Work Completed
- All schematic changes per steps 1–5 implemented (project description, architecture diagram, key ICs, passives, VBUS/tamper/ESD nets, ERC/DRC updates).
- Footprints verified and BOM enriched with MPNs and manufacturer details.
- Reviewed DRC issues and verified manufacturability items that could be completed in schematic and BOM.
Remaining Unaddressed Tasks
- Define and assign a standard 4-layer PCB stackup (inner VBUS & GND planes).
- Draw the board outline with slotted capture pads for USB-A pins, shield-stake holes, and mounting ears.
- Classify nets (USB diff pairs, power, ground) and set differential impedance rules (90 Ω) and power-net trace widths.
- Place all components on the PCB outline, including chassis-bonding features.
- Route nets (differential pairs, power, signals) per layout rules using Auto-Layout.
- Run manufacturability DRC checks for missing footprints, invalid layers, and floating copper in the PCB layout environment.
Success Criteria Review
- Mechanical mating & chassis mounting: Pending (outline & placement not defined).
- VBUS path & sensing: ✅ schematic completed.
- One-shot tamper mechanism: ✅ schematic integration complete.
- USB 2.0 SI (diff-pair impedance & ESD): Partial (series resistors & TVS added; impedance rules not yet applied).
- Documentation & design-rule compliance: ✅ BOM and ERC/DRC checks in schematic done; PCB-level DRC pending.
Recommended Next Step
Proceed to the “Prepare PCB Layout” phase of the Flux workflow: set up the 4-layer stackup, draw the board outline with capture pads and mounting holes, and classify nets with impedance rules. Once that’s in place, you can place components and begin routing.