 x 2.3 mm package. The wireless subsystem consists of a multi-threaded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, flash, ultra-low power sensor hub, and matrix vector processor. The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing, while the NWP runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications. The modules come with modular radio type approvals for various countries, including USA (FCC), Canada (IC/ISED) and Japan (MIC), and are in compliance with the relevant EN standards (including EN 300 328 v2.2.2) for the conformity with the directives and regulations in EU and UK. KEY FEATURES • Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax • Bluetooth LE 5.4 • Single chip Matter Over Wi-Fi Solution • ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals. • Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MUMIMO/OFDMA for Higher Throughput, network capacity and low latency • Best in Class Device and Wireless Security • WLAN Tx power up to +17.5 dBm with integrated PA • Bluetooth LE Tx power up to +17 dBm with integrated PA • WLAN Rx sensitivity as low as -95.5 dBm • Wi-Fi 4 Standby Associated mode current: 71 μA @ 1-second listen interval • Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB • Embedded PSRAM option up to 2 MB/ optional external PSRAM option up to 16 MB • Ultra-low power sensor hub peripherals • Matrix Vector Processor (MVP) • Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence • Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 KB) • Operating temperature: -40 to +85 ºC • Operating supply range: 3.0 to 3.63 V • Supply voltage for GPIOs: 1.71 to 3.63 V #WiFi6 #BluetoothLE54 #IoTModule #WirelessSoC #SiliconLabs #EmbeddedSystems #SmartHome #IndustrialIoT #LowPowerDesign #RFModule #ConnectedDevices #EdgeComputing #MatterReady #PCBDesign #ElectronicsEngineering

MAX-M10 RF Receiver BeiDou, Galileo, GLONASS, GPS, GNSS 1.561GHz, 1.575GHz, 1.602GHz -167dBm 921.6kbps Not Included Module The MAX-M10S-00B is a professional-grade, ultra-low-power GNSS positioning module from u-blox based on the u-blox M10 platform. It is designed for battery-powered applications such as asset trackers, wearables, IoT devices, and navigation systems. The module supports simultaneous reception of multiple GNSS constellations, providing high positioning availability, fast acquisition times, and excellent sensitivity even in challenging urban or weak-signal environments. It integrates a TCXO, LNA, and SAW filter to improve RF performance while maintaining very low power consumption. Key Features Multi-constellation GNSS receiver: GPS Galileo GLONASS BeiDou QZSS SBAS support (WAAS, EGNOS, MSAS, GAGAN) Concurrent tracking of up to four GNSS constellations for improved position availability and accuracy. Ultra-low power consumption: Approximately 25 mW in continuous tracking mode, making it ideal for battery-powered devices. High RF sensitivity: Tracking sensitivity up to −167 dBm for reliable operation in weak-signal conditions. High positioning accuracy: Typical position accuracy of approximately 1.5 m CEP under suitable conditions. Navigation update rate: Up to 10 Hz for responsive tracking applications. Integrated RF front-end: Built-in LNA (Low Noise Amplifier) Built-in SAW filter Integrated TCXO for stable operation. Supports Assisted GNSS services: AssistNow Online AssistNow Offline AssistNow Autonomous CloudLocate support for low-power IoT positioning. Communication interfaces: UART I²C NMEA and UBX protocols supported. Wide operating temperature range: −40°C to +85°C. Supply voltage: 1.76 V to 3.6 V. Typical Applications Asset tracking devices Wearable electronics Fleet management systems Industrial IoT Smart meters Drone and robotics navigation Personal navigation devices Timing and synchronization systems Package Information Package Type: Surface-mount LCC module Dimensions: 9.7 mm × 10.1 mm × 2.5 mm (typical module size) #Commonpartslibrary #RF #Wireless #RFreceivers #MAXM10S #uBlox #GNSS #GPS #Galileo #GLONASS #BeiDou #QZSS #NavigationModule #GNSSModule #GPSTracking #AssetTracking #IoT #IndustrialIoT #WearableTech #FleetManagement #DroneNavigation #EmbeddedSystems #ElectronicsDesign #PCBDesign #HardwareEngineering #LowPowerDesign #LocationTracking #Geolocation #RFDesign #LNA #SMTModule

Red, Green, Blue (RGB) 624nm Red, 525nm Green, 470nm Blue LED Indication - Discrete 2V Red, 3.3V Green, 3.3V Blue 4-SMD, No Lead # 150080M153000 ## General Description The 150080M153000 is a compact surface-mount full-color RGB LED manufactured by Würth Elektronik as part of the WL-SFCD series. The device integrates red, green, and blue light-emitting elements within a single package, enabling the generation of a wide spectrum of colors for status indication, user interfaces, backlighting, visual notifications, and decorative lighting applications. Its diffused lens design provides uniform light distribution and wide viewing visibility, making it suitable for industrial equipment, consumer electronics, communication devices, instrumentation systems, control panels, and embedded electronic products. The component is optimized for automated assembly processes and offers reliable optical performance, low power consumption, and long operational life. ## Key Features ### Optical Characteristics * Full-color RGB light output * Integrated red, green, and blue emitters * Diffused lens design for uniform illumination * Wide viewing angle * High-visibility indication capability * Consistent color performance ### Electrical Characteristics * Low-power operation * Stable optical output * Suitable for indicator and backlighting applications * Reliable performance across operating conditions * Optimized for embedded electronic systems ### Mechanical Characteristics * Surface-mount package construction * Compact footprint * Low-profile package design * Compatible with automated assembly processes * Reflow-soldering compatible ### Package Construction * Common-anode configuration * Integrated multi-die LED architecture * Rectangular lens geometry * Lead-free package design * Industrial-grade construction ### Material Characteristics * High-quality encapsulation materials * Diffused optical lens * RoHS-compliant construction * Environmentally compliant materials ### Environmental Characteristics * Suitable for commercial and industrial applications * Long operational service life * Reliable operation under standard environmental conditions * Resistant to normal assembly and handling processes ### Application Areas * Status Indicators * User Interface Displays * Industrial Control Panels * Consumer Electronics * Home Appliances * Telecommunications Equipment * Instrumentation Systems * Backlighting Applications * Smart Devices * Embedded Electronic Products * Safety and Security Equipment * Human-Machine Interface Systems ### Compliance * RoHS Compliant * REACH Compliant * Lead-Free Compatible * Industry-Standard Surface-Mount Technology ## Manufacturer Würth Elektronik ## Product Family WL-SFCD SMD Full-Color Chip LED Series #150080M153000 #WurthElektronik #RGBLED #SMDLED #WLSFCD #FullColorLED #LEDIndicator #Backlighting #Optoelectronics #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #PCBDesign #ElectronicsEngineering #SMTAssembly #commonpartslibrary #optoelectronic #ledindication

2 Position Wire to Board Terminal Block Horizontal with Board 0.150" (3.81mm) Through Hole ## Engineering Specification ## General Description The **1727010** is a Phoenix Contact **MKDS series PCB terminal block** designed for secure wire-to-board electrical connection in printed circuit board assemblies. It provides a compact screw-clamp termination interface for connecting external conductors to PCB circuitry. The component is suitable for industrial electronics, automation equipment, control modules, power interfaces, instrumentation, and general electronic assemblies requiring reliable field wiring termination. ## Device Identification Manufacturer Part Number: **1727010** Manufacturer: **Phoenix Contact** Product Name: **MKDS 1/ 2-3,81** Product Series: **MKDS** Product Line: **COMBICON Terminals** Device Category: **Connector and Interconnect Component** Device Type: **PCB Terminal Block** Connection Type: **Wire-to-Board Terminal Block** Termination Method: **Screw Connection with Tension Sleeve** Mounting Type: **Through-Hole PCB Mount** ## Functional Description The device functions as a fixed PCB terminal block that allows external wires to connect directly to the printed circuit board. The screw-clamp mechanism provides both mechanical conductor retention and electrical continuity between the field wiring and PCB circuit. This makes the component suitable for applications where wiring must be secure, serviceable, and accessible during installation or maintenance. ## Mechanical Description The terminal block uses a compact housing with side-entry conductor access and through-hole solder pins for stable PCB attachment. Its construction supports organized