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• Description: This block handles the power supply to the entire thermostat system, ensuring regulation and distribution of power from USB and battery sources.
• Components:
  • Battery and USB Connector:
    • USB1: TYPE-C-31-M-12 (Type-C USB connector)
  • Voltage Regulator:
    • U1: AMS1117-3.3 (3.3V Voltage Regulator)
    • C4: 10uF Capacitor
    • C3, C6, C8: 10uF Capacitors for filtering
  • Battery Charge Controller:
    • U4: BQ25895RTWT (Battery charge controller)
    • C16, C18: 22uF Capacitors
    • C17: 47nF Capacitor
    • C15: 4.7uF Capacitor
    • L1: 2.2uH Inductor
    • R11: 2.2kΩ Resistor
  • Diodes:
    • D1, D3: 1N5819HW-7-F (Schottky Diode for reverse voltage protection)

• Description: This block ensures the main processing, control, and connectivity via Wi-Fi through the ESP32 module.
• Components:
  • Microcontroller:
    • U2: ESP32-WROOM-32E (ESP32 Module)
  • Capacitors for ESP32:
    • C13, C12, C14, C20: 10uF Capacitors for decoupling and stability
    • C1, C2, C5, C47: 0.1uF Capacitors for stability
  • Crystal Oscillator:
    • X1: NX3215SA-32.768K-EXS00A-MU00003 (32.768 kHz Crystal)
    • C56: 10pF Capacitor
  • Programming and Debugging Interface:
    • J7: Connector
    • C23: 22uF Capacitor
    • R21: 100kΩ Resistor

• Description: Monitors the environment by measuring temperature, humidity, gas, and pressure using the BME680 sensor.
• Components:
  • Environmental Sensor:
    • IC2: BME680 (Environmental Sensor)
    • R5: 4.7kΩ (I²C Pull-up)
    • R6: 4.7kΩ (I²C Pull-up)
    • C48: 0.1uF Capacitor

• Description: This block allows user interaction through the E-Ink display and rotary encoder for setting adjustments.
• Components:
  • Display:
    • U3: HTEW0154T8 (1.54 inches E-Ink Display)
    • C49: 0.1uF Capacitor
  • Rotary Encoder:
    • SW2: EC12D1564402 (Rotary Encoder)
    • R8: 10kΩ Resistor
  • Miscellaneous:
    • R3, R9, R15, R17: Various resistors for signal conditioning

• Description: Detects motion or presence using the PIR sensor.
• Components:
  • PIR Sensor:
    • PIR1: IRA-S230ST01 (PIR Sensor)
    • C24: 3.3nF Capacitor
    • R19: 10kΩ Resistor

• Description: Facilitates communication with external peripherals and devices via I2C, SPI, and UART.
• Components:
  • I2C Pull-up Resistors:
    • R5: 4.7kΩ (SDA)
    • R6: 4.7kΩ (SCL)
  • UART Communication:
    • IC1: CH340C (USB to UART bridge)
  • I2C Devices:
    • U10: APDS-9960 (Proximity, Light, RGB, and Gesture Sensor)
    • IC2: BME680 (Environmental Sensor)

• Description: Responsible for audio output, such as alerts or notifications.
• Components:
  • Speaker:
    • SPK1: 3 Watt, 4 Ohm Mini Speaker

• Description: Includes other necessary components like passive elements.
• Components:
  • Filtering and Decoupling:
    • Various capacitors like C33, C36, C37, etc. for filtering and decoupling.
  • Resistive Networks:
    • Various resistors like R1, R24, R26, etc. for biasing and pull-ups.

