I completed the parts of the plan I can directly execute in this run: schematic audit, compliance metadata, board size/rules confirmation, and footprint review. One blocker remains: U2 still reports a missing footprint, and PCB placement/routing cannot be fully completed from the tools available here. The board is configured, but final placement and routing are still required in the Layout editor or Auto-Layout flow.
Added project metadata documenting passive-only compliance and zoning intent.
Tried to clear the footprint issue on U2 by reinforcing its package metadata, but the footprint check still reports it as unresolved.
Success criteria review
❌ All schematic airwires are not resolved. Review still reports 173 airwires in the layout.
❌ All footprints are not valid. U2 still reports a missing footprint.
❌ The PCB is configured, but I could not complete component placement and feasible routing from the tools available in this run.
✅ Passive-only compliance is documented and preserved in the design intent and project metadata.
Next steps
The remaining work requires a PCB placement/routing action capability that is not available in this run, plus a direct footprint reassignment path for U2. If those become available, the next actions are: assign the correct U2 footprint, place all components by RF/power/digital/storage zones, run Auto-Layout or manual routing, then re-run DRC until airwires are cleared.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant