Non-Isolated DC/DC Converters Ultra-small DC to Regulated DC Converter to 100V, Low-current, PCB-Mount Module, Unipolar, Single Output #power-supply #DCDC-Converter #ULTRAVOLT® XS #0.1XS5

JST PH SMD Connector Header Surface Mount, Right Angle 2 position 0.079" (2.00mm) The S2B-PH-SM4-TB(LF)(SN) is a surface-mount, 2-position wire-to-board header connector from the JST PH series. It is designed for compact and reliable connections in low-current, signal, and power applications. With a 2.0 mm pitch and secure friction-lock mechanism, this connector ensures stable mating with corresponding PH series crimp housings. The connector features side-entry (horizontal) orientation and solder tabs for enhanced PCB retention, making it suitable for automated assembly and high-vibration environments. Key Features 2-position connector (2 circuits) 2.0 mm pitch spacing Surface-mount, right-angle (side entry) configuration Friction-lock mechanism for secure mating Solder hold-down tabs for mechanical stability Compact, low-profile design Compatible with JST PH series housings and terminals Tape & reel packaging for automated assembly Mechanical Characteristics Mounting Type: Surface Mount (SMT) Orientation: Right Angle (Side Entry) Pitch: 2.0 mm Number of Positions: 2 Mating Type: Friction lock Board Retention: Solder tabs (SM4 type) Electrical Characteristics Rated Current: 2 A (per contact, AWG #24) Rated Voltage: 100 V AC/DC Contact Resistance: ≤ 20 mΩ (initial) Insulation Resistance: ≥ 100 MΩ Withstanding Voltage: 800 VAC/minute Material Specifications Insulator: Polyamide (Nylon), UL94V-0 rated Contact Material: Copper alloy Contact Plating: Tin over nickel (Sn plating) Environmental Specifications Operating Temperature Range: -25°C to +85°C Storage Temperature: -40°C to +85°C Packaging Information Packaging Type: Tape & Reel (TB suffix) Lead-Free: Yes (LF) Surface Finish: Tin plating (SN) Compatible Components Mating Housing: JST PH series (e.g., PHR-2) Crimp Terminals: SPH-002T-P0.5S or equivalent Typical Applications Consumer electronics Battery connections Signal and low-power connections Embedded systems and IoT devices Portable and compact electronic assemblies #commonpartslibrary #connector #header #tht

Accelerometer X, Y, Z Axis ±2g, 4g, 8g 6.25Hz ~ 200Hz 12-LGA (2.2x2.3) The ADXL367BCCZ-RL7 is an ultra-low power, three-axis MEMS accelerometer developed by Analog Devices for motion sensing applications requiring extremely low energy consumption and high measurement stability. The device integrates precision acceleration sensing, embedded motion detection capabilities, and intelligent power management features within a compact surface-mount package suitable for portable and battery-operated systems. The accelerometer supports both I²C and SPI digital communication interfaces, enabling flexible integration with embedded processors, microcontrollers, and sensor hubs. Its architecture is optimized for continuous motion monitoring while maintaining exceptionally low current consumption, making it ideal for wearable electronics, asset tracking devices, medical monitoring equipment, industrial sensing systems, and Internet of Things platforms. The device incorporates embedded activity, inactivity, and wake-up detection functions that allow host processors to remain in low-power states until significant motion events occur. Integrated FIFO buffering and programmable interrupt functionality reduce processor overhead and improve overall system efficiency. The ADXL367BCCZ-RL7 is designed for robust operation across a wide operating temperature range and maintains high measurement accuracy with low noise and excellent long-term stability. The compact LGA package enables dense PCB layouts for space-constrained designs. Key Features Motion Sensing Three-axis digital accelerometer Selectable acceleration measurement ranges High-resolution motion detection Low noise sensing architecture Integrated temperature sensor Power Management Ultra-low power operation optimized for battery-powered systems Multiple operating and standby modes Autonomous motion-triggered wake-up capability Efficient duty-cycling support Digital Interfaces Supports SPI communication Supports I²C communication Programmable interrupt outputs Embedded FIFO data buffering Embedded Detection Functions Activity detection Inactivity detection Motion-triggered interrupt generation Autonomous wake-up monitoring Mechanical and Environmental Compact LGA surface-mount package High