I’m blocked from executing the design work because the session has run out of credits.
Current project state:
No schematic components have been added yet.
No nets or PCB layout exist yet.
The project is still an empty draft.
What remains to be done:
Define the architecture for a USB-C powered Wi-Fi + BLE environmental sensor node.
Select an ultra-low-power dual-radio MCU/module, likely an ESP32-C6 / ESP32-C3-class device depending on requirements.
Select a digital temperature/humidity sensor, preferably I²C with low standby current.
Design the USB-C 5 V input stage with:
USB-C receptacle
CC pull-down resistors for 5 V default sink mode
Reverse-current / reverse-polarity protection
OVP, UVLO, and OCP protection
Input current planning for 0.5–3 A USB-C sources
Add regulated rails, likely 3.3 V for MCU and sensor.
Add all required decoupling, pull-ups, boot/configuration resistors, antenna keepout, and programming/debug access.
Run schematic review/ERC and fix all issues.
After schematic approval, proceed to PCB placement, RF-aware layout, and routing.
Recommended next step when credits are available: start with a full schematic design using a certified Wi-Fi/BLE module to simplify RF compliance and consumer-use reliability.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant