WiFi 802.11a/b/g/n, Bluetooth v5.0 Transceiver Module 2.4GHz PCB Trace The ESP32-S3-WROOM-1-N8R2 is a compact, low-power Wi-Fi and Bluetooth® Low Energy (BLE) module developed by Espressif Systems. It is based on the ESP32-S3 system-on-chip (SoC), which integrates a dual-core Xtensa® LX7 processor optimized for high performance and edge AI processing. This module includes 8 MB of external SPI flash memory and 2 MB of PSRAM, enabling efficient handling of memory-intensive applications such as graphical interfaces, buffering, and embedded machine learning workloads. Designed for flexibility and scalability, the module integrates RF components, power management, and a wide range of peripherals into a surface-mount package suitable for IoT, industrial, and consumer electronics applications. Key Features Dual-core Xtensa® LX7 processor operating up to 240 MHz Integrated 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth 5 Low Energy support Embedded 8 MB SPI flash memory Integrated 2 MB PSRAM AI acceleration through vector instruction support USB OTG (full-speed) capability Multiple low-power operating modes Built-in hardware security features Extensive peripheral interface support Functional Overview The module consists of several integrated subsystems, including a dual-core processing unit, memory subsystem (flash and PSRAM), RF subsystem for wireless communication, peripheral interface controllers, power management circuitry, and a hardware-based security engine. Electrical Characteristics Operating voltage range: 3.0 V to 3.6 V (typical 3.3 V) Operating temperature range: -40°C to +85°C RF operating frequency: 2.4 GHz Current consumption varies depending on operating mode, ranging from microamp levels in deep sleep to hundreds of milliamps during active transmission Processor and Memory The module features a dual-core Xtensa® LX7 CPU capable of running at frequencies up to 240 MHz. It includes approximately 512 KB of internal SRAM, supplemented by 8 MB of external flash memory and 2 MB of PSRAM for extended data storage and processing. Wireless Connectivity The ESP32-S3-WROOM-1-N8R2 supports Wi-Fi communication compliant with 802.11 b/g/n standards in the 2.4 GHz band. It also supports Bluetooth 5 Low Energy for short-range wireless communication. The module includes an integrated PCB antenna and supports RF output power up to approximately +20 dBm. Peripheral Interfaces The module provides a wide range of interfaces, including general-purpose input/output (GPIO) pins, SPI, I2C, UART, and I2S for audio applications. It also supports PWM for LED control, a 12-bit analog-to-digital converter (ADC), and USB OTG functionality. Pin functions are multiplexed to maximize flexibility. Power Management Power efficiency is achieved through multiple operating modes, including active mode, modem sleep, light sleep, and deep sleep. The module includes an RTC subsystem for low-power timekeeping and supports dynamic frequency scaling to optimize performance and energy consumption. Security Features The module incorporates several hardware-based security mechanisms, including secure boot, flash encryption, and digital signature verification. It also includes a hardware random number generator and cryptographic accelerators supporting AES, SHA, RSA, and ECC algorithms. Mechanical Characteristics The module is designed for surface-mount integration and measures approximately 18 mm by 25.5 mm. It includes an onboard PCB antenna and is suitable for compact embedded designs. Pin Configuration Overview GPIO pins are multiplexed to support various peripheral functions such as analog inputs, communication interfaces, and control signals. Dedicated pins are provided for power supply, module enable, and boot configuration. Typical Applications Internet of Things (IoT) devices Smart home systems Industrial automation and monitoring Edge AI and machine learning applications Wearable electronics Audio and multimedia systems USB-enabled embedded devices Compliance The module is designed to meet Wi-Fi and Bluetooth standards and is compliant with RoHS requirements. Certification such as FCC or CE may apply depending on the specific module variant and deployment. Ordering Information The ESP32-S3-WROOM-1-N8R2 variant includes 8 MB of flash memory and 2 MB of PSRAM. #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

