okProceed with the plan.
Resolve all copper-fill DRC issues:
Fix overlapping fills, wrong-net assignments, priorities, and clearances
Ensure fills respect zone segregation and intended nets
Do not change schematic intent, only PCB copper logic
Complete the BOM for manufacturing:
Replace all generic parts with real, orderable MPNs
Use conservative, industry-standard parts
Requirements:
Inductor: 8–10 µH, ≥15 A saturation
Output ceramics: 22 µF, ≥25 V, X7R
Output bulk: ≥100 µF, 25–35 V
Input bulk: ≥100 µF, ≥50 V
Passives with correct voltage, power, and temp ratings
Prefer parts that are currently in stock
Keep existing assigned MPNs unchanged for:
U1, U2, U3, Q1, D1, F1
Vendor preference:
Mouser first, Digi-Key second
After changes:
Re-run ERC and DRC
Verify manufacturability and availability