Smart Speaker Carrier Design
Worked
0:16
Started: add 4× M3 mounting holes at a 45 mm radius
Added 4 components
0:03
Added 4x Generic Non-Plated Mounting Hole as Hole1, Hole2, Hole3, Hole4
Worked
0:12
Started: define and add speaker keepout region (Ø 60–65 mm) and mic ring keepout region (Ø 70–80 mm) on the board layout
Worked
0:12
Started: select a standard 4-layer stackup with internal power planes
Worked
0:11
Started: Set project property “stackup” to “Standard 4 Layer” with internal power planes
Updated 1 document property
0:04
Updated 1 document property
Worked
0:08
Started: configure ground fill on designated layers
Worked
0:21
Started: message the user to confirm board outline, keepouts, mounting holes, and stackup before proceeding to component placement
Updated project description
0:05
Updated project description
Worked
0:26
Started: Update the project property “System Architecture” with the full mermaid diagram of the architecture; ensure the “stackup” property is set to “Standard 4 Layer with internal power planes”; and message the user to confirm board outline, keepouts, mounting holes, and stackup.
Updated 2 document properties
0:06
Updated 2 document properties
0:00
Ready.
Reviews
Properties
Pricing & Availability
Distributor | Qty 1 |
|---|---|
Arrow | $15.55–$20.98 |
Digi-Key | $8.62–$16.22 |
LCSC | $20.85–$20.86 |
Mouser | $25.79 |
TME | $1.49 |
Verical | $9.86–$46.19 |
Assets
Assets are files uploaded to this project which can be used in various ways.
Controls
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