Part Data Review and Verification
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Looking for "Device overview, ordering information, package option, and package pin count for AM2434BSEFHIALVR" in am2434
Looking for "Absolute Maximum Ratings table for AM2434" in am2434
Looking for "Recommended Operating Conditions table for AM2434" in am2434
Looking for "Electrical Characteristics table for AM2434 core supplies, IO supplies, ADC, USB, oscillator, reset, and power domains" in am2434
Looking for "Pin Attributes and Signal Descriptions for AM2434 package pins" in am2434
Looking for "Package Information and Mechanical Data for FCBGA package dimensions, ball pitch, body size, and package drawing" in am2434
Looking for "Features section and special features for AM2434 including cores, memory, interfaces, security, safety, and peripherals" in am2434
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Found 1 results.
Looking for "features" in am2434.pdf
Looking for "absolute maximum ratings" in am2434.pdf
Looking for "recommended operating conditions" in am2434.pdf
Looking for "pin descriptions" in am2434.pdf
Looking for "package mechanical data" in am2434.pdf
Looking for "electrical characteristics" in am2434.pdf
Looking for "AM2434BSEFHIALVR package pin count temperature orderable device" in am2434_oa.pdf
Looking for "ALV FCBGA package outline 17.2 mm 0.8 mm 441 mechanical drawing" in am2434.pdf
Looking for "power pins pin attributes table VDD_CORE VDDR_CORE VDDS_DDR VDDSHV0 VDDSHV1 VDDSHV2 VDDSHV3 VDDSHV4 VDDSHV5 VSS" in am2434.pdf
Looking for "USB0_VBUS USB0_ID USB0_DP USB0_DM signal description ball" in am2434.pdf
Looking for "I2C0_SCL I2C0_SDA MCU_I2C0_SCL MCU_I2C0_SDA signal description ball" in am2434.pdf
Looking for "SERDES0_P_RX0 SERDES0_N_RX0 SERDES0_P_TX0 SERDES0_N_TX0 SERDES0_REFCLK0P SERDES0_REFCLK0N signal description ball" in am2434.pdf
Looking for "operating temperature package ALV orderable device AM2434BSEFHIALVR" in am2434.pdf
Part review summary
| Item | Result |
|---|---|
| MPN | AM2434BSEFHIALVR |
| Manufacturer | Texas Instruments |
| Datasheet property present | Yes |
| Official datasheet used | https://www.ti.com/lit/ds/symlink/am2434.pdf |
| Package / orderable option | ALV (FCBGA), 441 pins |
| Package size | 17.2 mm × 17.2 mm |
| Ball pitch | 0.8 mm |
| Temperature grade | -40 to 125 °C |
| Project symbol pin count | 441 terminals |
| Project footprint pad count | 441 pads |
1) Available part information found
| Field | What is present in the part project |
|---|---|
| MPN | AM2434BSEFHIALVR |
| Datasheet URL | https://www.ti.com/lit/gpn/am2434 was set; official PDF resolves to https://www.ti.com/lit/ds/symlink/am2434.pdf |
| Manufacturer | Texas Instruments |
| Description | Project description contains the MPN and package/manufacturing notes |
| Package evidence | Datasheet + TI part page identify ALV FCBGA, 441 pins |
| Pin count evidence | BOM shows 441 terminal instances; footprint inspection shows 441 pads |
| Symbol style | Multi-unit terminalized symbol, one terminal per ball/signal |
| Footprint style | Single footprint with one pad per ball ID |
No update was needed because a datasheet URL was already set on the part.
3) Datasheet metadata summary
Device features
| Category | Summary |
|---|---|
| CPU | Up to 2× dual-core Arm Cortex-R5F clusters at up to 800 MHz and 1× Cortex-M4F at up to 400 MHz |
| On-chip memory | Up to 2 MB OCSRAM with ECC |
| External memory | DDR subsystem supports LPDDR4 / DDR4, 16-bit bus, up to 1600 MT/s, inline ECC |
| Industrial networking | 2× PRU_ICSSG, up to 2 Ethernet ports per subsystem, multiple industrial protocol support |
| Connectivity | 6× I2C, 9× UART, 7× SPI, 3× GPIO, 2× MCAN, USB 3.1 DRD, PCIe Gen2, SERDES |
| Storage / boot | MMCSD/eMMC, OSPI/QSPI, parallel flash, UART, I2C, USB, PCIe, Ethernet boot support |
| ADC | 12-bit ADC, up to 4 MSPS, 8 analog inputs |
| Safety / security | Secure boot, crypto acceleration, watchdogs, BIST, ECC/parity, IEC 61508 support up to SIL 3 systematic capability, SIL 2 hardware integrity |
| Power features | Simplified sequencing, dual-voltage IO, integrated SDIO LDO, voltage supervisor, glitch detector |
Absolute maximum ratings
| Rail / class | Absolute max |
|---|---|
| 0.85 V rails such as VDD_CORE, VDDR_CORE, VDD_MMC0, VDD_DLL_MMC0, VDDA_0P85_* | -0.3 V to 1.05 V |
| DDR IO rails VDDS_DDR, VDDS_DDR_C | -0.3 V to 1.57 V |
| 1.8 V analog rails, VMON_1P8_*, VPP | -0.3 V to 1.98 V |
