Test Plan Development Guidelines
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3. Key Requirements to Validate
| Requirement Type | Description |
|---|---|
| Functional | Power-up sequencing, regulator outputs, logic signals |
| Electrical | Voltage accuracy (±5%), current capacity, EMI/EMC compliance |
| Thermal | Maximum operating temperature ≤ 85 °C, hotspot ≤ 10 °C above ambient |
| Mechanical | Connector insertion force ≤ spec, board thickness and mounting fit |
| Environmental | Operate from –40 °C to +85 °C, humidity 85% RH non-condensing |
| Communication & Interface | Data transfer rates, protocol compliance, signal eye patterns |
| Reliability | MTBF > 50,000 hours; no solder joint fatigue under vibration |
4.1 Electrical Testing
| Test ID | Test Case | Procedure | Expected Outcome | Pass/Fail Criteria |
|---|---|---|---|---|
| ET-01 | Power-On Rail Voltages | Apply 0–5 V input ramp; measure each regulator output with DMM | 3.3 V ±5%, 5 V ±5% | All rails within tolerance |
| ET-02 | Short-Circuit Current Limit | Short each rail to GND; observe current draw and shutdown action | Current ≤ spec, no board damage | Limit trips and resets correctly |
| ET-03 | Signal Integrity on High-Speed Net | Inject PRBS pattern at max data rate; capture with scope | Eye diagram meets mask per spec | No more than 1 bit error per 10⁶ bits |
4.2 Thermal Testing
| Test ID | Test Case | Procedure | Expected Outcome | Pass/Fail Criteria |
|---|---|---|---|---|
| TT-01 | Steady-State Thermal Profile | Power board at full load in thermal chamber at 25 °C | Max component temp ≤ 85 °C | ΔT ≤ 60 °C above ambient |
| TT-02 | Thermal Cycling | Cycle −40 °C ↔ +85 °C, 30 min dwell, 100 cycles | No functional failures after test | 100% pass on power-up and self-tests |
4.3 Mechanical Testing
| Test ID | Test Case | Procedure | Expected Outcome | Pass/Fail Criteria |
|---|---|---|---|---|
| MT-01 | Connector Durability | Mate/unmate connectors 100× | No bent pins, reliable contact | Resistance ≤ spec after cycle |
| MT-02 | Vibration & Shock | MIL-STD-810G Method 514.6, 5 g, 10 –500 Hz, 1 hour per axis | No loosened components or cracks | Functional post-test, no opens |
4.4 Environmental Testing
| Test ID | Test Case | Procedure | Expected Outcome | Pass/Fail Criteria |
|---|---|---|---|---|
| ET-01 | Humidity Resistance | 85% RH, 85 °C for 96 hours | No corrosion or leakage currents | Insulation resistance ≥ spec |
| ET-02 | Salt Spray | 5% NaCl fog per ASTM B117, 48 hours | No conductive corrosion | Board functions normally |
4.5 Communication & Interface Testing
| Test ID | Test Case | Procedure | Expected Outcome | Pass/Fail Criteria |
|---|---|---|---|---|
| CI-01 | UART Loopback | Send known byte stream at 115 200 bps; verify reception | No framing or parity errors | BER ≤ 10⁻⁶ |
| CI-02 | I²C Pull-Up Resistor Verification | Measure bus rise time; check ACK/NACK at 400 kHz | Rise time within 300 ns, ACK reliable | Meets I²C timing specs |
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Extra Pink Matter Compiler
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Properties
Availability & Pricing
| Distributor | Qty 1 | |
|---|---|---|
| Arrow | $0.01–$0.01 | |
| Digi-Key | $0.01–$0.10 | |
| LCSC | $0.00 | |
| Mouser | $0.10 | |
| Verical | $0.01–$0.01 | |
Assets
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