2.4GHz -98dBm SMD,19.2x18mm RF Transceiver Modules and Modems RoHS The ESP32-WROOM-32UE-N16 is a 2.4 GHz wireless MCU module built around the ESP32 SoC. It combines a dual-core processor, integrated Wi-Fi (802.11 b/g/n) and Bluetooth 4.2 (Classic + BLE), along with rich peripherals. The “UE” variant specifically uses a U.FL / IPEX connector for an external antenna, making it ideal for applications that require better RF performance or flexible antenna placement (e.g., enclosed products or long-range communication). The “N16” indicates 16 MB external flash memory, suitable for large firmware, OTA updates, and data-heavy applications. Processing Dual-core Xtensa LX6 32-bit CPU Clock speed up to 240 MHz Memory 16 MB Flash (N16 variant) ~520 KB SRAM + 448 KB ROM Connectivity Wi-Fi: 802.11 b/g/n (up to 150 Mbps) Bluetooth: v4.2 (BR/EDR + BLE) Frequency: 2.4 GHz band Antenna External antenna via U.FL connector Better range and flexibility vs PCB antenna Interfaces / Peripherals GPIO (≈26 usable pins) UART, SPI, I2C, I2S, SDIO ADC, DAC PWM (LED & motor control) Capacitive touch sensing Security Hardware encryption: AES, SHA, RSA Secure boot & flash encryption support Power Operating voltage: 3.0V – 3.6V (typ. 3.3V) Multiple low-power modes for battery applications Environmental Operating temperature: -40°C to +85°C Physical Surface-mount module (~38 pins / 52 pads depending on reference) Compact and RF-shielded design Typical Applications Smart home devices (IoT) Industrial automation Wireless sensors and data loggers Wearables and consumer electronics Remote monitoring systems #Module #ESP32

NXP i.MX 8M Mini applications processor / SoC, MIMX8MM6CVTKZAA, FCBGA486 14 x 14 mm 0.5 mm pitch

The BK2461 is an RF SOC chip, which embeds the newest FLIP51 processor. These appear to be an nRF24L01 chip with a FLIP8051 MCU...

Bluetooth, WiFi 802.11b/g/n, Bluetooth v5.0 Transceiver Module 2.412GHz ~ 2.484GHz PCB Trace Surface Mount SP32-C3-MINI-1-N4 is a compact Wi-Fi + Bluetooth Low Energy (BLE) module based on Espressif’s ESP32-C3 chip, designed for low-power IoT and embedded applications. The module integrates a RISC-V 32-bit single-core processor with wireless connectivity, making it suitable for cost-sensitive and power-efficient smart devices. Key features Processor: 32-bit RISC-V single-core CPU (up to 160 MHz) Wireless: Wi-Fi 2.4 GHz (802.11 b/g/n) Bluetooth 5 (LE support) Flash: “N4” variant typically includes 4 MB SPI flash Memory: Internal SRAM for lightweight embedded applications Security features: Secure boot Flash encryption Hardware cryptographic acceleration Low power modes: Deep sleep support for battery-powered devices GPIO: Multiple general-purpose I/O pins (shared with peripherals like UART, SPI, I2C, ADC, PWM) Package: Compact “MINI” form factor for space-constrained PCB designs #CommonPartsLibrary #Module #RF

Processor CSPBGA-425(19x19) Video Processing RoHS

Processor Supervisor 2.66V 3/3.3/5V 3-Pin SOT-23 T/R - Tape and Reel #Commonpartslibrary #Integratedcircuit #Powermanagement #supervisor

CMOS with Processor Image Sensor 1296H x 976V 1.9µm x 1.9µm 55-ODCSP (4.65x3.85) #CommonPartsLibrary #Sensor #Transducer #Optical-Sensor #Image-Sensor #Camera #MT9M114

Inertial Measurement Unit (IMU) made by TDK. It contains a 3-axis gyroscope and a 3-axis accelerometer, making it a 6-axis motion tracking device. One of its standout features is the presence of a Digital Motion Processor (DMP) that can offload complex computation of motion processing algorithms from the host processor. This IC typically communicates with a microcontroller using the I2C interface. The MPU-6050 is highly versatile and finds its application in different devices particularly in those related to motion tracking like drones, wearable devices, and motion-based gaming controllers.

