WiFi IEEE802.11b/g/n with Ethernet Module, UART, GPIO #RF #WiFi #commonpartslibrary

USB to Serial Interface, SSOP-28 FTDI USB Serial SSOP*5.3x10.2mm*P0.65mm* The FT232RL is a full-speed USB 2.0 to asynchronous serial data transfer IC. It integrates all the necessary USB protocol handling and UART interface logic, making it very easy to add USB connectivity to embedded devices without requiring complex firmware development. It is commonly used in development boards (like Arduino clones), USB-to-TTL converters, and debugging interfaces. Key Features USB Interface Fully compliant with USB 2.0 Full-Speed (12 Mbps) Integrated USB transceiver (no external components required) Supports USB suspend/resume modes Internal EEPROM for storing USB descriptors (no external EEPROM needed) Serial (UART) Interface Supports standard UART communication (TX, RX) Configurable baud rates from 300 bps up to 3 Mbps Supports hardware flow control (RTS/CTS, DTR/DSR) Bit-bang mode for simple GPIO control Integrated Components Built-in clock generator (no external crystal required) Internal EEPROM for configuration Integrated voltage regulator (3.3V output available for external use) Power Features Operates from 3.3V to 5V Can be powered directly from USB (bus-powered) Low power consumption with sleep mode Driver Support Virtual COM Port (VCP) drivers available for: Windows Linux macOS Also supports direct D2XX driver for advanced applications Package Typically available in SSOP-28 package Common Applications USB-to-serial converters (TTL/RS232) Microcontroller programming and debugging Embedded system communication Industrial and instrumentation interfaces

This project is a motherboard for the ESP32-CAM module, which enables easy and flexible WiFi camera applications. The motherboard provides power supply, programming interface, and GPIO expansion for the ESP32-CAM. It also supports external sensors for more functionality. #motherboard #WiFi #MCU #ReferenceDesign #project #ESP32 #camera #reusable #module #edgeComputing #espressif #template

802.15.4, Bluetooth, WiFi 802.11a/b/g/n/ac/ax, Bluetooth v5.3, Zigbee® Transceiver Module 2.4GHz, 5GHz Antenna Not Included, U.FL/MHF, PCB Trace Surface Mount The LBES5PL2EL-923 is a compact, low-power Bluetooth® Low Energy (BLE) module developed by Murata. It integrates a Nordic Semiconductor SoC (nRF52 series) with an onboard antenna, providing a complete RF solution for wireless connectivity in embedded systems. The module is designed for IoT, wearable, and low-power wireless applications, offering reliable communication, small footprint, and minimal external component requirements. Key Features Integrated Bluetooth® Low Energy (BLE) 5.x compliant module Based on Nordic Semiconductor nRF52 series SoC Built-in chip antenna (no external antenna required) Ultra-low power consumption suitable for battery-powered devices Integrated RF matching and shielding Supports multiple BLE roles (Central, Peripheral, Broadcaster, Observer) Compact surface-mount package Pre-certified RF module (reduces certification effort) Electrical Characteristics Supply Voltage Operating Voltage: 1.7 V to 3.6 V Current Consumption TX Mode: ~5–10 mA (depending on output power) RX Mode: ~5 mA Sleep Mode: < 2 µA RF Characteristics Frequency Band: 2.4 GHz ISM (2400–2483.5 MHz) Output Power: up to +4 dBm Sensitivity: approx. -96 dBm Interfaces UART SPI I²C (TWI) GPIO (multiplexed) ADC inputs PWM Mechanical Specifications Package Type: Surface Mount Module (SMD) Dimensions: ~10 mm × 7 mm × 1.4 mm (approx.) Integrated antenna and shielding Environmental Ratings Operating Temperature: -40°C to +85°C Storage Temperature: -40°C to +125°C Compliance & Certifications Bluetooth SIG qualified FCC / IC / CE (module-level certification, varies by variant) RoHS compliant Applications IoT devices Wearables Smart home products Wireless sensors Industrial monitoring systems Pin Configuration (Summary) Power: VDD, GND Communication: UART, SPI, I²C GPIOs: Configurable digital I/O RF: Integrated antenna (no RF pin required) Design Considerations Follow recommended PCB layout for antenna clearance Avoid copper under antenna region Provide stable power supply with proper decoupling capacitors Ensure proper grounding for RF performance #commonpartslibrary #integratedcircuit #transceiver #wireless #rf

ARM Cortex-M0+ MCU, 48MHz, 8KB Flash, 4KB RAM, 1.6-3.6V, 12 GPIO, SOIC-14 #Microcontroller #samd #commonpartslibrary