shock tolerance Wide operating temperature capability Suitable for portable and industrial environments Electrical Characteristics Supply Requirements Low-voltage digital supply operation Optimized for low-current embedded systems Stable operation across supported voltage range Sensor Performance High sensitivity stability Low offset drift Low output noise density Configurable output data rates Communication and Control Supported Interfaces SPI serial interface I²C serial interface Programmability Configurable measurement ranges Adjustable output data rates Programmable interrupt mapping FIFO configuration support Package Information Package Type LGA surface-mount package Mounting PCB surface mount compatible Suitable for automated assembly processes Typical Applications Wearable electronics Health and fitness monitoring Portable instrumentation Asset and condition monitoring Industrial sensing systems IoT sensor nodes Motion-activated devices Battery-powered embedded systems #commonpartslibrary #integratedcircuit #accelerometer #sensor

DIODE GP 75V 150mA SOD-123 The 1N4148 (SOD-123) is a silicon epitaxial planar switching diode designed for fast switching applications. It is widely used in surface-mount designs as the SMD version of the classic 1N4148 (DO-35 through-hole type). It is mainly used for low-current, high-speed switching circuits, such as signal clamping, protection, logic circuits, and general rectification in small electronics. Key Features Fast switching speed (reverse recovery time typically ≤ 4 ns) Reverse voltage up to 100 V (peak) Average forward current: ~150 mA Compact SOD-123 surface-mount package (2-pin SMD) Low power dissipation (~400–500 mW depending on manufacturer) Low reverse leakage current (very small, µA or less) Low junction capacitance (~2–4 pF typical) for high-speed operation Wide operating temperature range: -55°C to +150°C Suitable for automatic PCB assembly (SMT reflow compatible) #CommonPartsLibrary #Diode

Bipolar (BJT) Transistor NPN 40V 200 mA 300MHz 300 mW Surface Mount SOT-23-3 (TO-236) The MMBT3904LT1G is a general-purpose NPN bipolar junction transistor designed for switching and amplification applications. It is housed in a compact SOT-23 surface-mount package, making it suitable for high-density PCB designs. This transistor is widely used in low-power signal processing, digital switching, and analog amplification circuits due to its reliable performance and fast switching characteristics. Key Features General-purpose NPN transistor Compact SOT-23 surface-mount package Fast switching speed Low saturation voltage Suitable for low-current and low-power applications High reliability and stability Pb-free, Halogen-free, and RoHS compliant Electrical Characteristics (Typical @ 25°C unless otherwise specified) Collector-Emitter Voltage (VCEO): 40 V Collector-Base Voltage (VCBO): 60 V Emitter-Base Voltage (VEBO): 6 V Collector Current (IC): 200 mA (max) DC Current Gain (hFE): 100 – 300 Collector-Emitter Saturation Voltage (VCE(sat)): 0.2 V (typ) Transition Frequency (fT): ~300 MHz Absolute Maximum Ratings Collector Current (Continuous): 200 mA Power Dissipation: ~225 mW Junction Temperature: +150°C (max) Operating Temperature Range: -55°C to +150°C Storage Temperature Range: -55°C to +150°C Mechanical Characteristics Package Type: SOT-23 (TO-236AB) Mounting Type: Surface Mount Number of Pins: 3 Marking Code: Dependent on lot/manufacturer marking Applications General-purpose switching circuits Signal amplification Digital logic interfacing LED drivers and small load switching Audio and RF signal processing #CommonPartsLibrary #TransistorBJT #MMBT2222

All details fully confirmed from Azoteq's official IQS7222B datasheet and multiple verified distributor sources. Here's the complete spec. Engineering Specification — IQS7222B102QNR Manufacturer: Azoteq (Pty) Ltd Device Family: IQ Switch® ProxFusion® Series — IQS7222B General Description The IQS7222B102QNR is a high-channel-count capacitive touch and proximity sensing controller integrated circuit manufactured by Azoteq, belonging to the ProxFusion series of intelligent human interface sensing devices. The IQS7222B is a sensor fusion device for various multi-button applications that is fully I²C compatible, with on-chip calculations that enable the IC to respond effectively even in the lowest-power modes. It represents an expanded-channel evolution within Azoteq's IQS7222 family, offering a substantially higher mutual capacitance channel