Compute Module 5 is a powerful and scalable system on module with a 64-bit Arm processor @ 2.4GHz, an I/O controller, video and PCIe interfaces, and a range of wireless, SDRAM and eMMC options. raspberry pi5 #rpi #pi

USB Type-C port controller, Cortex®-M0 processor, DFP CC with opto coupler feedback bootloader, SOIC-16 USBPD quickcharge SOIC*3.9x9.9mm*P1.27mm*

SigmaDSP Digital Audio Processor #DSP #audio

The ESP32-S3-DEVKITC-1U-N8R8 from Espressif Systems is an evaluation board designed for wireless communication applications. It features a 32-bit Xtensa dual-core processor running at 240MHz, providing strong processing power for complex tasks. The board supports 802.11 b/g/n Wi-Fi and Bluetooth® 5.x (BLE), operating at 2.4GHz, ensuring seamless wireless communication. 8 MB Quad flash and 8MB Octal PSRAM,

32 TOPS vision SoC for 1-12 cameras, autonomous mobile robots, machine vision, mobile DVR, AI-BOX #Integrated-circuit #processor #Microcontroller #AM69A

CMOS with Processor Image Sensor 1920H x 1080V 1.4µm x 1.4µm 34-CSP5 (3.85x2.92)

System On Chip (SOC) IC It integrates multiple processing units including CPUs, DSPs, AI accelerators, and GPU into a single chip to handle vision processing, deep learning, sensor fusion, and real-time control in automotive and industrial systems. • C7x floating point, vector DSP, up to 1.0GHz, 80 GFLOPS, 256 GOPS • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0GHz • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators • Depth and Motion Processing Accelerators (DMPAC) • Dual 64-bit Arm® Cortex®-A72 microprocessor subsystem at up to 2.0GHz – 1MB shared L2 cache per dual-core Cortex®- A72 cluster – 32KB L1 DCache and 48KB L1 ICache per Cortex®-A72 core • Six Arm® Cortex®-R5F MCUs at up to 1.0GHz – 16K I-Cache, 16K D-Cache, 64K L2 TCM – Two Arm® Cortex®-R5F MCUs in isolated MCU subsystem – Four Arm® Cortex®-R5F MCUs in general compute partition • Two C66x floating point DSP, up to 1.35GHz, 40GFLOPS, 160GOPS • 3D GPU PowerVR® Rogue 8XE GE8430, up to 750MHz, 96GFLOPS, 6Gpix/sec • Custom-designed interconnect fabric supporting near max processing entitlement Memory subsystem: • Up to 8MB of on-chip L3 RAM with ECC and coherency – ECC error protection – Shared coherent cache – Supports internal DMA engine • External Memory Interface (EMIF) module with ECC – Supports LPDDR4 memory types – Supports speeds up to 4266MT/s – 32-bit data bus with inline ECC • General-Purpose Memory Controller (GPMC) • 512KB on-chip SRAM in MAIN domain, protected by ECC #CommonPartsLibrary #IntegratedCircuit

The Syntiant NDP120 Neural Decision Processor is a special purpose chip for audio and sensor processing for always-on applications in battery powered devices and other power constrained systems. The NDP120 applies neural processing to run multiple applications simultaneously with minimal power consumption. Built using the Syntiant Core 2 programmable deep learning architecture, NDP120 is designed to natively run multiple Deep Neural Networks (DNN) on a variety of architectures, such as CNN, RNN and fully connected networks. NDP120 brings a level of ML performance that delivers 25x the tensor throughput compared to the Syntiant Core 1 embedded in Syntiant’s NDP100 and NDP101 devices. A programmable HiFi 3 DSP is available for classical audio processing. Always-On Speech & Sensor-Fusion Processor

High Performance and Low-power Processor for Digital Media Application #CommonPartsLibrary #IntegratedCircuits #Processor

The IA611 SmartMic is an "always-on" Audio Processor featuring Voice Wake and Voice ID keyword detector, a two-second buffer', and Knowles' proven high performance acoustic SiSonic™ MEMS microphone technology in a single, miniature, top-port package. The IA611 offers flexibility by supporting the most relevant audio and data interfaces. Its integrated programmable DSP with 248 kBytes of RAM is available for customer and 3rd party algorithms, enabling unlimited creativity. The solution pushes the system performance to ultra-low power with its custom core design, and accelerates time to market with its highly integrated combination of hardware, software, and firmware.

I2C 1-4 cell NVDC Buck-Boost battery charge controller with system power monitor & processor #CommonPartLibrary #IntegratedCircuits #PowerManagement #BatteryManagement #BQ25703