RP2040 chip for Raspberry Pi Pico - ARM® Cortex®-M0+ MCU 32-Bit The RP2040 is a high-performance, low-cost microcontroller built around two ARM Cortex-M0+ cores. It is optimized for flexibility, ease of use, and deterministic real-time performance. Unlike many microcontrollers, it includes a unique programmable I/O subsystem (PIO), allowing custom hardware interfaces without extra components. Key Features Processing Dual-core ARM Cortex-M0+ processors Up to 133 MHz clock speed Efficient integer performance with low power consumption Memory 264 KB on-chip SRAM External QSPI flash support (typically 2 MB–16 MB depending on board) Programmable I/O (PIO) 2 PIO blocks, each with 4 state machines Enables custom protocols (e.g., SPI, I2C, UART, WS2812, VGA, etc.) Offloads timing-critical tasks from CPU 🔗 Connectivity Interfaces 2× UART 2× SPI 2× I2C USB 1.1 controller (device or host support) 16× PWM channels Analog Features 12-bit ADC (up to 5 channels, including internal temperature sensor) Power & Voltage Operating voltage: 1.8V – 3.3V Low-power modes available Package Options QFN-56 (7×7 mm) Development Ecosystem Supports C/C++ SDK MicroPython and CircuitPython support Strong community and documentation Typical Applications Embedded systems and IoT devices Robotics and automation DIY electronics and prototyping USB devices (HID, MIDI, etc.) Custom communication interfaces using PIO #CommonPartsLibrary #IntegratedCircuit #Microcontroller

ARM® Cortex®-M33F, ARM® Cortex®-M7F RT1180 Microcontroller IC 32-Bit Dual-Core 240MHz, 800MHz 160KB (160K x 8) ROM 289-LFBGA (14x14) The MIMXRT1189XVM8C is a high-performance crossover microcontroller from the NXP Semiconductors i.MX RT1180 family, designed for advanced industrial and real-time embedded applications. It combines the real-time performance of a microcontroller with the connectivity and security features typically found in application processors. The device integrates dual Arm® Cortex® cores, high-speed networking with Time-Sensitive Networking (TSN), and advanced EdgeLock® security technology, making it ideal for industrial automation, robotics, motor control, automotive gateways, and Industry 4.0 systems. Key Features Dual-core architecture: Arm® Cortex®-M7 core running up to 800 MHz Arm® Cortex®-M33 core running up to 300 MHz Integrated Gigabit TSN Ethernet switch for deterministic real-time networking Supports industrial Ethernet protocols including: EtherCAT PROFINET Ethernet/IP CC-Link IE Advanced EdgeLock® Secure Enclave for secure boot, cryptography, and tamper detection Up to 1.5 MB on-chip SRAM with ECC protection High-speed external memory interfaces Multiple communication peripherals: CAN-FD UART SPI I2C USB Ethernet High-resolution ADCs and advanced PWM/timer modules Supports MCUXpresso SDK and Zephyr RTOS Industrial temperature range operation from -40°C to +125°C BGA package optimized for compact industrial designs #Commonpartlibrary #Microcontroller #MIMXRT1189

16 MHz ±15ppm Crystal 8pF 60 Ohms 4-SMD, No Lead The CX3225SB16000D0GZJC1, manufactured by Kyocera AVX, is a 16.000 MHz crystal oscillator element designed to provide precise frequency reference for microcontrollers, communication ICs, and digital systems. It belongs to the CX3225SB series, known for compact size and stable frequency performance. Key Characteristics Type: Quartz crystal (passive frequency component) Frequency: 16 MHz Load Capacitance: 8 pF Frequency Stability: ±15 ppm Frequency Tolerance: ±15 ppm Operating Mode: Fundamental ESR (Equivalent Series Resistance): ~60–80 Ω Mechanical Details Package: 4-SMD, no-lead (surface mount) Size: 3.2 mm × 2.5 mm (3225 package) Height: ~0.6 mm (low profile) Operating Conditions Temperature Range: −25°C to +85°C Mounting Type: Surface mount (SMT) Function (Simple Explanation) This component: Generates a stable clock signal (16 MHz) Acts as the timing reference for MCUs, processors, or RF modules Works together with internal oscillator circuits inside ICs Microcontroller clock sources (e.g., ESP32, STM32, AVR) Communication modules Embedded systems Consumer electronics IoT devices #CommonPartsLibrary #Crystal #Oscillator #resonator

Other Processors and Microcontrollers (MCUs) FT60F211-RB SOP-8_L4.9-W3.9-P1.27-LS6.0-BL LCSC Part Number: C708779 JLCPCB Part Class: undefined Manufactured by FMD(辉芒微)