count than the IQS7222A variant while maintaining the same ProxFusion design philosophy of combining sophisticated on-chip sensing intelligence with a minimal external component requirement and a compact surface-mount package. Molex The IQS7222B is a highly flexible ProxFusion device that can configure up to eighteen mutual capacitance buttons or up to eight self-capacitance buttons, with nine external sensor pad connections available in the QFN package variant. Alternatively, it can configure up to twenty mutual capacitance buttons or eighteen mutual capacitance buttons with a proximity wake-up function. This high degree of channel configurability makes the device adaptable to a very broad range of physical interface configurations, from simple multi-button panels to complex touch arrays with simultaneous proximity wake-up capability, all within a single fixed-footprint IC that does not require a change of device between product variants with different button counts. MolexAmazon Target applications for the IQS7222B include remote control user interfaces, home automation device user interfaces, and wireless speaker controls. These application domains share common requirements for robust touch detection through cosmetic overlay materials such as glass, plastic, or painted surfaces, reliable operation in environments where the device may be exposed to moisture or contamination, and power efficiency sufficient to support battery-powered or always-on operation without significantly impacting battery life. The device's on-chip power management architecture, which features automated system power modes for optimal response versus consumption, directly addresses these requirements by allowing the device to spend the majority of its time in a low-current sleep or ultra-low-power state while still waking promptly in response to proximity or touch events. MolexMolex Built-in basic functions include automatic tuning, noise filtering, debounce and hysteresis, and dual direction trigger indication. The automatic tuning capability, implemented through Azoteq's proprietary ATI algorithm, compensates for variations in electrode capacitance that arise from PCB manufacturing tolerances, overlay thickness variation, and environmental factors such as temperature and supply voltage drift. This self-calibration eliminates the need for individual unit factory calibration and ensures consistent touch sensitivity across the full production run of any product built around this device. The noise filtering and debounce functions further improve the reliability of touch event detection in electrically noisy environments, preventing false triggers from electrical interference or mechanical vibration that could otherwise cause spurious button events in poorly filtered designs. Molex Both mutual capacitance and self-capacitance designs are possible with the IQS7222B, giving system designers the flexibility to choose the sensing modality most appropriate for their electrode layout and overlay configuration. Mutual capacitance sensing offers better noise immunity and the ability to detect touch through thicker overlay materials, while self-capacitance sensing allows a simpler single-electrode layout per button with potentially higher raw sensitivity. The I²C communication interface supports IRQ/RDY signaling at speeds up to Fast-Plus mode, providing efficient, low-latency event notification to the host microcontroller without requiring continuous polling of the device. The "QNR" suffix in the part number designates the QFN twenty-pin package variant, which offers the maximum external pad count for mutual capacitance configurations. MolexMolex Spec Sheet Identification Part Number: IQS7222B102QNR Device Family: IQ Switch ProxFusion Series — IQS7222B Manufacturer: Azoteq (Pty) Ltd Part Number Decode IQS7222B: Base device family, B-variant expanded channel count 102: Firmware/configuration variant designation QNR: QFN twenty-pin package, tape-and-reel Functional Classification Device Type: Multi-channel capacitive touch and proximity sensing controller IC Sensing Architecture: ProxFusion sensor fusion engine with on-chip processing Application Class: Multi-button, slider, and wheel human interface controller Channel Configuration Mutual Capacitance Buttons: Up to twenty configurable buttons Mutual Capacitance with Proximity Wake-Up: Up to eighteen mutual capacitance buttons with simultaneous proximity wake function Self-Capacitance Buttons: Up to eight self-capacitance