Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

XIAO MG24 Sense is an ultra-low-power wireless development board based on Silicon Labs' EFR32MG24 SoC, featuring a high-performance 78MHz ARM Cortex®-M33 core. It‘s Matter® native over Thread® and Bluetooth® Low Energy 5.3, all supported by the Arduino® Core. With 4MB Flash onboard, 19 GPIOs, LED, and charging circuit onboard, it boasts extremely low operating current and ultra-low-power modes, making it an ideal choice for IoT applications, especially battery-powered projects utilizing Matter® protocols. Additionally, the onboard analog microphone and six-axis IMU sensors make XIAO MG24 Sense a great fit for TinyML applications such as posture detection

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

The TUSB8041, developed by Texas Instruments, is a four-port USB 3.0 hub intended for use in computer systems, docking stations, monitors, and set-top boxes, providing simultaneous SuperSpeed USB and high-speed/full-speed connections on the upstream port as well as on the downstream ports. This component supports battery charging features, enabling Charging Downstream Port (CDP) and Dedicated Charging Port (DCP) modes, compliant with the Chinese Telecommunications Industry Standard YD/T 1591-2009, and introduces an automatic mode for transparent support for BC devices and devices supporting Divider Mode charging solutions. It offers customization through OTP ROM, I2C EEPROM or via an I2C/SMBus slave interface for Vendor ID (VID), Product ID (PID), port customizations, and manufacturer and product strings. The TUSB8041 comes in a 64-pin RGC package and is available in both commercial (0°C to 70°C) and industrial (-40°C to 85°C) temperature ranges, part numbers TUSB8041 and TUSB8041I respectively, with an operating voltage requirement of 3.3V for I/O and 1.1V for the core. This hub doesn't require special drivers as it's designed to work seamlessly with any operating system supporting the USB stack, making it a highly adaptable solution for expanding USB connectivity in a wide range of applications.

ARM® Cortex®-A9 Microprocessor IC i.MX6D 2 Core, 32-Bit 1.0GHz 624-FCPBGA (21x21) #CommonPartsLibrary #IntegratedCircuit #Microprocessor #MCIMX6

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

This is a stereo WiFi camera reference design using dual ESP32-CAM modules for edge computing. The design includes connections for power, ground, and core communication features; UART for control & data transfer, and BOOT pins for mode selection. #WiFi #MCU #stereo #ReferenceDesign #project #ESP32 #camera #referenceDesign #edgeComputing #espressif #template #reference-design

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

ARM® Cortex®-M0+ STM32G0 Microcontroller IC 32-Bit Singl e-Core 64MHz 32KB (32K x 8) FLASH 8-SOIC #commonpartslibrary #integratedcircuit #microcontroller

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

Dual core, Wi-Fi: 2.4 GHz up to 150 Mbits/s,BLE (Bluetooth Low Energy) and legacy Bluetooth, 32 bits, Up to 240 MHz #esp32 #ble #wifi #arm

330µH Shielded Drum Core, Wirewound Inductor 1.15A 580mOhm Max Nonstandard #commonpartslibrary #inductor #coil

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

Use this template if you're planning to get your board manufactured in OSHPARK. It has the via min/max and trace width constraints already baked as global rules. #project-template #template #manufacturer-design-rules OSHpark 4-layer stackup specs: Top overlay or silkscreen: 1 mil thick Top solder mask or solder resist: 1 mil thick Top copper: 1.7 mil thick on 1 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Mid layer 1: 0.68 mil thick on 0.5 oz copper Dielectric core: 39 mil thick FR408HR Mid layer 2: 0.68 mil thick on 0.5 oz copper Dielectric: 7.96 mil thick FR408HG 2113 Bottom copper: 1.7 mil thick on 1 oz copper Bottom solder mask or solder resist: 1 mil thick
Bottom overlay or silkscreen: 1 mil thick

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