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1. ESP32 Module:
   • Alternative Modules: Look for cheaper ESP32 variants or WiFi modules. Often, different suppliers offer similar products at reduced costs.
   • Board Design: Consider designing the WiFi circuitry yourself using the ESP32 chip instead of using a ready-made module.
2. Environmental Sensor (BME680):
   • Alternative Sensors: Evaluate if a different, less expensive sensor can meet your design requirements. Sensors like the DHT22 or BME280 might suffice depending on your precision needs.
3. E-Ink Display:
   • Size and Resolution: Assess if a smaller or lower-resolution E-Ink display would be sufficient for your user interface.
   • Different Supplier: Check for alternative suppliers for the same or similar E-Ink display at a lower cost.
4. Capacitors and Resistors:
   • Component Sourcing: Source capacitors and resistors from suppliers that offer bulk discounts.
   • Standardize Values: Use commonly available and standardized values to reduce costs due to bulk purchasing.
5. Connectors and Switches:
   • Evaluate Specifications: Ensure that connectors like JST and switches from Cherry Americas have no over-specification, which often increases cost.
   • Bulk Purchasing: Purchase in bulk where feasible to drive the per-unit cost down.

1. Component Count Reduction:
   • Combined Functionality: Check if certain functionalities can be combined or if certain components are redundant.
2. Power Management:
   • Single Power Supply: Use a single power supply voltage if possible (e.g., 3.3V only), which can simplify the design and reduce costs.
   • Power Optimization: Use low-power components to reduce the overall power consumption, potentially allowing for less expensive power supply solutions.

1. PCB Size:
   • Reduce Board Size: Minimize the PCB dimension to reduce manufacturing costs. Every square cm saved can translate to cost savings.
   • Layer Reduction: If your design uses multiple PCB layers, assess if it can be reduced to fewer layers without compromising performance.
2. Routing and Trace Optimization:
   • Efficient Routing: Optimize the component placement and routing to minimize trace lengths and avoid vias which can add to manufacturing complexity and costs.

1. Component Packaging:
   • Standard Packages: Use components with standard packaging to reduce assembly costs. For example, SMD components are generally cheaper to assemble than through-hole components.
2. Vendor Quotes:
   • Multiple Quotes: Get quotes from multiple manufacturers and assembly houses to find the most cost-effective option.
3. Panelization:
   • Optimal Panelization: Efficient panelization of the PCBs can minimize the waste and reduce per-unit manufacturing costs.

1. Licensed Designs:
   • Open Source Components: Utilize open-source designs where possible. This can reduce development cost and time.

• ESP32 to BME680:
  • Connect U2:IO21 to IC2:SDA (shared SDA line for I2C)
  • Connect U2:IO22 to IC2:SCL (shared SCL line for I2C)
• ESP32 to E-Ink Display:
  • Connect U2:IO18 to U3:CLK (SPI Clock)
  • Connect U2:IO23 to U3:SDI (SPI Data Input)
  • Connect U2:IO5 to U3:CS (SPI Chip Select)

• The chosen alternatives meet the project requirements in performance and reliability.
• Bulk ordering discounts are significant enough to justify larger up-front costs.

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• The project is a smart thermostat with WiFi connectivity, mainly for environmental monitoring.
• Components include an ESP32 module for WiFi, a BME680 sensor for environmental data, an E-ink display for the user interface, and an encoder for user input.
• The system requires power management to handle both USB and battery power sources.
• A movement sensor (PIR sensor) is included.

• ARM Cortex-M3 core capable of running up to 72 MHz.
• A range of low-power modes, which is beneficial for battery-operated devices.
• 64 KB Flash memory and 20 KB RAM.
• Rich peripheral set including I2C, SPI, USART, ADC, and timers which can support the interfacing needs for the display, sensors, and communication modules.
• Advanced control peripherals including PWM channels and GPIOs for user interface elements like buttons or LEDs, suitable for controlling the encoder and potentially managing power modes.

1. Processing Needs: The STM32F103C8T6 offers a 32-bit ARM Cortex-M3 core, which provides sufficient computational power for real-time processing of environmental data from the BME680 and handling WiFi connectivity tasks. Considering the complexity of sensory data analysis and potential future firmware updates that could introduce more sophisticated features, the processing capabilities are justified.
2. Peripheral Usage: The STM32F103C8T6's variety of communication peripherals (I2C, SPI, USART) aligns well with the project requirements. The E-ink display, encoder, BME680 sensor, and ESP32 WiFi module all can be interfaced with these peripherals. This is a point of suitability rather than overspecification.
3. Power Management: This MCU supports various power-saving modes, essential for a device that might be battery-operated. The efficiency of power management is a critical feature that matches well with the project's needs, considering it targets both USB and battery power sources.
4. Memory Capacity: For a smart thermostat, the Flash and RAM specifications are more than adequate for the firmware demands and potential local data logging before sending to a server or cloud service.
5. I/O and Sensor Integration: This MCU's GPIO availability and analog inputs provide ample support for interfacing with additional sensors, input devices, and future expandability of the thermostat.