| 3.3 V IO / analog rails VDDSHV*, VDDA_3P3_* | -0.3 V to 3.63 V |
| USB0_VBUS | -0.3 V to 3.6 V |
| USB0_ID | -0.3 V to 3.6 V |
| Storage temperature | -55 °C to 150 °C |
| Latch-up test | -100 mA to +100 mA |
Recommended operating conditions
| Rail / condition | Recommended range |
|---|---|
| VDD_CORE, VDDR_CORE, VDD_MMC0, VDD_DLL_MMC0, VDDA_0P85_* | 0.81 V / 0.85 V / 0.895 V |
| VDDS_DDR, VDDS_DDR_C at 1.1 V mode | 1.06 V / 1.1 V / 1.17 V |
| VDDS_DDR, VDDS_DDR_C at 1.2 V mode | 1.14 V / 1.2 V / 1.26 V |
| 1.8 V rails including VDDS_MMC0, VDDS_OSC, VDDA_MCU, VDDA_PLL*, VDDA_ADC0, VDDA_1P8_, VDDA_TEMP | 1.71 V / 1.8 V / 1.89 V |
| 3.3 V rails including VDDA_3P3_USB0, VDDA_3P3_SDIO, VMON_3P3_* | 3.135 V / 3.3 V / 3.465 V |
| VDDSHV5 in 1.8 V mode | 1.71 V / 1.8 V / 1.89 V |
| VDDSHV5 in 3.3 V mode | 3.135 V / 3.3 V / 3.465 V |
| Junction temperature | -40 °C to 125 °C industrial, -40 °C to 105 °C extended industrial |
Electrical characteristics extracted
| Interface class | Key values found |
|---|---|
| I2C / fail-safe IO, 1.8 V mode | VIH 0.7 × VDD to 1.98 V, leakage ±10 µA, IOL 10 mA |
| I2C / fail-safe IO, 3.3 V mode | VIH 0.7 × VDD to 3.63 V, leakage ±10 µA, VOL 0.4 V, IOL 10 mA |
| IO behavior note | Only specific pins are fail-safe; all others must stay within their powered IO rail limits |
The datasheet organizes pins by:
- Signal name
- Signal type:
I,O,OD,IO,IOD,IOZ,OZ,A,PWR,GND,CAP - Description
- Ball
From the part project, the symbol already encodes:
- Ball IDs such as
AA5,K9,T14 - Pin electrical type, for example power, input, output, bidirectional
- Signal names matching the datasheet naming style
Package / mechanical data
| Item | Value |
|---|---|
| Package code | ALV |
| Package type | FCBGA |
| Pin count | 441 |
| Body size | 17.2 mm × 17.2 mm |
| Pitch | 0.8 mm |
| Variant note | Lidded flip-chip ball grid array |
Checks performed
| Check | Result | Risk |
|---|---|---|
| MPN vs package family | Pass - orderable device matches TI ALV package | Low |
| Pin count | Pass - symbol exposes 441 terminals and footprint has 441 pads | Low |
| Ball naming convention | Pass - symbol pin numbers are BGA ball IDs and footprint pads use same ball IDs | Low |
| Signal naming consistency | Pass - terminal names align with TI datasheet signal naming style | Low |
| Power / ground exposure | Pass - all major rail groups and many ground balls are represented | Low |
| Missing nets in part project | Expected for a part definition | None |
| Explicit package property in project metadata | Not clearly exposed in BOM output | Medium documentation risk only |
Mismatches / issues flagged
| Issue | Severity | Why it matters |
|---|---|---|
| No clear standalone package property surfaced in the part metadata output | Medium | Could make automated review or downstream verification harder, even though the MPN and footprint clearly imply ALV/441 |
| I could not extract the full ALV mechanical drawing page text directly from the PDF scan | Low | I still verified the package family, pin count, size, and pitch from TI sources, but not every drawing callout dimension was recoverable in text |
Manufacturing / ordering risk assessment
| Area | Assessment |
|---|---|
| Wrong package ordered | Low risk - MPN and TI orderable-device data both indicate ALV FCBGA 441 |
| Symbol-to-footprint pin swap | Low risk - symbol pin numbers and footprint pad IDs use the same ball codes |
| Missing / extra balls | Low risk - counts match at 441 |
| Board failure from gross pinout mismatch | Low risk based on current cross-check |
| Remaining caution | The final manufacturing-critical check still depends on full land pattern geometry, solder mask, and courtyard being correct to TI’s ALV package drawing; this output confirms pin identity/count/package match, not every pad dimension |
- The part project is substantially consistent with the TI definition for AM2434BSEFHIALVR.
- I found no pin-count mismatch, no ball-ID mismatch, and no obvious symbol/footprint mismatch likely to cause incorrect ordering or immediate pinout failure.
- The main improvement I’d recommend is making sure the package metadata is explicitly captured as ALV / FCBGA / 441-pin / 17.2 mm × 17.2 mm / 0.8 mm pitch in the part properties for easier future audits.
@review check part issues
@project_docs save findings
@datasheet inspect ALV package
@schematic inspect power pins
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