wire routing and practical access for conductor insertion and screw tightening. The design is suitable for compact board layouts where reliable field wiring connection is required. ## Electrical Description The component is intended for signal and low-voltage power connection applications within the manufacturer’s specified electrical ratings. It provides stable electrical contact when used with compatible conductor sizes, correct wire preparation, and proper screw tightening torque. ## Material and Contact Description The terminal block uses an insulating housing with internal conductive contact elements that transfer current from the inserted conductor to the soldered PCB pins. The screw connection with tension sleeve helps maintain reliable contact pressure and secure conductor retention during normal operating conditions. ## Mounting and Assembly Description The **1727010** is intended for through-hole solder mounting on a printed circuit board. The PCB layout should follow the manufacturer’s recommended hole size, pad pattern, spacing, and soldering guidance. The component should be positioned to allow safe wire insertion, screwdriver access, and adequate clearance from nearby components or enclosure walls. ## Application Suitability The device is suitable for industrial control boards, automation modules, power supply interfaces, relay boards, instrumentation equipment, sensor wiring interfaces, building control systems, communication hardware, and other electronic products requiring secure PCB wire termination. ## Design Considerations The design should account for conductor size compatibility, current requirement, voltage rating, tightening torque, creepage and clearance spacing, solder joint strength, wire routing, and service access. The terminal block should not be used beyond the manufacturer’s specified electrical, mechanical, or environmental limits. ## Hashtags #commonpartslibrary #terminalblock #pcbterminalblock #phoenixcontact #mkds #combicon #wiretoboard #screwterminal #fixedterminalblock #throughholecomponent #soldermount #connector #interconnect #fieldwiring #industrialelectronics #automationequipment #controlsystems #powerinterface #pcbdesign #hardwaredesign #electronicscomponents #electronicparts #engineeringparts #componentlibrary #electronicsengineering

0.5 mOhms ±1% 5W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element # Engineering Specification ## Product Name CSS4J-4026R-L500F ## General Description CSS4J-4026R-L500F is a precision four-terminal Kelvin current sense shunt resistor designed for accurate current measurement in high-performance electronic and power management systems. The device is intended for use in applications requiring low resistance sensing, high measurement accuracy, and stable thermal performance under varying electrical loads. The component utilizes a metal element resistive structure optimized for minimal resistance drift, reduced temperature effects, and consistent long-term stability. Its four-terminal Kelvin configuration separates current flow and voltage sensing paths, enabling improved measurement accuracy by eliminating errors caused by PCB trace and connection resistance. The device is widely used in power conversion systems, battery monitoring systems, motor control circuits, and industrial power electronics where precise current feedback is essential for control, protection, and monitoring functions. Its surface-mount construction supports compact PCB layouts and automated assembly processes while maintaining robust mechanical and electrical reliability. The design emphasizes efficient heat dissipation, stable electrical characteristics, and compatibility with demanding industrial and automotive environments. It is suitable for integration into systems requiring continuous current monitoring and high measurement fidelity. ## Functional Requirements ### Current Measurement The device shall provide accurate current sensing through a low-resistance conductive path designed for minimal measurement error. ### Kelvin Sensing Operation The device shall support four-terminal Kelvin sensing to improve measurement accuracy by separating current and voltage sensing paths. ### Signal Stability The device shall maintain stable sensing characteristics under varying load and thermal conditions. ### System Integration The component shall support integration into power electronics and embedded control systems requiring precise current feedback. ## Electrical Requirements ### Low