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1. J9 (U.FL-R-SMT-1 by Hirose Electric Co Ltd)
2. J4, J2, J5, J6 (B2B-PH-K-S(LF)(SN) by JST Sales America)
3. J1, J7, J3, J8 (Unspecified, custom license)
4. USB1 (TYPE-C-31-M-12 by Korean Hroparts Elec)

• Typically used for RF connections.
• Replacements: Ensure compatibility with U.FL for high-frequency signals.

• Widely used for low-current, general-purpose connections.

• These lack specific details and could be anything from headers to custom connectors.

• Commonly used in modern designs for USB interfacing.

• Replacement Connectors:
  • Hirose U.FL: Continue using for RF (don't replace due to its specific use-case).
  • Generic Connectors (like on J1, J3, J7, J8): Replace with JST PH where appropriate.
  • For USB interfacing, continue using USB Type-C or consider a Micro-USB or Mini-USB if size reduction is essential.

• For High-Frequency Signals:
  • Keep U.FL-R-SMT connectors for critical RF connections.
• For General Connections:
  • Replace any custom or undefined connectors with JST PH connectors.
  • Example replacement suggestions:
    • J1, J3, J7, J8: Replace with JST PH 2.0mm connectors, ensure pin count matches.
    • Board interfaces that handle typical low current/voltage signals/links.
• For USB Connectivity:
  • USB1: Consider maintaining the Type-C connector due to its versatility and compact nature.

1. Review existing connections and identify where JST PH connectors can replace generic/custom connectors without impacting functionality.
2. Update the Bill of Materials (BOM) accordingly.
3. Ensure that mechanical constraints, especially regarding the board layout/spacing, are compatible with the new connectors.

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• J1
  • Pins: 1 (name: 1), 2 (name: 2), 3 (name: 3), 4 (name: 4)
  • Total Pins: 4
• J7
  • Pins: 1 (name: Pin_1), 2 (name: Pin_2), 3 (name: Pin_3), 4 (name: Pin_4), 5 (name: Pin_5), 6 (name: Pin_6)
  • Total Pins: 6
• J3
  • Pins: 1 (name: Pin_1), 2 (name: Pin_2), 3 (name: Pin_3), 4 (name: Pin_4), 5 (name: Pin_5), 6 (name: Pin_6)
  • Total Pins: 6
• J8
  • Pins: 1 (name: Pin_1), 2 (name: Pin_3), 3 (name: Pin_5), 4 (name: Pin_7), 5 (name: Pin_9), 6 (name: Pin_10), 7 (name: Pin_8), 8 (name: Pin_6), 9 (name: Pin_4), 10 (name: Pin_2)
  • Total Pins: 10

• JST PH Series Connectors: Available in various pin counts.
• Standard 6-Pin JST PH Connector: We can use the 6-pin connector as a standard for J1, J3, J7, and individually verify if pin reduction or pin usage streamlining is possible.

• Option 1: Use a 6-pin connector and only wire up the necessary 4 pins.
• J1 Pin Assignment:
  • Pins 1 to 4 connected.

• Option 2: Keep as is but ensure the 6-pin connector matches other connectors’ series.
• J7 Pin Assignment:
  • Pins 1 to 6 connected.

• Option 3: Keep as is but ensure the 6-pin connector matches other connectors’ series.
• J3 Pin Assignment:
  • Pins 1 to 6 connected.

• Option 4: If possible, try to reassign or rethink the pin usage to fit within a 6-pin connector.
• If 10 pins are mandatory, we have to use the 10-pin version but align it with the overall JST PH series.

