32GB eMMC 5.1 FBGA-153 eMMC ROHS KLMBG2JETD-B041 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C2803245 JLCPCB Part Class: Extended Part Manufactured by SAMSUNG(三星半导体) embedded MultiMediaCard Ver. 5.1 compatible.  SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, HS200, HS400, Field Firmware Update. - Non-supported Features : Large Sector Size (4KB)  Full backward compatibility with previous Multi

16GB SLC eMMC 5.1 FBGA-153(11.5x13) Memory RoHS eMMC embedded flash memory providing non-volatile data storage with a 16GB SLC capacity and eMMC 5.1 interface. It supports up to 210MB/s sequential read and 170MB/s sequential write speeds, operates with VCCQ of 1.7–1.95V or 2.7–3.6V and VCCF of 2.7–3.6V, and is specified for an operating temperature range of −40°C to +85°C. #eMMC #EmbeddedFlash #FlashMemory #SLC #eMMC5_1 #16GB #NonVolatileMemory #IndustrialTemperature #FBGA153 #MK

eMMC FEMDNN008G-08A39 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C601079 JLCPCB Part Class: undefined Manufactured by FORESEE(江波龙)

MTFC4GMWDM-3MAITA FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C2911181 JLCPCB Part Class: undefined Manufactured by micron(镁光)

eMMC FEMDNN064G-58K72 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C719492 JLCPCB Part Class: undefined Manufactured by FORESEE(江波龙)

eMMC FEMDRW032G-88A19 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C719926 JLCPCB Part Class: Extended Part Manufactured by FORESEE(江波龙)

eMMC SDINBDG4-8G-XI1 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C577445 JLCPCB Part Class: Extended Part Manufactured by SANDISK(闪迪)

eMMC SDINBDG4-64G-XI1 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C3446132 JLCPCB Part Class: Extended Part Manufactured by SANDISK(闪迪)

8GB 330/50 MB/s eMMC 5.1 FBGA-153(11.5x13) eMMC ROHS KLM8G1GETF-B041 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C499918 JLCPCB Part Class: Extended Part Manufactured by SAMSUNG(三星半导体)

eMMC FEMDRW128G-88A19 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C719928 JLCPCB Part Class: Extended Part Manufactured by FORESEE(江波龙)

eMMC HG-EMC032-N1110 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C718471 JLCPCB Part Class: Extended Part Manufactured by undefined

eMMC SDINBDG4-16G FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C2830396 JLCPCB Part Class: Extended Part Manufactured by SANDISK(闪迪)

eMMC FEMDRW016G-88A43 FBGA-153_L13.0-W11.5-P0.50_MKEMA032GD1E-C LCSC Part Number: C2841376 JLCPCB Part Class: Extended Part Manufactured by FORESEE(江波龙)