buttons External Sensor Pad Connections: Nine pads available in QFN package Sensing Modalities Mutual Capacitance: Full channel array for high noise immunity and overlay penetration Self-Capacitance: Simplified single-electrode per button layout option Proximity Detection: Pre-touch proximity wake-up capability Built-In Processing Functions Automatic Tuning: Proprietary ATI algorithm for self-calibration and baseline normalization Noise Filtering: Integrated digital filtering for EMI and environmental noise rejection Debounce and Hysteresis: Per-channel configurable debounce and release hysteresis Dual Direction Trigger: Positive and negative delta event detection Host Interface Communication Protocol: I²C fully compatible Speed Grade: Up to Fast-Plus mode Event Signaling: IRQ/RDY interrupt output for host notification I²C Address: Configurable; additional address options available on special request Power Management Operating Modes: Active sensing, idle, and ultra-low-power modes Automated Power Mode Control: System-managed transitions for optimized response versus current consumption ULP Wake Capability: Proximity or touch event wake-up from ultra-low-power state Layout & Application Notes VREG Decoupling: Capacitor required at each VREG pin, placed as close as possible to IC Tx Series Resistance: Nominal series resistance recommended on Rx electrodes to reduce EMI coupling ESD Rating: Pins rated to high HBM ESD performance per JEDEC JEP155 Environmental & Qualification RoHS Compliance: Yes Lifecycle Status: Active production Package Package Type: QFN — Quad Flat No-Lead, twenty-pin Package Designation: QNR variant per Azoteq ordering suffix Mounting Method: Surface mount technology (SMT) Packaging Format Supply Format: Tape-and-reel Target Applications Remote control user interfaces Home automation device controls Wireless speaker and audio device interfaces Multi-button consumer appliance panels IoT device touch interfaces Industrial HMI panels with overlay #IQS7222B #IQS7222B102QNR #Azoteq #ProxFusion #IQSwitch #CapacitiveTouchController #MutualCapacitance #SelfCapacitance #ProximityController #MultiButtonHMI #TouchSensor #ATICalibration #SmartHMI #HomeAutomation #RemoteControl #WirelessSpeaker #IoTDesign #LowPowerSensing #QFN20 #SurfaceMount #EmbeddedHMI #EngineeringSpec #ComponentLibrary #CommonPartsLibrary #RoHSCompliant

Battery Battery Monitor IC Lithium Ion 8-TDFN-EP (2x2) The MAX17048/MAX17049 ICs are tiny, micropower current fuel gauges for lithium-ion (Li+) batteries in handheld and portable equipment. The MAX17048 operates with a single lithium cell and the MAX17049 with two lithium cells in series. The ICs use the sophisticated Li+ battery-modeling algorithm ModelGauge™ to track the battery relative state-ofcharge (SOC) continuously over widely varying charge and discharge conditions. The ModelGauge algorithm eliminates current-sense resistor and battery-learn cycles required in traditional fuel gauges. Temperature compensation is implemented using the system microcontroller. The ICs automatically detect when the battery enters a low-current state and enters low-power 3µA hibernate mode, while still providing accurate fuel gauging. The ICs automatically exit hibernate mode when the system returns to active state. On battery insertion, the ICs debounce initial voltage measurements to improve the initial SOC estimate, thus allowing them to be located on system side. SOC, voltage, and rate information is accessed using the I2C interface. The ICs are available in a tiny 0.9mm x 1.7mm, 8-bump wafer-level package (WLP), or a 2mm x 2mm, 8-pin TDFN package. ● MAX17048: 1 Cell, MAX17049: 2 Cells ● Precision ±7.5mV/Cell Voltage Measurement ● ModelGauge Algorithm • Provides Accurate State-of-Charge • Compensates for Temperature/Load Variation • Does Not Accumulate Errors, Unlike Coulomb Counters • Eliminates Learning • Eliminates Current-Sense Resistor ● Ultra-Low Quiescent Current • 3μA Hibernate, 23μA Active • Fuel Gauges in Hibernate Mode • Automatically Enters and Exits Hibernate Mode ● Reports Charge and Discharge Rate ● Battery-Insertion Debounce • Best of 16 Samples to Estimate Initial SOC ● Programmable Reset for Battery Swap • 2.28V to 3.48V Range ● Configurable Alert Indicator • Low SOC • 1% Change in SOC • Battery Undervoltage/Overvoltage • VRESET Alert ● I2C Interface ● 8-Bit OTP ID Register (Contact Factory) #CommonPartsLibrary #IntegratedCircuit #PowerManagement #Battery-management #MAX17048