1. Assess Pin Usage:
   • For J1, reassign connections to fit a 6-pin connector if possible.
   • For J8, consider combining signals or optimizing connections to fit within the 6-pin format, if this impacts functionality minimally.
2. Update BOM:
   • Replace J1, J3, J7 connectors with the same MPN for JST PH 6-pin connectors.
   • Keep or order a 10-pin JST PH connector for J8 if consolidation isn’t feasible.

• JST PH 6-Pin Connector: Streamlined part for easier bulk ordering.

• Evaluate alternative connections: Aim for the 6-pin format if possible, else maintain 10-pin format.

• Update the schematic: Ensure that J1, J3, J7, and J8 use standardized connectors.
• Verify functional integrity: Double-check that the pin reassignment doesn’t affect circuit performance.

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• General Review: Capacitors appear to have a tolerance mostly around 5% which is typical. For critical applications where exact capacitance values are crucial, you might take a closer look.
  • C12: 0.1µF, 0.1% tolerance. This high precision might be unnecessary unless the capacitor is in a timing-critical circuit.
  • C57, C13, C42, etc.: Most capacitors have a 5% tolerance. Depending on their use, a ±10% tolerance could be sufficient and more cost-effective.
  • C7: Has an operating voltage of 150V, which may be over-specified if your typical voltages do not approach this level. Consider something around 25V if that's more suitable.

• General Review: Most resistors are specified with typical resistances (e.g., 10kΩ, 1kΩ) and tolerances which are probably adequate.
  • R13: 5.25kΩ may be a specific requirement, but if not, standardizing to 5.1kΩ or 5.6kΩ could reduce costs.
  • R41: 10k 1% tolerance. Unless you need this precision, consider ±5% to reduce cost.

• General Review: The ICs chosen such as ESP32, STM32, and BME680, while excellent components, have areas where you might look to reduce performance if cost is a significant factor.
  • ESP32 $U_2$: An excellent choice with a myriad of functionality, ensure each feature is necessary for your design. For example, if Bluetooth or dual cores aren't required, there may be a cheaper variant available.

• General Review: Review if the specifications match actual needs.
  • L1: 2.2µH, which is a standard inductor value, ensure that the current rating and tolerance meet but do not exceed needs.

• Diodes (e.g., D1 and D3): 1N5819 is a Schottky diode with a 40V reverse voltage rating. If 40V is more than necessary, consider alternatives such as 20V or 30V diodes.
• Switches and Buttons: Ensure the current and voltage ratings, as well as the physical size, are aligned with actual usage scenarios.

• C12: 0.1μF, 0.1% tolerance - unless there's a critical reason, a tolerance of 5% or 10% should suffice.
• C7: 150V - review your supply voltage; 20V capacitors could be enough.
• R41: 10kΩ, 1% - consider 5% tolerance if precision is not crucial.
• STM32 $U_7$: Have a review if a simpler MCU might meet the requirements or if features like low-power or connectivity are essential.

1. Capacitance Tolerances: Many capacitors with tighter tolerances (≤5%) might be relaxed to 10% in non-critical paths.
2. Tolerance on Resistors: Assess if 1% tolerance resistors can be relaxed to 5% for non-precision applications.
3. Voltage Ratings: Downrate capacitors from 150V to 25V when system voltage max will be much lower.

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• C12 is connected to the net cde1afa2d5ff6866f7e7de8907029bee.
• Members of this net:
  • cde1afa2d5ff6866f7e7de8907029bee
  • R29$$(P1)$$
  • +3V3$$(P1)$$
  • +3V3$$(P1)$$
  • R20$$(P1)$$
  • +3V3$$(P1)$$
  • C12$$(P1)$$
  • +3V3$$(P1)$$
  • ...

• Power Supply Filtering: If C12 is used for decoupling or filtering on the power supply line (+3V3), its primary purpose is to smooth out voltage fluctuations and noise. In these cases, tight tolerance (e.g., 0.1%) is usually not required. Capacitors in power supply lines can typically have tolerances in the range of 5% to 20% without compromising functionality.

• Change C12 to a 0.1µF capacitor with a tolerance of 5% or 10%. This should be sufficient for its role in power supply decoupling or filtering.