SIM868 module is the complete Quad-Band GSM/GPRS module which combines GNSS( GPS/GLONASS/BDS) technology for satellite navigation. It has strong extension capability with abundant interfaces including UART, USB2.0, GPIO etc. The module provides much flexibility and ease of integration for customer's applications. #Module #part

ARM Cortex-M0+ MCU, 128KB flash, 20KB RAM, 32MHz, 1.65-3.6V, 25 GPIO, 32-LQFP #Microcontrollers #stm32 wf

The ams OSRAM TCS3448 is a highly versatile, multi-purpose spectral light sensor designed to sense the spectral components of ambient light in the visible range. This 14-channel sensor is optimized for applications requiring precise color sensing and ambient light classification, making it ideal for enhancing camera performance through improved color temperature (CCT), automatic white balance (AWB), and exposure time adjustments. The TCS3448 features individual channels covering approximately 380 nm to 1000 nm, including 11 channels centered in the visible spectrum, one near-infrared (NIR) channel, and a clear channel. Additionally, it integrates a flicker detection channel that can automatically flag ambient light flicker at 50/60 Hz and buffer data for calculating other flicker frequencies. The sensor's high-precision optical interference filters are directly deposited on photodiodes embedded in CMOS silicon, ensuring accurate spectral data. With a built-in aperture, programmable digital GPIO, and LED driver, the TCS3448 offers robust control and synchronization capabilities. The device is available in an ultra-low profile package, making it suitable for a wide range of applications, from industrial automation to mobile and wearable devices. Features: 14-channel spectral sensing Visible range coverage (380 nm to 1000 nm) 11 visible spectrum channels Near-infrared (NIR) channel Clear channel Flicker detection up to 1 kHz Integrated aperture for increased accuracy High-precision optical interference filters Programmable digital GPIO LED driver for light source control Serial I²C interface (1.2 V/1.8 V) Ultra-low profile package (3.1 mm x 2 mm x 1 mm) Field of view (FOV) ±40° 0.18 µ process technology Compatible with AS7343 software #CommonPartsLibrary #IntegratedCircuit #Sensor #Transducers #Optical-Sensor #Ambient-Light #IR #UV-Sensor

2 MP MIPI® CSI-2 FPD-Link III serializer for 2MP/60fps cameras & radar The DS90UB953-Q1 is an automotive-grade high-speed serializer designed to convert parallel image sensor data into a high-speed serial stream for transmission over a single differential pair using FPD-Link III technology. It is intended for use in camera-based systems where compact cabling, high data integrity, and low latency are required. The device interfaces directly with image sensors through a MIPI CSI-2 input and transmits video, control, and GPIO data over a single coaxial or shielded twisted pair cable. Integrated clocking and control features allow synchronization with remote deserializers, enabling robust communication in electrically noisy environments typical of automotive and industrial applications. Functional Description The device receives image data from a connected sensor through a MIPI CSI-2 interface and serializes this data for transmission over a high-speed differential link. In addition to video data, bidirectional control communication is supported through an embedded control channel, allowing configuration and monitoring of remote devices using an I²C interface. The serializer incorporates programmable GPIO functionality that can be used for control signaling or sensor monitoring, with the ability to transport these signals across the link. Internal clock generation and phase-locked loop circuitry support multiple clocking modes, enabling flexible system design with either local or remote reference clocks. The device also includes pattern generation capabilities for system testing and validation. Electrical Characteristics The component operates from multiple power domains supporting core logic, I/O, and phase-locked loop functions. It is designed to provide stable high-speed signal transmission with controlled impedance outputs and low jitter characteristics. The differential serial output supports reliable long-distance communication over coaxial or twisted-pair media. Input interfaces are optimized for compatibility with standard MIPI CSI-2 signaling, ensuring seamless integration with modern image sensors. The control interface uses an open-drain I²C protocol for configuration and communication. Mechanical Characteristics The device is provided in a compact quad flat no-lead package suitable for high-density PCB designs. The package includes an exposed thermal pad that serves both as a heat dissipation path and a low-impedance electrical ground connection. The small footprint and low profile make it well suited for space-constrained applications such as camera modules and embedded vision systems. Environmental Characteristics The DS90UB953-Q1 is qualified for automotive applications and is designed to operate reliably over extended temperature ranges and under conditions of electrical noise, vibration, and mechanical stress. The device is compatible with standard surface-mount assembly processes, including lead-free reflow soldering. Materials and construction comply with relevant environmental and reliability standards for automotive-grade electronic components. Materials and Construction The package body is constructed from high-temperature thermally stable materials suitable for reflow soldering. Electrical contacts are formed from copper-based alloys with plated finishes to ensure long-term conductivity, corrosion resistance, and mechanical durability. The exposed pad is designed to interface directly with the PCB ground plane for improved thermal and electrical performance.