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Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    KLMBG2JETD-B041 Symbol.svg

    KLMBG2JETD-B041 Symbol.svg

    KLMBG2JETD-B041 SymbolDefault
    153-WFBGA (11.5x13).png

    153-WFBGA (11.5x13).png

    153-WFBGA (11.5x13)Thumbnail
    step

    KLMBG2JETD-B041/KLMBG2JETD-B041.3dshapes/FBGA-153_L13.0-W11.5-H1.1-P0.50_KLMAG1JETD-B041.step

    KLMBG2JETD-B041/KLMBG2JETD-B041 Model3D Model
    kicad_mod

    KLMBG2JETD-B041/KLMBG2JETD-B041.pretty/FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041.kicad_mod

    KLMBG2JETD-B041/KLMBG2JETD-B041 FootprintFootprint

    KLMBG2JETD-B041

    KLMBG2JETD-B041 thumbnail
    32GB eMMC 5.1 FBGA-153 eMMC ROHS KLMBG2JETD-B041 FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041 LCSC Part Number: C2803245 JLCPCB Part Class: Extended Part Manufactured by SAMSUNG(三星半导体) embedded MultiMediaCard Ver. 5.1 compatible.  SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard - Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag, Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, Command Queuing, Enhanced Strobe Mode, Secure Write Protection, HS200, HS400, Field Firmware Update. - Non-supported Features : Large Sector Size (4KB)  Full backward compatibility with previous Multi

    Properties

    SAMSUNG(三星半导体)

    U

    KLMBG2JETD-B041

    C2803245

    FBGA-153_L13.0-W11.5-P0.50_KLMAG1JETD-B041

    eMMC

    Extended Part

    -25℃~+85℃

    2.7~3.6

    V

    eMMC 5.1

    lcsc.com/datasheet/C2803245.pdf

    parametric-v1

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    Controls