Resistance Operation The device shall exhibit very low resistance to minimize power loss and maintain measurement accuracy. ### Thermal Stability The resistor shall maintain consistent electrical behavior under elevated operating temperatures and thermal cycling conditions. ### Power Handling The device shall support operation in high-current environments typical of power conversion and motor control systems. ### Measurement Accuracy The design shall support precise voltage drop measurement proportional to current flow for control and monitoring applications. ## Mechanical Requirements ### Surface Mount Construction The device shall be provided in a surface mount package suitable for automated PCB assembly. ### Structural Integrity The component shall maintain mechanical stability during assembly, operation, and thermal cycling. ### PCB Integration The device shall support direct integration into multilayer printed circuit board designs with optimized current path layout. ## Environmental Requirements ### Operating Conditions The device shall operate reliably under industrial and automotive environmental conditions. ### Thermal Performance The component shall maintain performance stability under continuous electrical loading and heat generation. ### Storage and Handling The device shall maintain physical and electrical integrity during storage, transport, and handling procedures. ## Quality Requirements ### Reliability The device shall provide long-term stability in resistance value and sensing accuracy under continuous operation. ### Verification Electrical, thermal, and mechanical characteristics shall be validated through appropriate testing and qualification procedures. ### Compliance The product shall conform to applicable standards for current sensing resistors used in industrial and automotive electronics. ## Documentation Requirements Technical documentation shall include application guidelines, layout recommendations for Kelvin sensing, thermal considerations, electrical characteristics, and integration practices for power electronics systems. ## Classification Tags #CSS4J4026RL500F #CurrentSenseResistor #ShuntResistor #KelvinSensing #FourTerminalResistor #PowerElectronics #BatteryManagement #MotorControl #PowerSupplyDesign #AnalogSensing #ElectricalEngineering #PCBDesign #EmbeddedSystems #IndustrialElectronics #AutomotiveElectronics #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #TechnicalDocumentation #HighCurrentSensing #PrecisionMeasurement #CircuitDesign

67 Position Female Connector M.2 (NGFF) Mini Card Gold 0.020" (0.50mm) Black # Engineering Specification ## Product Name 2199230-4 ## General Description 2199230-4 is a surface mount board-edge connector designed to support standardized M.2 module interfaces, specifically configured for Key E applications used in wireless communication, embedded computing, and high-speed peripheral expansion systems. The component provides a reliable mechanical and electrical interface between a host printed circuit board and a removable or fixed M.2 module. The connector is engineered to accept gold-finger edge contacts from an M.2 module, enabling secure signal transmission for high-speed data communication, power delivery, and control signaling. Its design supports stable mechanical retention, precise alignment, and consistent electrical contact performance under repeated mating cycles. This component is widely used in industrial computing platforms, telecommunications equipment, IoT devices, and embedded system architectures where modular expansion and standardized connectivity are required. It enables flexible system design by allowing interchangeable M.2 modules for wireless communication, storage, and specialized processing functions. The design emphasizes signal integrity, mechanical durability, and compatibility with high-density PCB layouts. It is suitable for applications requiring robust high-frequency performance and reliable long-term mechanical stability. ## Functional Requirements ### Module Interface The connector shall provide a standardized interface for M.2 Key E module insertion and electrical connection. ### Signal Transmission The connector shall support high-speed electrical signal routing between host systems and M.2 modules. ### Mechanical Retention The connector shall securely retain inserted modules under vibration and operational stress conditions. ### System Modularity The connector shall enable modular expansion and replacement of functional