Buzzers Transducer, Externally Driven Piezo 3 V 3mA 4kHz 70dB @ 3V, 10cm Surface Mount Solder Pads The CMT-1603-SMT-TR is a compact, surface-mount piezoelectric buzzer transducer designed for applications requiring an externally driven audible indicator. Featuring a low-profile 16 × 16 mm package, it delivers reliable single-tone sound output with low current consumption, making it suitable for portable electronics, industrial equipment, consumer devices, medical instruments, and embedded systems where PCB space is limited. Key Features: Piezoelectric buzzer transducer (externally driven) Surface-mount (SMT) package with solder pad terminals Compact 16 × 16 × 2.8 mm low-profile design Low current consumption (~3 mA typical) Resonant frequency of 4 kHz Sound pressure level of 70 dB @ 3 V, 10 cm Rated voltage: 3 V Maximum input voltage: 25 Vp-p Single-tone acoustic output Operating temperature range: −30°C to +70°C Tape-and-reel (TR) packaging for automated assembly RoHS compliant #Hashtags: #PiezoBuzzer #AudioTransducer #SurfaceMount #SMTBuzzer #ExternallyDriven #LowProfile #LowCurrent #EmbeddedSystems #IndustrialElectronics #ConsumerElectronics #MedicalDevices #RoHS #commonpartslibrary #audio #buzzer

100 Position Connector Receptacle, Center Strip Contacts Surface Mount Gold The DF40C-100DS-0.4V(51) is a board-to-board and board-to-FPC receptacle connector manufactured by Hirose Electric. It belongs to the DF40 series, a family of fine-pitch stacking connectors intended for compact, high-density interconnect applications such as mobile devices, cameras, wearables, and other space-constrained electronics. The connector functions as the receptacle (socket) half of a mating pair, designed to stack with a corresponding DF40 plug header to join two printed circuit boards, or a printed circuit board and a flexible printed circuit, in a low-profile vertical arrangement. This particular part number represents the full-position, low-profile variant within the series, configured without a reinforcing metal fitting and without a locating boss or mechanical holddown feature, meaning it relies on the contact array itself rather than additional structural hardware for mechanical retention during reflow and handling. The connector is supplied in straight, surface-mount form and is non-polarized, so it can be inserted in either orientation relative to its mating counterpart. Contacts are arranged in parallel rows along the connector body, with gold plating in the contact mating area to ensure reliable signal continuity and resistance to oxidation over repeated use. The series is positioned by Hirose as a general-purpose, high-speed-capable interconnect, suitable for a range of differential and single-ended signaling standards used in consumer and industrial electronics, with the broader DF40 family supporting interfaces such as USB, MIPI, SATA, and PCIe. Its low stacking height and fine contact pitch make it well suited to applications where board-to-board spacing must be minimized, such as camera modules, display modules, or stacked daughterboard architectures in handheld and wearable products. The connector is packaged on embossed carrier tape for automated pick-and-place assembly, and its construction is compliant with RoHS material restrictions. Mechanically, the connector body is built to support repeated mating cycles typical of consumer electronics assembly and rework, while maintaining stable electrical contact under vibration and thermal cycling across its rated environmental range. As a stacking-style connector rather than a card-edge or cable-mount type, it is intended to be soldered directly to a host PCB pad pattern, with the mating plug soldered to the corresponding board or FPC, allowing the two assemblies to be joined and separated as needed during manufacturing, test, or service operations. Spec Sheet Identification Part Number: DF40C-100DS-0.4V(51) Series: DF40 Variant: "C" type — without reinforcing metal fitting Connector Type / Configuration Type: Receptacle (socket), board-to-board / board-to-FPC Gender: Female Orientation: Straight Row Arrangement: Dual row Polarization: Non-polarized Locking/Retention Feature: None (no metal holddown or locating boss) Electrical Ratings Current Rating: Low-current signal class Voltage Rating: Standard signal-level rating typical of fine-pitch board-to-board connectors Applicable High-Speed Protocols: USB, MIPI, SATA, PCIe (series capability) Transmission Rate: High-speed, multi-gigabit