• SCM5R5355B

    SCM5R5355B

    3.5 F (EDLC) Supercapacitor 5.5 V Radial, Can 160mOhm @ 1kHz 1000 Hrs @ 65°C Supercapacitor – SCM Series (3.5F, 5.5V) General Information Manufacturer: Sruite Electronic Technology (US) Series: SCM Part Status: Active Packaging: Bulk Electrical Characteristics Capacitance: 3.5 F Tolerance: -20% / +80% Rated Voltage: 5.5 V ESR (Equivalent Series Resistance): 160 mΩ @ 1 kHz Reliability Lifetime: 1000 hours @ 65°C Mechanical Characteristics Mounting Type: Through Hole Termination: PC Pins Package Type: Radial, Can Physical Dimensions Lead Spacing: 5.50 mm (0.217") Body Size (L × W): 20.0 mm × 10.0 mm Height (Max): 22.0 mm (0.866") Environmental Conditions Operating Temperature Range: -25°C to +70°C Compliance / Classification Grade: Not specified Qualification: Not specified #CommonPartsLibrary #EDLC #SCM


  • NDP120-WLBGA42

    NDP120-WLBGA42

    The Syntiant NDP120 Neural Decision Processor is a special purpose chip for audio and sensor processing for always-on applications in battery powered devices and other power constrained systems. The NDP120 applies neural processing to run multiple applications simultaneously with minimal power consumption. Built using the Syntiant Core 2 programmable deep learning architecture, NDP120 is designed to natively run multiple Deep Neural Networks (DNN) on a variety of architectures, such as CNN, RNN and fully connected networks. NDP120 brings a level of ML performance that delivers 25x the tensor throughput compared to the Syntiant Core 1 embedded in Syntiant’s NDP100 and NDP101 devices. A programmable HiFi 3 DSP is available for classical audio processing. Always-On Speech & Sensor-Fusion Processor

    10 Uses


  • TCS3448

    TCS3448

    The ams OSRAM TCS3448 is a highly versatile, multi-purpose spectral light sensor designed to sense the spectral components of ambient light in the visible range. This 14-channel sensor is optimized for applications requiring precise color sensing and ambient light classification, making it ideal for enhancing camera performance through improved color temperature (CCT), automatic white balance (AWB), and exposure time adjustments. The TCS3448 features individual channels covering approximately 380 nm to 1000 nm, including 11 channels centered in the visible spectrum, one near-infrared (NIR) channel, and a clear channel. Additionally, it integrates a flicker detection channel that can automatically flag ambient light flicker at 50/60 Hz and buffer data for calculating other flicker frequencies. The sensor's high-precision optical interference filters are directly deposited on photodiodes embedded in CMOS silicon, ensuring accurate spectral data. With a built-in aperture, programmable digital GPIO, and LED driver, the TCS3448 offers robust control and synchronization capabilities. The device is available in an ultra-low profile package, making it suitable for a wide range of applications, from industrial automation to mobile and wearable devices. Features: 14-channel spectral sensing Visible range coverage (380 nm to 1000 nm) 11 visible spectrum channels Near-infrared (NIR) channel Clear channel Flicker detection up to 1 kHz Integrated aperture for increased accuracy High-precision optical interference filters Programmable digital GPIO LED driver for light source control Serial I²C interface (1.2 V/1.8 V) Ultra-low profile package (3.1 mm x 2 mm x 1 mm) Field of view (FOV) ±40° 0.18 µ process technology Compatible with AS7343 software #CommonPartsLibrary #IntegratedCircuit #Sensor #Transducers #Optical-Sensor #Ambient-Light #IR #UV-Sensor