M.2 devices within host systems. ## Electrical Requirements ### Contact Performance The connector shall provide stable electrical contact between gold-finger module pads and host PCB terminals. ### Signal Integrity The design shall support high-frequency signal transmission with minimal loss and interference. ### Power Delivery The connector shall support regulated power distribution to installed M.2 modules. ### Low Resistance Path The electrical interface shall maintain low contact resistance for reliable long-term operation. ## Mechanical Requirements ### Board Edge Mounting The connector shall be mounted on a printed circuit board to accept edge-insertion M.2 modules. ### Alignment and Fit The design shall ensure precise alignment between module contacts and connector terminals. ### Durability The connector shall withstand repeated module insertion and removal cycles without performance degradation. ### Structural Stability The assembly shall maintain mechanical integrity under vibration and operational stress conditions. ## Environmental Requirements ### Operating Conditions The connector shall operate reliably in industrial, commercial, and embedded system environments. ### Thermal Performance The device shall maintain mechanical and electrical stability under elevated operating temperatures. ### Storage and Handling The component shall retain structural and functional integrity during storage, transportation, and assembly processes. ## Quality Requirements ### Reliability The connector shall provide consistent electrical and mechanical performance throughout its operational lifetime. ### Verification Mechanical retention, contact resistance, and signal integrity shall be validated through appropriate qualification testing. ### Compliance The product shall conform to applicable standards governing M.2 interface connectors and high-speed board-edge interconnect systems. ## Documentation Requirements Technical documentation shall include footprint layout guidance, mating interface specifications, signal routing recommendations, mechanical keep-out regions, and application guidelines for M.2 system integration. ## Classification Tags #21992304 #M2Connector #M2KeyE #EdgeCardConnector #GoldFingerInterface #HighSpeedConnector #BoardEdgeConnector #WirelessModuleConnector #PCIeInterface #NGFF #EmbeddedSystems #IoTHardware #TelecomHardware #PCBDesign #MechanicalConnector #SignalIntegrity #HighFrequencyDesign #CommonPartsLibrary #ComponentLibrary #EngineeringSpecification #SystemIntegration #HardwareDesign #TEConnectivity #ModuleInterface #BoardToModule

24 MHz ±20ppm Crystal 18pF 60 Ohms 4-SMD, No Lead The ABM8G-24.000MHZ-18-D2Y-T is a compact 24.000 MHz surface-mount quartz crystal from Abracon's ABM8G series, designed to provide a stable and accurate clock reference for digital electronic systems. Housed in a miniature 3.2 × 2.5 mm, 4-pad SMD package, it is optimized for space-constrained applications while delivering reliable frequency performance over a wide operating temperature range. This crystal is commonly used in microcontrollers, wireless modules, communication equipment, networking devices, industrial electronics, and precision timing circuits. It operates in the fundamental mode with an 18 pF load capacitance, making it suitable for a broad range of oscillator circuits. Key Features 24.000 MHz fundamental-mode quartz crystal Compact 3.2 × 2.5 × 1.0 mm 4-pad SMD package 18 pF load capacitance ±20 ppm frequency tolerance ±30 ppm frequency stability Maximum 60 Ω ESR Wide operating temperature range: −40°C to +85°C Glass-sealed ceramic package for high reliability Compatible with standard IR reflow soldering processes Low-profile design suitable for compact PCB layouts Ideal for embedded systems, communications, wireless devices, and clock generation applications. #Abracon #QuartzCrystal #24MHz #ABM8G #SMDCrystal #TimingDevice #ClockSource #EmbeddedSystems #WirelessElectronics #IndustrialElectronics #PCBDesign #ElectronicsComponents

