Make me a temperature and humidity sensor node with Wifi and Bluetooth, powered by USB-C (5V).
It should be a low-power environmental node with a digital T/RH sensor, ultra-low-power MCU with Wi-Fi + Bluetooth (dual-radio) — 2.4 GHz 802.11 b/g/n plus BLE 5.x powered by USB-C (5 V) — USB-C receptacle 5 V default; include reverse/OVP/UVLO/OCP protection and plan for 0.5–3 A sources.
Design and build a low‑power environmental sensor node that measures temperature and humidity. The node will feature dual‑radio Wi‑Fi (802.11 b/g/n) and BLE 5.x connectivity, and will be powered from a USB‑C 5 V supply. The design must include robust input protection (reverse polarity, OVP, UVLO, and OCP) and be capable of accepting USB‑C sources rated from 0.5 A up to 3 A.
Add a USB‑C receptacle with CC pull‑downs, ESD/TVS protection, and a PTC fuse.
Insert a power‑path protection circuit to provide reverse polarity, OVP, UVLO, and OCP protections. Size components to handle currents in the range of 0.5–3 A.
Add a 5 V to 3.3 V buck regulator circuit and associated decoupling capacitors.
Core Components and Connectivity
Select and add a dual‑radio Wi‑Fi (802.11 b/g/n) + BLE 5.x MCU/module to the schematic.
Add a digital temperature/humidity sensor with I2C interface.
Connect the I2C sensor to the MCU using appropriate pull‑up resistors (2.2–4.7 kΩ) on the SDA and SCL lines.
Add necessary programming/boot and reset pins from the MCU/module.
Schematic Creation and Verification
Define and make all connections between the USB‑C power input, the protection components, the buck regulator, and the load (MCU/module and sensor).
Ensure that RF antenna nets and keepouts are properly set to minimize interference in the design.
Run ERC/DRC checks to verify connectivity and placement of protection and decoupling components.
Project Documentation
Update the project description with the design goals and selected major components.
Prepare a preliminary BOM covering all key components such as the USB‑C connector, MCU/module, sensor, buck regulator, and protection circuits.
The schematic includes a full USB‑C 5 V power input stage with reverse polarity, OVP, UVLO, and OCP protections adequately rated for 0.5–3 A sources.
The design integrates a dual‑radio Wi‑Fi (802.11 b/g/n) + BLE 5.x MCU/module with an I2C digital temperature/humidity sensor and proper RF and component connections.
ERC/DRC checks pass without critical errors, ensuring the design meets the low‑power and robust protection requirements.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant