40 Position Elevated Socket Connector 0.100" (2.54mm) Through Hole Tin #CommonPartsLibrary #Connector #Header #Samtec #ESQ-120

Pin Headers FTSH-105-01-L-DV-K-A CONN-SMD_FTSH-105-01-L-DV-K-TR LCSC Part Number: C21365778 undefined Manufactured by SAMTEC

TSW-108-07-L-S HDR-TH_TSW-108-07-L-S LCSC Part Number: C6888011 undefined Manufactured by SAMTEC

64 Position Female Connector PCI Express™ Gold 0.039" (1.00mm) Black The PCIE-064-02-X-D-TH is a high-density PCI Express edge connector designed for reliable board-to-board and card-to-host connections in high-speed data communication applications. Manufactured by Samtec, this connector supports PCI Express signaling standards while providing robust mechanical and electrical performance for high-frequency, high-bandwidth systems. Its through-hole mounting and dual-row design ensure secure attachment to the PCB, high mating retention, and long operational life. The connector is ideal for computer peripherals, server systems, embedded computing platforms, networking devices, and industrial electronic equipment where signal integrity, mechanical reliability, and high-density interconnects are critical. Engineering Specifications Manufacturer: Samtec Part Number: PCIE-064-02-X-D-TH Series: PCI Express Edge Connector Connector Type: Board-to-Board / Card Edge Connector Contact Configuration: Dual-Row High-Density Contacts Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Surface Housing Material: High-Temperature Thermoplastic Signal Performance: PCI Express Standard Compliant Electrical Performance: High-Speed Data Transmission Mechanical Durability: High Mating Cycle Life Orientation: Right Angle / Standard Edge Mount Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: PCI Express Expansion Cards, High-Speed Computing Systems, Server and Data Center Hardware, Embedded Platforms, Networking Equipment, Industrial Computing, High-Bandwidth Digital Interfaces, Board-Level Interconnects Key Features High-density dual-row PCIe edge contacts Through-hole mounting for robust PCB attachment Gold-plated contact interface for reliable signal transmission Supports high-speed PCI Express signaling Compact, high-density design for space-constrained PCBs Long mechanical life with repeated mating cycles Compatible with standard PCI Express cards and connectors Reliable operation in industrial and commercial environments Ideal for embedded computing, server, and networking applications Ensures signal integrity for high-bandwidth data communication #PCIE06402XDTH #Samtec #PCIeConnector #EdgeConnector #BoardToBoard #HighSpeedInterconnect #HighDensityConnector #ThroughHole #IndustrialElectronics #EmbeddedSystems #ServerHardware #NetworkingEquipment #ElectronicComponents #PCBDesign #HighBandwidth #DataCommunication #PCIExpress #ExpansionCardConnector #MechanicalReliability #ElectronicInterconnect

10 Position Receptacle Connector 0.050" (1.27mm) Surface Mount Gold The SFM-105-02-X-D-A is a high-reliability dual-row socket connector designed for board-to-board and mezzanine interconnection applications. Manufactured by Samtec, this connector provides a compact and durable solution for connecting printed circuit boards in embedded systems, industrial electronics, communications equipment, test instruments, and high-performance computing platforms. The connector features precision-machined contacts that ensure consistent electrical performance, excellent mating reliability, and long operational life. Its low-profile design and high-density contact arrangement make it suitable for applications requiring space-efficient interconnect solutions while maintaining signal integrity and mechanical robustness. Engineering Specifications Manufacturer: Samtec Part Number: SFM-105-02-X-D-A Series: SFM Series Connector Type: Board-to-Board Socket Connector Contact System: Precision Socket Contacts Row Configuration: Dual Row Mounting Style: Through-Hole Contact Material: Copper Alloy Contact Finish: Gold-Plated Contact Interface Housing Material: High-Temperature Thermoplastic Mating Compatibility: Standard Samtec Header Systems Electrical Performance: High-Reliability Signal Interconnection Mechanical Durability: High Mating Cycle Life Operating Temperature Range: Industrial Grade RoHS Compliant: Yes Applications: Embedded Systems, Industrial Control Equipment, Communication Systems, Data Acquisition Platforms, Instrumentation, Test Equipment, Computing Hardware, PCB Interconnect Solutions Key Features High-density dual-row socket configuration Precision-machined contacts for reliable electrical performance Gold-plated contact interface for enhanced conductivity and durability Compact footprint for space-constrained designs Excellent mating alignment and retention characteristics High mechanical durability for repeated insertion cycles Suitable for board stacking and mezzanine interconnections Compatible with a wide range of Samtec header connectors Designed for industrial and commercial electronic systems Supports reliable signal transmission in high-performance applications #SFM10502XDA #Samtec #BoardToBoardConnector #SocketConnector #DualRowConnector #PCBConnector #Interconnect #EmbeddedSystems #IndustrialElectronics #CommunicationSystems #Instrumentation #DataAcquisition #MezzanineConnector #ThroughHoleConnector #ElectronicComponents #PCBDesign #SignalIntegrity #HighReliability #ConnectorTechnology #EmbeddedHardware

The ADF6-100-03.5-L-4-2-A-TR is a high-density board-to-board mezzanine connector from the Samtec AcceleRate® HD series. It is designed for high-speed and high-performance interconnect applications requiring compact size, excellent signal integrity, and high pin density. This connector features a fine 0.635 mm pitch with a 4-row socket configuration, making it suitable for advanced embedded systems, networking equipment, data communication devices, industrial electronics, and high-speed computing platforms. Key Features High-density mezzanine connector system 0.635 mm fine pitch design 4-row socket configuration Supports high-speed data transmission up to 64 Gbps PAM4 / 32 Gbps NRZ Optimized Edge Rate® contact system for improved signal integrity Surface-mount (SMD) mounting style Gold-plated contacts for reliable electrical performance Compact low-profile design Designed for board-to-board stacking applications Compatible with multiple stacking heights Suitable for PCIe®, CXL®, networking, AI, telecom, and embedded systems applications Tape-and-reel packaging for automated assembly processes #Connector

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TMMH-132-06-S-6 HDR-TH_192P-P2.00-V-M-R6-C32-LS2.0 LCSC Part Number: C6881662 undefined Manufactured by SAMTEC

HTSW-139-05-G-T-LL HDR-TH_117P-P2.54-V-M-R3-C39-S2.00 LCSC Part Number: C6878438 undefined Manufactured by SAMTEC

HTSW-134-05-L-D-LL HDR-TH_68P-P2.54-V-M-R2-C34-S2.54 LCSC Part Number: C6878375 undefined Manufactured by SAMTEC

FTR-132-02-G-D-A HDR-SMD_64P-P1.27-V-M_FTR-132-XX-X-D-A LCSC Part Number: C20726385 undefined Manufactured by SAMTEC