Bipolar Motor Driver NMOS On/Off, PWM 44-HTSSOP The DRV8262QDDWRQ1 is an automotive-qualified, high-power H-bridge motor driver from Texas Instruments designed for 24 V and 48 V automotive systems. It integrates two H-bridges capable of driving one or two brushed DC motors, a bipolar stepper motor, or thermoelectric coolers (TECs). The device features integrated high-side current sensing, programmable current regulation, and comprehensive protection functions, eliminating the need for external current-sense resistors while reducing PCB area and system cost. It supports wide supply voltages from 4.5 V to 60 V, making it suitable for demanding automotive body electronics and industrial motor control applications. Key Features Automotive AEC-Q100 Grade 1 qualified (-40°C to +125°C) Wide 4.5 V to 60 V operating supply voltage Dual H-bridge or single high-current H-bridge operation Drives: One or two brushed DC motors One bipolar stepper motor One or two thermoelectric coolers (TECs) Up to 8 A peak (dual H-bridge mode) Up to 16 A peak (single H-bridge mode) Low MOSFET on-resistance: 100 mΩ (dual H-bridge) 50 mΩ (single H-bridge) Integrated high-side current sensing with ±4% accuracy Programmable current regulation and current limiting Supports 1.8 V, 3.3 V, and 5 V logic interfaces Configurable PWM control modes (PH/EN or IN/IN) Ultra-low 3 µA sleep current Integrated protection features: Undervoltage Lockout (UVLO) Charge Pump Undervoltage (CPUV) Overcurrent Protection (OCP) Thermal Shutdown (OTSD) Fault output (nFAULT) Functional safety-capable with supporting documentation for automotive system design. #DRV8262QDDWRQ1 #MotorDriver #HBridge #AutomotiveElectronics #BrushedDCMotor #StepperMotor #CurrentSense #AECQ100 #TexasInstruments #EmbeddedSystems #PowerManagement #PCBDesign

1.5µH Shielded Molded Inductor 9.1A 15.8mOhm Max 1616 (4040 Metric) The XFL4020-152MEC is a metal-composite core, shielded surface-mount power inductor with an inductance value of 1.5 µH and a current rating of 9.1 A. Its low DCR of 15.8 mΩ maximum helps reduce conduction losses, making it suitable for efficient power conversion designs. The component is rated for automotive-grade reliability (AEC-Q200) and operates over a wide temperature range of -40°C to +125°C. Key Features Inductance: 1.5 µH Tolerance: ±20% Maximum Current Rating: 9.1 A Saturation Current (Isat): Approximately 4.6 A Low DC Resistance (DCR): 15.8 mΩ max Shielded molded construction for reduced EMI radiation Metal composite core for high efficiency and compact size Surface-mount package: 1616 / 4040 metric Dimensions: approximately 4.0 mm × 4.0 mm × 2.1 mm Self-resonant frequency: 59 MHz AEC-Q200 qualified for automotive applications Operating temperature: -40°C to +125°C Typical Applications DC/DC switching converters Power supply filtering Voltage regulator modules (VRM) Battery-powered devices Automotive power electronics Embedded power management systems Hashtags #Coilcraft #XFL4020 #PowerInductor #ShieldedInductor #SMTInductor #DC_DCConverter #PowerElectronics #AutomotiveElectronics #AECQ200 #PCBDesign #ElectronicComponents #commonpartslibrary #inductor

ARM® Cortex®-M4F STM32G4 Microcontroller IC 32-Bit 170MHz 512KB (512K x 8) FLASH 64-LQFP (10x10) The STM32G491RET6 from STMicroelectronics is a high-performance 32-bit microcontroller based on the Arm® Cortex®-M4 core with Floating Point Unit (FPU), designed for advanced embedded applications requiring high computational performance, precise analog processing, and real-time control. It belongs to the STM32G4 series and integrates enhanced analog peripherals, motor-control timers, communication interfaces, security features, and hardware accelerators such as CORDIC and FMAC. The device operates at up to 170 MHz, provides 512 KB Flash memory, and includes 96 KB SRAM, making it suitable for applications such as motor control, digital power conversion, industrial automation, robotics, and embedded control systems. Key Features Core: Arm® Cortex®-M4 32-bit CPU with FPU, DSP instructions, and MPU Maximum CPU Frequency: Up to 170 MHz (up to 213 DMIPS) Memory: 512 KB Flash memory with ECC support 96 KB SRAM with parity checking features Quad-SPI memory interface Operating Voltage: 1.71 V to 3.6 V Package: LQFP-64 Advanced Analog Features: 3 × 12-bit ADCs with high-speed conversion 4 × 12-bit DAC channels 4 × Rail-to-Rail operational amplifiers 4 × Fast analog comparators Internal voltage reference buffer Hardware Accelerators: CORDIC accelerator for trigonometric calculations FMAC (Filter Math Accelerator) for digital filtering applications Timers & Motor Control: Advanced PWM timers for motor-control applications Multiple 16-bit and 32-bit timers Support for encoder and PWM control Communication Interfaces: 2 × FDCAN interfaces 5 × USART/UART 3 × SPI interfaces 3 × I²C interfaces USB 2.0 Full-Speed interface SAI audio interface Security Features: True Random Number Generator (TRNG) CRC calculation unit Unique device ID Debug & Programming: SWD and JTAG debugging support Typical Applications Motor control and BLDC controllers Digital power converters Industrial automation equipment Robotics and motion control Smart sensors and embedded control systems Power management applications #STM32G491RET6 #STM32G4 #STMicroelectronics #ARM_CortexM4 #Microcontroller #MCU #EmbeddedSystems #MotorControl #DigitalPower #IndustrialAutomation #Robotics #IoT #ElectronicsDesign #PCBDesign