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• ESP32-WROOM-32E (U2): This module is known for its good performance in terms of both WiFi and Bluetooth capabilities. However, it’s always good to explore potential alternatives.

• Pros: Very cost-effective, supports WiFi
• Cons: No Bluetooth, slightly lower processing power
• Modules: ESP-01, ESP-12E

• Pros: Combines WiFi with microcontroller functionality, relatively cost-effective
• Cons: Raspberry Pi brand may carry a slight premium
• Modules: Raspberry Pi Pico W

• Pros: Combined Bluetooth and basic WiFi capabilities, Low power consumption
• Cons: Might be more costly than ESP8266 but competitive with ESP32
• Modules: nRF52840 Dongle

• Pros: Combines WiFi and Bluetooth (LE), lower cost compared to ESP32-WROOM-32E, Espressif's brand reliability
• Cons: Limited peripherals compared to ESP32-WROOM-32E
• MPN: ESP32-C3-WROOM-02

• Pros: A simplified version of ESP32 with good performance for WiFi, Integrated hardware crypto-acceleration
• Cons: No Bluetooth
• MPN: ESP32-S2-WROOM

• Pros: Combines Bluetooth 5.0 and powerful ARM Cortex-M4 in a single module
• Cons: Slightly more expensive but offers high performance
• Modules: STM32WB5MMG

1. We'll assume that WiFi and potential Bluetooth functionalities are critical to your design.
2. Cost-effective here means a reasonable trade-off between performance, availability, and price.

1. Choose an Alternative Module: Decide whether to stick with the ESP32-WROOM-32E or switch to a cost-effective alternative like ESP8266 or Raspberry Pi Pico W.
2. Integrate an Integrated Module: Consider replacing separate modules with a single integrated module like ESP32-C3 for design simplification and cost savings.

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1. R14: Change from 31.23kΩ to 30kΩ to merge with R43 and decrease unique resistors. Components reduced: 1.
2. R11: Change from 2.2kΩ to 2.0kΩ. Components reduced: 1.
3. R13: Change from 5.25kΩ to 4.7kΩ to merge with R6 and decrease unique resistors. Components reduced: 1.
4. R16: Change from 680kΩ to 470kΩ to merge with R22 and decrease unique resistors. Components reduced: 1.
5. R36: Change from 100Ω to 10kΩ to merge with other resistors of the same value. Components reduced: 1.
6. R23: Change from 470Ω to 4.7kΩ to merge with R5 and decrease unique resistors. Components reduced: 1.

1. C46: Change from 2.2µF to 10µF to merge with other capacitors of the same value. Components reduced: 1.
2. C51: Change from 200pF to 100pF to merge with other capacitors of the same value. Components reduced: 1.
3. C54: Change from 0.01µF to 0.1µF to merge with other capacitors of the same value. Components reduced: 1.
4. C53: Change from 10pF to 100pF to merge with other capacitors of the same value. Components reduced: 1.
5. C24: Change from 3.3nF to 1nF to merge with other capacitors of the same value. Components reduced: 1.

1. L1: Change from 2.2µH to 10µH to standardize to more common values. Components reduced: 1.

• Total number of resistors reduced: 6
• Total number of capacitors reduced: 5
• Total number of inductors reduced: 1

nico

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1. R11 Connection:
   • R11: P1 is connected to the node "LED1: A," which is the anode of an LED.
   • R11: P2 is connected to the power net "+3V3."
2. R11 Purpose:
   • R11 is a current-limiting resistor for an LED (LED1). It limits the current flowing through the LED to prevent it from burning out. Calculating the resistor value involves Ohm's law: $R = \frac{V_{supply} - V_{LED}}{I_{LED}}$
   • Assuming a forward voltage drop ($V_{LED}$) of 2V for the LED and a desired current ($I_{LED}$) of 10mA, the actual value can be calculated.
3. Consequence of Changing R11 from 2.2kΩ to 2kΩ:
   • If the supply voltage is $3.3V$ and the LED forward voltage is approximately $2V$: $Current = \frac{V_{supply} - V_{LED}}{R} = \frac{3.3V - 2V}{2.2k\Omega} \approx 0.59mA$
   • Changing R11 to $2k\Omega$: $Current = \frac{3.3V - 2V}{2k\Omega} = \frac{1.3V}{2k\Omega} \approx 0.65mA$
   • This change would slightly increase the current through the LED, making it brighter. However, the difference in brightness would be small and safe for typical LEDs.

