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PCB Routing Setup Status
Design Rule Exceptions / Schematic Signoff
Created schematic signoff note documenting the 10 accepted relay
NC ERC exceptions. These pins are normally-closed relay contacts used for joystick pass-through, not no-connect pins.Routing Setup Actions
- Pre-routing board check was run.
- Default routing width was reduced to 0.10 mm with 0.08 mm minimum to make fine-pitch CM4 and DAC pins routeable.
- Pre-routing check improved from 18 warnings to 1 remaining LDC1614 footprint/padstack warning.
- Full auto-route was started after routing setup; it completed and applied 1125 routing nodes.
Routing Result
- Auto-route completed successfully.
- Post-route review still reports 17 remaining airwire items.
- The 10 relay
NCERC exceptions remain visible as ERC errors in the platform review, but are accepted by project signoff and must not block layout.
Important Note on Priority Routing
The available full-board auto-router does not expose a strict staged priority interface for I2C first, then 24V safety, then relay drivers. A targeted I2C route attempt was tried first, but the deterministic pathfinder reported no path for the first I2C segment. The full auto-router was then used after preflight setup.
Remaining Work
- The previous 17 post-route airwires were reduced by replacing the ADS1115 module footprints with verified bare ADS1115IDGST VSSOP-10 ICs and rerouting affected nets.
- The final 2 GND airwires were resolved by configuring the GND plane/fill behavior and rerunning routing.
- Layer 2 / Mid-Layer 1 GND fill is present and assigned to the GND net with stitching density set to 10 mm x 10 mm.
- Layer 3 / Mid-Layer 2 3V3_LOGIC fill is present and assigned to the 3.3V logic/power net.
- Latest DRC no longer reports airwire, dangling-trace, overlapping-copper, or floating-copper errors. The only remaining review items are the already-signed-off relay
NCnormally-closed contact ERC exceptions.
Latest Final DRC Update
- Airwires: clear after stitching CM4 GND to the GND plane and rerouting.
- Dangling traces: clear.
- Overlapping copper: clear.
- Floating copper: clear.
- Layer 2 / Mid-Layer 1: GND fill present and assigned to the GND net; stitching density set to 10 mm x 10 mm.
- Layer 3 / Mid-Layer 2: 3V3_LOGIC fill present and assigned to the 3.3V logic/power net.
- Remaining ERC items: 10 accepted relay
NCexceptions for K1-K8, K11, and K12 joystick pass-through contacts. - Remaining manufacturing-readiness items: generic resistors and CORE-P3 still need manufacturer part numbers before an assembly-ready BOM is clean.
Manufacturing Export Readiness
Fabrication geometry is layout-clean for airwires, dangling traces, overlapping copper, and floating copper. Assembly/manufacturing review is not fully clean yet because many generic resistors and the CORE-P3 substitute connector do not have manufacturer part numbers assigned. Gerber export can be prepared for PCB fabrication, but BOM / pick-and-place should be treated as draft until those MPNs are finalized.
Design Rule Exceptions / Schematic Signoff
Routing Setup Actions
Routing Result
Important Note on Priority Routing
Remaining Work
Latest Final DRC Update
Manufacturing Export Readiness