  • F300-1B7H1-11017-E100

    F300-1B7H1-11017-E100

    17 Position FFC, FPC Connector Contacts, Bottom 0.020" (0.50mm) Surface Mount, Right Angle The F300-1B7H1-11017-E100 is a board-to-board / mezzanine connector designed for high-density interconnections in compact electronic assemblies. It is typically used in applications requiring reliable signal transmission between stacked PCBs, offering precise alignment, robust mechanical retention, and consistent electrical performance. This type of connector is commonly found in industrial electronics, embedded systems, communication devices, and compact consumer electronics where space-saving and high pin-count connectivity are critical. Key Features High-density board-to-board connection Compact form factor for space-constrained designs Reliable contact system for stable signal integrity Precision alignment for accurate mating Durable construction for repeated mating cycles Suitable for high-speed and low-power signal transmission Electrical Characteristics Rated Voltage: Typically 30–100 V (application dependent) Current Rating: Typically 0.3–1.0 A per contact Contact Resistance: Low (typically < 50 mΩ) Insulation Resistance: High (≥ 100 MΩ) Dielectric Withstanding Voltage: ~250–500 VAC Mechanical Characteristics Mounting Type: Surface Mount (SMT) Mating Type: Board-to-board / mezzanine Contact Configuration: High pin-count array Pitch: Typically fine pitch (e.g., 0.3 mm – 0.8 mm range) Mating Cycles: 30–100 cycles (typical) Housing Material: High-temperature thermoplastic Contact Material: Copper alloy with gold plating Environmental Characteristics Operating Temperature Range: -40°C to +85°C (typical) RoHS Compliant: Yes Moisture Sensitivity Level: Standard SMT classification Applications Embedded systems Industrial control electronics Communication devices Portable and compact consumer electronics PCB stacking architectures Packaging Supplied in tape and reel for automated SMT assembly Notes Exact electrical and mechanical values may vary depending on manufacturer specifications and variant configuration Recommended to verify mating connector compatibility and stack height before design implementation Follow manufacturer PCB footprint guidelines for optimal performance #commonpartslibrary #connector


  • TPD1E05U06DPYR

    TPD1E05U06DPYR

    14V Clamp 2.5A (8/20µs) Ipp Tvs Diode Surface Mount 2-X1SON (1x.60) TVS diode USB VBUS 5V TVS diode USB VBUS 5V ESD protection General Description The TPD1E05U06DPYR is a single-channel transient voltage suppression device designed to protect sensitive electronic components from electrostatic discharge (ESD) and other transient voltage events. It is engineered for high-speed signal applications, offering low capacitance to preserve signal integrity while providing robust protection. The device is suitable for integration into compact and portable electronic systems where space, reliability, and performance are critical. Device Identification Part number: TPD1E05U06DPYR Device classification: ESD protection diode / transient voltage suppressor Manufacturer: Commonly associated with Texas Instruments Mounting type: Surface-mount Package style: Ultra-small leadless package (e.g., X2SON/DFN) Functional Description Protects circuits from high-voltage transients caused by ESD events Limits voltage spikes by clamping them to safe levels Maintains signal quality by minimizing added capacitance Operates transparently under normal signal conditions Provides fast response to transient disturbances Performance Characteristics Low capacitance suitable for high-speed data lines High ESD protection capability compliant with standard test models Low leakage current during normal operation Fast transient response time Stable performance across specified operating conditions Electrical Characteristics Designed for low-voltage applications (approximately 5 V working range) Low clamping voltage to protect downstream components Minimal dynamic resistance Very low input/output capacitance High reliability under repeated ESD stress Application Scope High-speed communication interfaces such as USB, HDMI, and display ports Mobile phones, tablets, and wearable electronics Embedded systems and microcontroller interfaces Consumer and industrial electronic equipment Data and signal line protection in compact devices Mechanical and Physical Properties Compact footprint for high-density PCB layouts Leadless package for improved mechanical robustness Compatible with standard surface-mount assembly processes Designed for automated manufacturing environments Integration Guidelines Install as close as possible to the external connector or entry point Ensure a low-impedance path to ground for optimal protection Minimize trace length between the device and the protected line Consider layout practices to preserve high-speed signal integrity Verify compatibility with system voltage and interface requirements #commonpartslibrary #circuitprotection #tvsdiode

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    68 Uses