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1. U2: ESP32-WROOM-32E $QFN$ package; typically available in modules with pin headers but is a $QFN$ package internally.
2. U4: BQ25895RTWT $24-QFN$
3. U6: SN74LS04DR $14-QFN$, $14-SOIC$ are more common for this part
4. U7: STM32F103C8T6 $48-QFN$, $48-LQFP$ available
5. IC2: BME680 $8-QFN$
6. IC1: CH340C $16-QFN$
7. IC3: PCM5102 $20-QFN$
8. Q1, Q2: BSS138 $SOT-23$ is the leaded version, not direct but commonly used due to similar form factor

• No BGA packages were identified directly in the provided information.

• D1, D2, D3: 1N5819HW-7-F $SOD-123$ which is a leadless small outline package

1. ESP32-WROOM-32E $U2$:
   • Alternatives: Module with pin headers $ESP32\ Dev\ Kits$, though typically more expensive due to added convenience.
2. BQ25895RTWT $U4$:
   • Leaded Equivalent: BQ25895 in $TSSOP$ which is leaded. $TSSOP$ packages are also compact but cost significantly less on PCB assembly.
3. SN74LS04DR $U6$:
   • Leaded Equivalent: 74LS04 in DIP or $SOIC$ package. $SOIC$ is typically much easier to handle than $QFN$ and usually cheaper to assemble.
4. STM32F103C8T6 $U7$:
   • Leaded Equivalent: $48-LQFP$ is a common package that is leaded and easier to solder.
5. BME680 $IC2$:
   • Leaded Equivalent: No direct leaded equivalent; sensor ICs like this are typically in $QFN$ to maintain compact size. But look for modules that integrate the sensor with communication headers.
6. CH340C $IC1$:
   • Leaded Equivalent: CH340G in a $16-SOP$ $Standard\ Small\ Outline\ Package$
7. PCM5102 $IC3$:
   • Leaded Equivalent: PCM5102A in $TSSOP-20$ package.
8. BSS138 $Q1, Q2$:
   • Leaded Equivalent: Use $SOT-23$ package which is also industry-standard and easier to handle than a leadless package.
9. 1N5819HW-7-F $D1, D2, D3$:
   • Leaded Equivalent: 1N5819 in $DO-41$ package $through-hole$ or $DO-214$ package $leaded\ SMT$.

• U4: Switch from $BQ25895RTWT$ to $BQ25895$ in $TSSOP$.
• U6: Switch from $SN74LS04DR$ to $74LS04$ in $SOIC$.
• U7: Switch from $STM32F103C8T6$ in $QFN$ to $STM32F103C8T6$ in $LQFP$.
• IC1: Switch from $CH340C$ to $CH340G$ in $SOP$.
• Q1, Q2 $BSS138$: Switch to $BSS138$ in $SOT-23$.
• Diodes $D1, D2, D3$: Switch to 1N5819 in $DO-214$ package.

• Board space requirement: Leaded packages are typically larger.
• Performance: Check if thermal performance and electrical characteristics remain within acceptable limits.
• Availability: Ensure that leaded package variants are readily available in your supply chain.

• Make a decision based on available PCB space, the criticality of performance for specific signal paths, and manufacturing cost optimization.
• Update the schematic and $BOM$ with new designators and verify footprint compatibility on the PCB.

