USB 2.0 SI (diff-pair impedance & ESD): Partial (series resistors & TVS added; impedance rules not yet applied).
Documentation & design-rule compliance: ✅ BOM and ERC/DRC checks in schematic done; PCB-level DRC pending.
Recommended Next Step
Proceed to the “Prepare PCB Layout” phase of the Flux workflow: set up the 4-layer stackup, draw the board outline with capture pads and mounting holes, and classify nets with impedance rules. Once that’s in place, you can place components and begin routing.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant
Piggyback USB2.0 Type-A Mezzanine Interposer with Reverse-Current Protection, Tamper-Resistant D+/D− One-Shot Shunt, Supercap Backup, and SI-Compliant Chassis-Mounted Shielding
Properties
Power Conversion
30
px
Power
7.62mm
ONSHORE_USB-A1VSB6
USB 2.0
2.5
mm
4 + shield stakes
USB
Telecommunications
Mechanical
USB
[(-6.57mm, 0mm), (6.57mm, 0mm)]
On Shore USB-A1VSB6
Adjustable slotted pad pattern to accommodate typical 4-pin right-angle through-hole USB-A receptacles with ~2.5 mm pin pitch and shield stakes at ±6.57 mm
USB 2.0 Type-A tamper-detect interposer with integrated reverse-current protection, polyfuse, VBUS TVS, supercapacitor-based energy store, and one-shot–latched D+/D- shunt for tamper response. Implemented on a standard 4-layer stackup with inner planes for VBUS and GND/return to support USB 2.x signal integrity in a compact interposer form factor.