Embedded Processors & Controllers SLS32AIA010MKUSON10XTMA2 USON-10_L3.0-W3.0-P0.50-BL-EP LCSC Part Number: C1518668 JLCPCB Part Class: undefined Manufactured by Infineon(英飞凌)

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320C5535AZAYA05 BGA-144_L12.1-W12.1-P0.80-BR_TMS320C5535AZHHA10 LCSC Part Number: C2873410 JLCPCB Part Class: undefined Manufactured by TI(德州仪器)

Digital Signal Processors / Controllers (DSPs/DSCs) TMS320DM642AGNZ6 FCBGA-548_L27.0-W27.0-P1.00-BL_TI_TMS320DM643AZNZ6 LCSC Part Number: C2879664 undefined Manufactured by TI(德州仪器)

Other Processors and Microcontrollers (MCUs) PTBO134XXS-SOP16 SOP-16_L10.0-W3.9-P1.27-LS6.0-BL LCSC Part Number: C329423 JLCPCB Part Class: undefined Manufactured by PUOLOP(迪浦)

6-Pin \"No Legs\" Cable with 10-pin micro-connector for Cortex processors #CommonPartsLibrary #Connector #Plug-Of-Nails™

The RP2350, developed by Raspberry Pi Ltd, is a high-performance microcontroller designed to cater to a broad range of applications requiring efficient power management, advanced security features, and versatile IO options. This microcontroller stands out with its dual-core architecture, featuring either Cortex-M33 or Hazard3 processors operating at up to 150 MHz, ensuring robust performance for complex applications. It boasts a substantial 520 KB of on-chip SRAM distributed across 10 independent banks, enhancing parallel data processing capabilities. Additionally, the RP2350 supports up to 16 MB of external QSPI flash/PSRAM for extensive program and data storage, further expandable via an optional second chip-select. A notable feature of the RP2350 is its integrated on-chip switched-mode power supply, designed to generate core voltage efficiently, complemented by a low-quiescent-current LDO mode for reduced power consumption in sleep states. Security is a paramount feature of the RP2350, offering options for boot signing with key fingerprint in OTP, hardware mitigations against fault injection attacks, and a hardware SHA-256 accelerator for cryptographic operations. The microcontroller is also equipped with a comprehensive set of peripherals, including USB 1.1 controller and PHY, multiple UARTs, SPI, and I2C controllers, 24 PWM channels, and 12 programmable IO (PIO) state machines, providing extensive interface capabilities. The RP2350 is available in QFN-60 and QFN-80 packages, with or without flash-in-package options, catering to various design requirements and application needs.

The RP2350, developed by Raspberry Pi Ltd, represents a significant advancement in the field of microcontrollers, building upon the foundation laid by its predecessor, the RP2040. This component is designed to cater to a wide range of applications requiring dual-core processing capabilities, with the option to switch between Dual Cortex-M33 or Hazard3 processors operating at up to 150 MHz. It features an extensive 520 kB of on-chip SRAM distributed across 10 independent banks, alongside 8 KB of one-time-programmable (OTP) storage. External memory interfaces are well-supported, with provisions for up to 16 MB of external QSPI flash/PSRAM, and an additional 16 MB accessible via an optional second chip-select, facilitating extensive code and data storage options. Security features are robust, including options for boot signing enforced by on-chip mask ROM, with key fingerprints stored in OTP, and hardware mitigations against fault injection attacks. The RP2350 also boasts a comprehensive set of peripherals, including 2x UARTs, 2x SPI controllers, 2x I2C controllers, 24x PWM channels, and a USB 1.1 controller with PHY for host and device support, among others. Programmable IO (PIO) state machines enhance its flexibility, enabling the implementation of custom peripherals. For developers, the RP2350 offers low-power operation modes and a built-in boot ROM that supports direct boot from external flash or OTP, serial boot from USB or UART, and secure boot with code signature enforcement. The device is available in QFN-60 (7x7 mm) and QFN-80 (10x10 mm) packages, with or without built-in flash, catering to diverse application requirements. This microcontroller is a compelling choice for sophisticated projects that demand high performance, extensive memory and peripheral support, and advanced security features.