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1. ESP32-WROOM-32E (U2)
2. BME680 (IC2)
3. TL072CDT (U5)
4. 1N5819HW-7-F (D1, D3)
5. STM32F103C8T6 (U7)
6. MH2029-300Y (FB1, FB2)
7. CH340C (IC1)
8. BQ25895RTWT (U4)
9. SPH0645LM4H-B (MK1, MK2)
10. PTS815 SJM 250 SMTR LFS (SW3, SW4, SW5)
11. NX3215SA-32.768K-EXS00A-MU00003 (X1)
12. AMS1117-3.3 (U1)
13. PCM5102 (IC3)
14. APDS-9960 (U10)
15. IRA-S230ST01 (PIR1)
16. BSS138 (Q1, Q2)
17. U.FL-R-SMT-1 (J9)
18. B2B-PH-K-S(LF)(SN) (J2, U10)
19. MGM240SA22VNA2 (U9)
20. HTEW0154T8 (U3)
21. EC12D1564402 (SW2)
22. Various Resistors and Capacitors

1. EC12D1564402 (SW2) - THT Rotary Encoder

1. ALPS ALPINE EC11E-SERIES SMT Rotary Encoder
   • MPN: EC11E15344A8
   • Description: Compact SMT rotary encoder from ALPS with similar functionality.
2. Bourns PEC11L-4020F-S0018 SMT Rotary Encoder
   • MPN: PEC11L-4020F-S0018
   • Description: Bourns rotary encoder with SMT packages.

• Resistors (THT to SMT):
  • THT Example: 1/4W Axial Resistors
  • SMT Alternatives: 0603, 0805, 1206 package resistors
• Capacitors (THT to SMT):
  • THT Example: Electrolytic Capacitors
  • SMT Alternatives: MLCCs in 0603, 0805, 1206 package capacitors

1. 10uF: Capacitors like C1 (THT) can be replaced with 0805 package - GRM21BR60J106KE43L (Murata)
2. 0.1uF: Capacitors like C2 (THT) replaced with 0603 package - C1608X7R1H104K080AA (TDK)
3. 22uF: Capacitors like C3 (THT) replaced with 1210 package - GRM32DR60J226ME19 (Murata)

1. 10kΩ: Resistors can be replaced with 0603 package - RC0603FR-0710KL (Yageo)
2. 100kΩ: Resistors in THT like R20 (THT) replaced with 0805 package - CRCW0805100KFKEA (Vishay)
3. 1kΩ: Resistors 1k THT Example replaced with 0603 package - ERJ-3EKF1001V (Panasonic)

1. Inductance values: THT Inductor Example replace with Inductors 0603 package - M12P50601-180MS (Coilcraft)

1. NPN/PNP TO-92 Package: Instance Q1/Q2 THT can be SMT SOT-23 package, BSS84 (P-Channel), BSS138 (N-Channel)

• Identify manufacturers for resistors/capacitors from packages 0603, 0805, and 1206 compatible footprints should satisfy design equivalence for replacements.

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• Temperature Range:
  • Operational: 0°C to 50°C
  • Storage: -20°C to 70°C
• Humidity Range:
  • Operational: 20% to 90% RH (non-condensing)
  • Storage: 10% to 95% RH (non-condensing)

• IPC-2221B: Generic Standard on Printed Board Design.
• IPC-6012: Qualification and Performance Specification for Rigid Printed Boards.
• RoHS Compliance: Restriction of Hazardous Substances for environmental safety.

• A single power supply line predominantly at 3.3V.
• Decoupling capacitors for power stability.
• Signal integrity for high-speed SPI/I2C interfaces.

• Properties:
  • Thermal expansion: 14-18 ppm/°C
  • Glass transition temperature (Tg): Typically around 130°C to 140°C
  • Flame resistance rating: UL94-V0
  • Commonly available and cost-effective.

1. Top Layer: Signal and Power
2. Core: Dielectric material (FR-4)
3. Bottom Layer: Ground and additional signals

• JLCPCB
• PCBWay
• Seeed Fusion
• Osh Park

1. Environmental Operating Conditions:
   • Temperature: 0°C to 50°C (operational), -20°C to 70°C (storage)
   • Humidity: 20% to 90% RH (operational), 10% to 95% RH (storage)
2. Standards Compliance:
   • IPC-2221B
   • IPC-6012
   • RoHS Compliance
3. PCB Stackup:
   • Material: FR-4
   • Stackup: 2-layer (Top: Signal/Power, Core: FR-4 Dielectric, Bottom: Ground/Signal)
   • Cost-effective manufacturers