1 mOhms ±1% 4W Chip Resistor Nonstandard Automotive AEC-Q200, Current Sense Metal Element Bourns Inc. CSS4J-4026R-1L00F is a high-power surface-mount current sense resistor designed for accurate current measurement in power electronics applications. It belongs to the CSS4J-4026 series and uses a metal element construction that provides low resistance, high power handling, and excellent stability for automotive and industrial applications. This device features a 1 mΩ resistance value, ±1% tolerance, and 4 W power rating, making it suitable for monitoring high-current paths while minimizing measurement losses. It is also qualified for AEC-Q200 automotive applications and operates across a wide temperature range. Key Features Component Type: SMD Current Sense Resistor (Metal Element / Metal Strip) Resistance Value: 1 mΩ (0.001 Ω) Resistance Tolerance: ±1% Power Rating: 4 W Package Size: 4026 (approx. 10.06 mm × 6.60 mm) Number of Terminals: 4 terminals (Kelvin sensing configuration) Temperature Coefficient: approximately ±75 ppm/°C Operating Temperature Range: −55°C to +170°C Construction: Metal element current shunt resistor for accurate current measurement Qualification: Automotive AEC-Q200 compliant Typical Applications Battery Management Systems (BMS) EV and automotive power systems Motor control circuits Power supplies and DC/DC converters Overcurrent monitoring and protection circuits Industrial power monitoring equipment #CommonPartsLibrary #Bourns #CSS4J4026 #CurrentSenseResistor #ShuntResistor #MetalElementResistor #AECQ200 #PowerElectronics #BatteryManagementSystem #EVElectronics #SMTComponents #PCBDesign

Mini 2.45 GHz Antenna The 2450AT18A100E is a high-frequency ceramic SMT antenna featuring a small 3.2 mm × 1.6 mm × 1.3 mm package, optimized for space-constrained RF designs. It operates from 2400 MHz to 2500 MHz with a 50 Ω impedance and provides a compact alternative to traditional PCB trace antennas while maintaining reliable RF performance. Key Features Operating Frequency: 2400 MHz – 2500 MHz (2.4 GHz ISM Band) Center Frequency: 2450 MHz Antenna Type: Mini Ceramic Chip Antenna / SMT RF Antenna Package Size: 3.2 mm × 1.6 mm × 1.3 mm Impedance: 50 Ω Peak Gain: Approximately +0.5 dBi (typical) Average Radiation Efficiency: Approximately 76% (based on Johanson evaluation board) Maximum Input Power: 2 W continuous wave (CW) Operating Temperature Range: -40 °C to +125 °C Mounting Type: Surface Mount Technology (SMT) Applications: Bluetooth / BLE devices Wi-Fi 2.4 GHz modules Zigbee / IEEE 802.15.4 systems IoT sensors and embedded wireless products #2450AT18A100E #JohansonTechnology #ChipAntenna #SMTAntenna #RFDesign #2GHzAntenna #Bluetooth #WiFi #Zigbee #IoT #WirelessCommunication #EmbeddedSystems #PCBDesign #RFAntenna #Antena #Chip #SurfaceMount

Battery Retainer Coin, 24.5mm 1 Cell SMD (SMT) Tab BAT-HLD-006-SMT is a surface-mount coin-cell battery holder designed for secure retention of a single CR2450 lithium coin battery in compact PCB applications. Manufactured by TE Connectivity, it provides a low-profile, reliable power solution for embedded systems, wireless sensors, IoT devices, medical electronics, and backup power circuits. The holder features a horizontal battery orientation, phosphor bronze construction, and nickel-plated contacts for durability and dependable electrical performance. Key Features Supports one CR2450 coin-cell battery Surface-mount (SMT) PCB installation Horizontal battery orientation for low-profile designs Nickel-plated contacts for reliable conductivity and corrosion resistance Phosphor bronze construction for mechanical durability Maximum contact current rating of 1 A Compact design with approximately 6.88 mm height above PCB Suitable for automated assembly and reflow soldering processes Ideal for RTC backup, wireless modules, portable electronics, and IoT devices #BatteryHolder #CR2450 #CoinCellHolder #SMT #SurfaceMount #TEConnectivity #PowerManagement #EmbeddedSystems #IoT #PCBDesign #Electronics #BatteryRetainer #HardwareDesign #ElectronicComponents