RF System on a Chip - SoC Cortex-M55 250MHz, 2.5D GPU, 4MB MRAM, 3.75MB SRAM, BLE5.4, -20 to +70 C, BGA , 1.71 V to 2.2 V -20C ~ 70C ARM® Cortex®-M55 System On Chip (SOC) IC Apollo510B 250MHz The AP510BFA-CBR is an ultra-low-power MCU System-on-Chip (SoC) designed for advanced embedded and edge-AI applications. It belongs to the Apollo510B series and integrates a powerful ARM Cortex-M55 processor optimized for both performance and energy efficiency. It combines processing, memory, and multiple peripherals into a single BGA package, making it suitable for compact and power-sensitive designs. Key Characteristics Core: ARM Cortex-M55 Max CPU Speed: 250 MHz Architecture: MCU / SoC Flash Memory: 4 MB RAM: ~3.75 MB Connectivity: I2C, SPI, UART, USB Wireless Support: Bluetooth 5.4 (variant dependent) Package: 153-BGA (compact high-density package) Key Features Built on Ambiq’s ultra-low-power SPOT technology Designed for battery-powered and energy-sensitive devices High computational performance for edge AI and DSP workloads Integrated peripherals for embedded system development Typical Applications Wearables (smartwatches, fitness bands) Smart home and IoT devices Edge AI / machine learning nodes Industrial sensors and monitoring systems Wireless communication modules #CommonPartsLibrary #IntegratedCircuit #SoC #Apollo510B

Bluetooth Low Energy 5.0 transceiver module, nRF52832-based, 1.7-3.6 V supply, 6.5 x 6.5 mm SMD-52 package

Non-Isolated PoL Module DC DC Converter 1 Output 0.8 ~ 6V 10A 6V - 20V Input The LMZ22010TZ/NOPB is a compact, high-efficiency step-down (buck) DC-DC power module from Texas Instruments. It integrates a switching regulator, power MOSFETs, inductor, and compensation components into a single package, simplifying power supply design. This module is capable of delivering up to 10A output current with excellent thermal performance and minimal external components. It is intended for high power density applications such as industrial systems, telecommunications equipment, and embedded processing platforms. Manufacturer Information Manufacturer: Texas Instruments Part Number: LMZ22010TZ/NOPB Product Type: DC-DC Buck Power Module Key Features Integrated power module with inductor and controller Output current up to 10A Wide input voltage range High efficiency operation Adjustable output voltage Built-in protection features (thermal shutdown, overcurrent protection) Power-good output and enable control Requires minimal external components Electrical Characteristics Parameter Value Input Voltage Range 6 V to 20 V Output Voltage Range 0.8 V to 6 V (adjustable) Output Current Up to 10 A Switching Frequency ~500 kHz Efficiency Up to ~95% Operating Temperature Range -40°C to +125°C Package Information Package Type: TO-PMOD (Power Module) Mounting Type: Surface Mount Integrated inductor and power components Optimized for thermal performance Pin Configuration (Typical) Pin Name Description VIN Input supply voltage VOUT Regulated output voltage GND Ground EN Enable input FB Feedback for output adjustment PGOOD Power-good indicator Typical Applications Industrial automation systems Telecom and networking equipment FPGA / DSP / processor power rails Embedded systems Point-of-load regulation Design Considerations Ensure proper PCB layout for heat dissipation Use appropriate input/output capacitors External resistors required to set output voltage Consider airflow for high-current operation #commonpartslibrary #powersupply #dcdc #converter

The ESP32-WROOM-32E (16MB) is a highly integrated Wi-Fi + Bluetooth + Bluetooth Low Energy (BLE) module developed by Espressif. It is based on the ESP32-D0WD-V3 chip and features a dual-core processor, rich peripherals, and large flash memory—making it ideal for IoT, embedded systems, and wireless applications. This module is part of the upgraded WROOM-32E series, offering improved RF performance, better stability, and enhanced reliability compared to earlier versions like the 32D. Key Features (16MB Variant) Processor & Memory Dual-core Xtensa® 32-bit LX6 CPU, up to 240 MHz 520 KB SRAM + 448 KB ROM 16 MB SPI Flash (large storage for firmware/data) Optional variants with PSRAM for memory-intensive tasks Connectivity 2.4 GHz Wi-Fi (802.11 b/g/n) Bluetooth v4.2 (BR/EDR + BLE) Integrated PCB antenna (no external antenna needed) Peripherals & Interfaces Up to 26–38 GPIOs (depending on usage) Supports: UART, SPI, I2C, I2S PWM (LED & motor control) ADC, DAC Capacitive touch sensors SD/SDIO/MMC, CAN (TWAI) Electrical & Physical Operating voltage: 3.0V – 3.6V Operating temperature: –40°C to +85°C (industrial range) Compact size: 18 × 25.5 × 3.1 mm Typical Applications Smart home devices (lighting, appliances) IoT sensors and gateways Industrial automation systems Wearables and smart gadgets Audio/voice processing (thanks to dual-core + large flash) #module #ESP32 #16MB

SMBus 1-4 cell NVDC Buck-Boost battery charge controller with system power monitor & processor #CommonPartLibrary #IntegratedCircuits #PowerManagement #BatteryManagement #BQ25700

SMBus 1-4 cell Buck-Boost battery charge controller w/ system power monitor & processor hot monitor #CommonPartLibrary #IntegratedCircuits #PowerManagement #BatteryManagement #BQ25710

USB 2.0 High-Speed True HD Audio Processor #CommonPartsLibrary #IntegratedCircuit

Audio Digital Signal Processor (DSP) 150MHz 61-WLCSP (2.7x4.12) #CommonPartsLibrary #IntegratedCircuit #DSP #CS47L63

4 Channel - Digitally Controlled Audio Processor IC - 28 Pin SOIC #CommonPartsLibrary #IntegratedCircuit #Processor #Controller