class (series capability) Mechanical Specifications Contact Pitch: Fine pitch Mounting Pitch: Matches contact pitch Stacking/Mated Height: Low-profile Mounting Method: Surface mount technology (SMT) Mating Cycles: Rated for repeated mate/unmate cycles typical of consumer electronics rework Contact & Material Properties Contact Material: Phosphor bronze Contact Plating (Mating Area): Gold Insulator Color: Black Insulator Material: High-temperature engineering resin suitable for SMT reflow Environmental Ratings Operating Temperature Range: Extended consumer/industrial range RoHS Compliance: Yes Packaging Packaging Format: Embossed carrier tape, reel format Packaging Code Meaning: Suffix denotes embossed tape packaging at a standard reel quantity Mating Compatibility Mates With: Corresponding DF40 series plug/header connector Application Note: Intended for mezzanine-style stacking between two PCBs or between a PCB and FPC #DF40 #Hirose #HiroseElectric #BoardToBoard #BoardToFPC #StackingConnector #CommonPartsLibrary #Connector #SMTConnector #FinePitchConnector #MezzanineConnector #ElectronicComponents #PCBDesign #HardwareEngineering #ConnectorDatasheet #EngineeringSpec #ConsumerElectronics #HighSpeedConnector #RoHSCompliant #ComponentLibrary

1/1 Transceiver Half RS422, RS485 8-SOIC The MAX3483, MAX3485, MAX3486, MAX3488, MAX3490, and MAX3491 are 3.3V, low-power transceivers for RS-485 and RS-422 communication. Each part contains one driver and one receiver. The MAX3483 and MAX3488 feature slew-rate-limited drivers that minimize EMI and reduce reflections caused by improperly terminated cables, allowing error-free data transmission at data rates up to 250kbps. The partially slew-rate-limited MAX3486 transmits up to 2.5Mbps. The MAX3485, MAX3490, and MAX3491 transmit at up to 10Mbps. Drivers are short-circuit current-limited and are protected against excessive power dissipation by thermal shutdown circuitry that places the driver outputs into a high-impedance state. The receiver input has a fail-safe feature that guarantees a logic-high output if both inputs are open circuit. The MAX3488, MAX3490, and MAX3491 feature fullduplex communication, while the MAX3483, MAX3485, and MAX3486 are designed for half-duplex communication. Applications ● Low-Power RS-485/RS-422 Transceivers ● Telecommunications ● Transceivers for EMI-Sensitive Applications ● Industrial-Control Local Area Networks ● Operate from a Single 3.3V Supply— No Charge Pump! ● Interoperable with +5V Logic ● 8ns Max Skew (MAX3485/MAX3490/MAX3491) ● Slew-Rate Limited for Errorless Data Transmission (MAX3483/MAX3488) ● 2nA Low-Current Shutdown Mode (MAX3483/MAX3485/MAX3486/MAX3491) ● -7V to +12V Common-Mode Input Voltage Range ● Allows up to 32 Transceivers on the Bus ● Full-Duplex and Half-Duplex Versions Available ● Industry Standard 75176 Pinout (MAX3483/MAX3485/MAX3486) ● Current-Limiting and Thermal Shutdown for Driver Overload Protection

The 1N4148 SOD-323 is a high-speed switching diode designed for general-purpose signal switching, fast signal processing, and protection applications in compact electronic circuits. Utilizing fast recovery characteristics and low junction capacitance, this diode is widely used in digital circuits, communication equipment, consumer electronics, industrial control systems, and embedded devices. The device is optimized for high-speed switching performance, enabling rapid response to changing signal conditions while maintaining low power consumption. Its compact SOD-323 surface-mount package makes it ideal for space-constrained PCB layouts and high-density electronic assemblies. The 1N4148 SOD-323 is commonly employed for signal routing, logic circuit protection, voltage clamping, waveform shaping, and general-purpose switching functions where fast response and reliable operation are required. Features High-speed switching diode Fast reverse recovery characteristics Low forward voltage drop Low junction capacitance Low leakage current High reliability construction Compact SOD-323 surface-mount package Suitable for high-frequency applications Excellent switching performance RoHS-compliant construction available Compatible with automated assembly processes Wide operating temperature capability Electrical Characteristics Silicon switching diode technology Fast signal switching operation Low capacitance design Low reverse leakage performance High-speed recovery behavior Stable electrical characteristics Optimized for digital and analog signal