Mechanical and signal relocation PCB for an Espressif ESP32-S3-DEVKITC-1-N32R16V development board. The PCB contains no active circuitry; it only relocates signals through copper traces.
Core Requirements
2-layer PCB.
Mount one ESP32-S3-DEVKITC-1-N32R16V using two 1x22 female sockets.
Route every pin straight through 1:1 to two additional 1x22 male headers.
No pin remapping.
No resistors, capacitors, LEDs, voltage regulators, ICs, or other active/support circuitry.
Only copper traces between connectors and test points.
Four M3 mounting holes.
USB-C connector remains accessible.
No copper under USB connector.
Four grouped service test points:
TP1 = 5V
TP2 = 3.3V
TP3 = 3.3V
TP4 = GND
Compact layout while maintaining 2.54 mm connector spacing.
Black solder mask and white silkscreen.
Intended for industrial DIN enclosure mounting.
Required Silkscreen
BayFinder™
BF-SR-PCBv1
Signal Relocation PCB
Revision A
ESP32-S3-DEVKITC-1-N32R16V
No active circuitry.
Verification Criteria
All 44 devkit socket pins connect 1:1 to matching relocation header pins.
No active components or passives in BOM except connectors, sockets, test points, mounting holes.
Service test points connect to the required rails only.
Board has 2 layers, four M3 holes, USB keepout/copper exclusion, and readable silkscreen.
Purpose
Core Requirements
Required Silkscreen
Verification Criteria
Reviews
Documents
BF-SR-PCBv1 Project Specification
Assets
No assets added.
BF-SR-PCBv1
BF-SR-PCBv1 signal relocation PCB for ESP32-S3-DEVKITC-1-N32R16V
Properties
Properties describe core aspects of the project.
Pricing & Availability
Distributor
Qty 1
Controls
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