i.MX6 Proje Arayışı
0:54
Preparing project plan instructions.
Analyzing project schematic.
Building the project plan.
Responding to the plan tool.
Finalizing the plan summary.
2:22
Parsing project intents.
Issuing knowledge queries.
Defining PMIC candidates.
Considering PMIC and connector options.
Choosing components for the plan.
Using Knowledge Base Tool.
Preparing execution plan.
- MCIMX6D5EYM10AD, 24 MHz/RTC kristaller, düşük maliyet PMIC (güç IC’lerini tam yüklerinin en fazla %75’iyle seçeceğim), 2 GB için 32‑bit DDR3L (4×8Gb x16, 2 rank), eMMC 16GB ve iki adet 0.5 mm, ~100 pin SOM konnektörü eklenecek.
Started implementing a plan
# Goal
- Design an i.MX6D Dual SOM incorporating the MCIMX6D5EYM10AD SoC, 2 GB of DDR3L memory, and 16 GB eMMC storage. The design should prioritize low cost and high availability, follow datasheet guidelines and proven open-source references, and include PMIC selection and SOM connectors (which will later be finalized by the user).
# Implementation plan
1. SoC, Clocks, and Power
1. Add the MCIMX6D5EYM10AD symbol to the schematic.
2. Add a 24 MHz main crystal oscillator and the RTC crystal.
3. Select a cost-effective PMIC (using a low cost, high availability default from the library) and add it to the schematic. Dimension the power rails and add decoupling capacitors, ensuring that no power IC is used beyond 75% of its rated power.
2. DDR3L Memory Integration
1. Add DDR3L components to achieve 2 GB capacity using a 32-bit bus configuration with four 8 Gb x16 devices arranged in two ranks.
2. Include required VREF circuitry, terminations, and decoupling components.
3. Apply length and impedance matching guidelines per the i.MX6 DDR design recommendations.
3. eMMC Storage Integration
1. Add a 16 GB eMMC component that complies with JEDEC 5.x standards.
2. Connect the eMMC to a USDHC port with proper pull-ups, series options, and decoupling capacitors.
3. Enforce proper clock routing constraints as per datasheet specifications.
4. Boot, Reset, and Debug Design
1. Implement boot strap resistors ensuring eMMC-first boot setup.
2. Add a POR supervisor, ONOFF/POR_B circuitry and configure reset signals.
3. Expose UART and JTAG headers for debug purposes.
5. Carrier Connectors
1. Add two low-cost, widely available 0.5 mm pitch board-to-board connectors (approximately 2 x 100 pins) from the library.
2. Map key interfaces such as USDHC, RGMII, USB, I2C, SPI, GPIO, and power through these connectors.
6. Review and Finalization
1. Run ERC and DRC checks to ensure design correctness.
2. Review parts availability and include notes for layout rules including DDR impedance management and keep-out areas.
3. Update the project description and metadata to reflect these changes.
# Success criteria
- The schematic includes the i.MX6D SoC, DDR3L memory, and eMMC components with proper connections and power regulation.
- Power subsystems and decoupling meet the derating guidelines (not exceeding 75% load on power ICs).
- Boot, reset, and debug circuitry is correctly implemented and mapped to user accessible interfaces.
- Carrier connectors are present and key interfaces are correctly routed for future board-to-board connection.
Started implementing a plan
# Goal
- Design an i.MX6D Dual SOM incorporating the MCIMX6D5EYM10AD SoC, 2 GB of DDR3L memory, and 16 GB eMMC storage. The design should prioritize low cost and high availability, follow datasheet guidelines and proven open-source references, and include PMIC selection and SOM connectors (which will later be finalized by the user).
# Implementation plan
1. SoC, Clocks, and Power
1. Add the MCIMX6D5EYM10AD symbol to the schematic.
2. Add a 24 MHz main crystal oscillator and the RTC crystal.
3. Select a cost-effective PMIC (using a low cost, high availability default from the library) and add it to the schematic. Dimension the power rails and add decoupling capacitors, ensuring that no power IC is used beyond 75% of its rated power.
2. DDR3L Memory Integration
1. Add DDR3L components to achieve 2 GB capacity using a 32-bit bus configuration with four 8 Gb x16 devices arranged in two ranks.
2. Include required VREF circuitry, terminations, and decoupling components.
3. Apply length and impedance matching guidelines per the i.MX6 DDR design recommendations.
3. eMMC Storage Integration
1. Add a 16 GB eMMC component that complies with JEDEC 5.x standards.
2. Connect the eMMC to a USDHC port with proper pull-ups, series options, and decoupling capacitors.
3. Enforce proper clock routing constraints as per datasheet specifications.
4. Boot, Reset, and Debug Design
1. Implement boot strap resistors ensuring eMMC-first boot setup.
2. Add a POR supervisor, ONOFF/POR_B circuitry and configure reset signals.
3. Expose UART and JTAG headers for debug purposes.
5. Carrier Connectors
1. Add two low-cost, widely available 0.5 mm pitch board-to-board connectors (approximately 2 x 100 pins) from the library.