applications Suitable for low-current switching circuits Applications Signal switching circuits Logic signal routing Communication equipment Embedded systems Consumer electronics Industrial control systems Protection circuits Waveform shaping networks Signal detection circuits High-frequency switching applications Test and measurement equipment General-purpose electronic designs Package Information Package Type: SOD-323 Surface-mount technology Compact PCB footprint Suitable for automated pick-and-place assembly High-density circuit integration capability Optimized for space-constrained applications #commonpartslibrary #semiconductor #diode #switchingdiode #signaldiode #highspeedswitching #circuitprotection #electronics #smd #sod323 #consumerelectronics #industrialelectronics #embeddedsystems #communicationelectronics #analogdesign #digitaldesign #pcbdesign #electroniccomponents

Tactile Switch SPST-NO Top Actuated Surface Mount ## Engineering Specification ## General Description The **MSLPT5252AG2TR** is a TE Connectivity ALCOSWITCH low-profile tactile switch designed for compact electronic devices, printed circuit board assemblies, portable electronics, control panels, and user-input interface applications. It provides momentary tactile feedback when pressed and returns to its normal open state when released. The device is suitable for applications requiring a small surface-mount switch with reliable actuation, compact board footprint, and low-profile mechanical construction. ## Device Identification Manufacturer Part Number: **MSLPT5252AG2TR** Manufacturer: **TE Connectivity** Brand Series: **ALCOSWITCH** Product Family: **LPT Low-Profile Tactile Switches** Device Category: **Electromechanical Component** Device Type: **Tactile Switch** Switch Function: **Single Pole Single Throw, Normally Open** ## Functional Description The device functions as a momentary user-input switch. When the actuator is pressed, the internal contacts close and allow an electrical signal path. When the actuator is released, the switch returns to its normally open condition. This makes the component suitable for button input, menu control, reset functions, mode selection, and general human-machine interface designs. ## Mechanical Description The switch uses a compact low-profile construction with a top-actuated flush actuator. It is intended for surface-mount installation on printed circuit boards and is suitable for space-constrained designs where low height and small board area are required. ## Electrical Description The MSLPT5252AG2TR is designed for low-current DC switching applications. It should be used within the manufacturer’s specified voltage and current ratings to ensure reliable operation and long service life. The switch is intended for signal-level control applications rather than high-power load switching. ## Contact and Material Description The switch includes stainless steel contact base material with silver contact plating. This construction supports reliable contact performance for tactile input applications and helps provide stable electrical switching behavior during normal operation. ## Mounting and Assembly Description The component is supplied as a surface-mount tactile switch suitable for automated PCB assembly. Proper land pattern design, soldering profile control, and mechanical clearance should be followed according to the manufacturer’s recommended layout and assembly guidelines. ## Application Suitability The device is suitable for portable electronic devices, consumer electronics, handheld equipment, control buttons, reset switches, interface panels, communication devices, instrumentation, remote controls, and compact PCB-based user-input systems. ## Design Considerations The switch should be placed in a location that allows direct actuator access without excessive mechanical side loading. PCB layout should provide proper solder pad support and mechanical stability. The design should avoid overtravel, excessive actuation force, contamination, and use beyond the rated electrical limits. ## Hashtags #commonpartslibrary #electromechanicalcomponent #tactileswitch #pushbuttonswitch #momentaryswitch #spstswitch #normallyopen #teconnectivity #alcoswitch #mslpt5252ag2tr #lptseries #smtcomponent #surfacemount #pcbdesign #electronicscomponents #electronicparts #switchcomponent #hardwaredesign #userinterface #embeddedhardware #consumer electronics #portableelectronics #componentlibrary #engineeringparts #electronicsengineering