Precision virtual ground, noise reduction pin, 4V to 40V input, SOIC-8 Rail splitter precision virtual ground SOIC*3.9x4.9mm*P1.27mm*

Precision virtual ground, 2.5V output, SOIC-8 Rail splitter precision virtual ground 2.5V SOIC*3.9x4.9mm*P1.27mm*

Precision virtual ground, noise reduction pin, 4V to 40V input, DIP-8 Rail splitter precision vitrual ground DIP*W7.62mm*

Precision virtual ground, 4V to 40V input, TO-92

3.5 mm, Stereo, Right Angle, Through Hole, Isolated Ground, Audio Jack Connector.

Microphone Module #Module Introducing the Microphone Circuit project, featuring the SPH0645LM4H-B MEMS microphone with a 20 Hz to 10 kHz frequency range and high precision sensitivity at -26dB ±3dB @ 94dB SPL for superior audio capture. The circuit is engineered with designated power and ground nets and optimized passive components to deliver reliable audio processing in rapid prototyping and advanced electronic applications. #MicrophoneCircuit #MEMSMicrophone #AudioEngineering #ElectronicsDesign #SPH0645LM4HB #PCBDesign

LGA-16 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 3 mm x 3 mm (L x W) with 16 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Land Grid Array 16 or LGA-16. #part #template

LGA-12 is a small surface-mount package commonly used for electronic components. It has a body size of approximately 2 mm x 2 mm (L x W) with 12 pins. The lead pitch between the pins is typically 0.5 mm. The package is also known as Land Grid Array 12 or LGA-12. #part #template

LGA-8 is a small surface-mount package commonly used for integrated circuits. It has a body size of approximately 3 mm x 5 mm (L x W) with 8 pins. The lead pitch between the pins is typically 1.25 mm. The package is also known as Land Grid Array 8 or LGA-8. #part #template

Earth Leakage Detector PMIC 8-SOIC #commonpartslibrary #integratedcircuit #powermanagement

Earth Leakage Detector PMIC 8-SOIC #commonpartslibrary #integratedcircuit #powermanagement

Ground Fault Protection PMIC 16-QFN (3x3) #CommonPartsLibrary #IntegratedCircuit #PowerManagement

600 V high-side and low-side gate driver IC with separate pin for logic ground 14-DIP #CommonPartsLibrary #IntegratedCircuit #PowerManagement #GateDriver #IR21814

600 V high-side and low-side gate driver IC with separate pin for logic ground 14-DIP #CommonPartsLibrary #IntegratedCircuit #PowerManagement #GateDriver #IR21864

Ground Reference (Virtual) Voltage Reference IC Adjustable 2V 20 VV ±1% 20 mA 8-PDIP #ReferenceVoltaget #commonpartslibrary

39 mH @ 10 kHz 2 Line Common Mode Choke Through Hole 300mA DCR The 744821039 is a common mode choke (CMC) designed for power line filtering. It is used to suppress electromagnetic interference (EMI), particularly common-mode noise in AC/DC power circuits and switching power supplies. Type: Common mode choke (power line filter) Inductance: 39 mH @ 10 kHz Rated current: 300 mA Number of lines: 2-line configuration Mounting: Through-hole (radial/vertical, 4 pins) AC voltage rating: up to 250 V DC resistance: ~3 Ω max Operating temperature: −40°C to +125°C Blocks high-frequency noise on power lines Allows normal differential current (useful signal) to pass Improves EMC compliance of electronic systems Reduces radio interference (RFI) in circuits AC/DC power supply input filters Switch-mode power supplies (SMPS) Industrial electronics and motor drives Household appliances and embedded systems Devices without proper grounding (noise suppression) #CommonPartsLibrary #Inductor #WE-CMB

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

2 Channel AFE 16 Bit 24-UQFN (4x4) The AFE881H1RRUR is a highly integrated analog front-end (AFE) designed for multi-channel data acquisition systems. It combines precision analog signal conditioning with high-speed analog-to-digital conversion, making it suitable for applications such as medical instrumentation, industrial measurement, and test and measurement equipment. The device integrates low-noise amplifiers, programmable gain stages, anti-aliasing filters, and high-resolution ADCs into a compact package, reducing system complexity and board space. Key Features Multi-channel analog front-end integration High-resolution analog-to-digital conversion Low-noise input stage for precision measurements Programmable gain amplifier (PGA) Integrated anti-aliasing filters High sampling rate capability Serial digital interface (SPI-compatible) Low power consumption for portable systems Compact surface-mount package Electrical Characteristics (Typical – refer to datasheet for exact values) Supply Voltage: ~1.8 V to 3.3 V (analog/digital domains) Input Voltage Range: Dependent on configuration Resolution: Up to 16-bit or higher (device dependent) Sampling Rate: Up to several MSPS (depending on mode) Power Consumption: Optimized for performance/power balance Functional Blocks Low-noise input buffer Programmable gain amplifier (PGA) Anti-aliasing filter High-speed ADC core Digital control interface (SPI) Clock management circuitry Package Information Package Type: QFN / VQFN (exact variant per TI RRU package code) Mounting Type: Surface Mount Pin Count: Typically 40+ pins (refer to datasheet for exact count) Applications Medical imaging and instrumentation Industrial data acquisition systems Oscilloscopes and test equipment Communication systems Precision sensor interfaces Advantages High integration reduces external components Improved signal integrity due to low-noise design Flexible configuration via programmable gain Compact footprint for dense PCB layouts Notes Exact electrical parameters, pin configuration, and performance metrics must be verified in the official Texas Instruments datasheet. Proper PCB layout (grounding, shielding, and decoupling) is critical for optimal performance. #commonpartslibrary #integratedcircuit

3 pole female XLR receptacle, grounding: without ground/shell contact, horizontal PCB mount nc3fah

12 MHz Crystal Oscillator Circuit Module #Module This module is designed to generate a highly stable and precise 12 MHz clock signal using a crystal oscillator. It incorporates a carefully selected load capacitor network and proper grounding techniques to ensure minimal frequency drift and robust performance across digital applications. This circuit is optimized for use in timing-critical systems where consistent frequency output is essential. #CrystalOscillator #CircuitModule #ClockSignal #EmbeddedSystems #DigitalCircuits #PCBDesign