2. Map key interfaces such as USDHC, RGMII, USB, I2C, SPI, GPIO, and power through these connectors.
6. Review and Finalization
1. Run ERC and DRC checks to ensure design correctness.
2. Review parts availability and include notes for layout rules including DDR impedance management and keep-out areas.
3. Update the project description and metadata to reflect these changes.
# Success criteria
- The schematic includes the i.MX6D SoC, DDR3L memory, and eMMC components with proper connections and power regulation.
- Power subsystems and decoupling meet the derating guidelines (not exceeding 75% load on power ICs).
- Boot, reset, and debug circuitry is correctly implemented and mapped to user accessible interfaces.
- Carrier connectors are present and key interfaces are correctly routed for future board-to-board connection.
Working...
Show Plan
Reviews
- Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portaljharwinbarrozo43.0M
- Wirelessly connects power nets on schematic. Identical to the net portal, but with a power symbol. Used to organize schematics and separate functional blocks. To wirelessly connect power net portals, give them the same designator. #portal #powerjharwinbarrozo11.4M
- A generic fixed resistor for rapid developing circuit topology. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard resistor values: 1.0Ω 10Ω 100Ω 1.0kΩ 10kΩ 100kΩ 1.0MΩ 1.1Ω 11Ω 110Ω 1.1kΩ 11kΩ 110kΩ 1.1MΩ 1.2Ω 12Ω 120Ω 1.2kΩ 12kΩ 120kΩ 1.2MΩ 1.3Ω 13Ω 130Ω 1.3kΩ 13kΩ 130kΩ 1.3MΩ 1.5Ω 15Ω 150Ω 1.5kΩ 15kΩ 150kΩ 1.5MΩ 1.6Ω 16Ω 160Ω 1.6kΩ 16kΩ 160kΩ 1.6MΩ 1.8Ω 18Ω 180Ω 1.8KΩ 18kΩ 180kΩ 1.8MΩ 2.0Ω 20Ω 200Ω 2.0kΩ 20kΩ 200kΩ 2.0MΩ 2.2Ω 22Ω 220Ω 2.2kΩ 22kΩ 220kΩ 2.2MΩ 2.4Ω 24Ω 240Ω 2.4kΩ 24kΩ 240kΩ 2.4MΩ 2.7Ω 27Ω 270Ω 2.7kΩ 27kΩ 270kΩ 2.7MΩ 3.0Ω 30Ω 300Ω 3.0KΩ 30KΩ 300KΩ 3.0MΩ 3.3Ω 33Ω 330Ω 3.3kΩ 33kΩ 330kΩ 3.3MΩ 3.6Ω 36Ω 360Ω 3.6kΩ 36kΩ 360kΩ 3.6MΩ 3.9Ω 39Ω 390Ω 3.9kΩ 39kΩ 390kΩ 3.9MΩ 4.3Ω 43Ω 430Ω 4.3kΩ 43KΩ 430KΩ 4.3MΩ 4.7Ω 47Ω 470Ω 4.7kΩ 47kΩ 470kΩ 4.7MΩ 5.1Ω 51Ω 510Ω 5.1kΩ 51kΩ 510kΩ 5.1MΩ 5.6Ω 56Ω 560Ω 5.6kΩ 56kΩ 560kΩ 5.6MΩ 6.2Ω 62Ω 620Ω 6.2kΩ 62KΩ 620KΩ 6.2MΩ 6.8Ω 68Ω 680Ω 6.8kΩ 68kΩ 680kΩ 6.8MΩ 7.5Ω 75Ω 750Ω 7.5kΩ 75kΩ 750kΩ 7.5MΩ 8.2Ω 82Ω 820Ω 8.2kΩ 82kΩ 820kΩ 8.2MΩ 9.1Ω 91Ω 910Ω 9.1kΩ 91kΩ 910kΩ 9.1MΩ #generics #CommonPartsLibraryjharwinbarrozo1.5M
- A generic fixed capacitor ideal for rapid circuit topology development. You can choose between polarized and non-polarized types, its symbol and the footprint will automatically adapt based on your selection. Supported options include standard SMD sizes for ceramic capacitors (e.g., 0402, 0603, 0805), SMD sizes for aluminum electrolytic capacitors, and through-hole footprints for polarized capacitors. Save precious design time by seamlessly add more information to this part (value, footprint, etc.) as it becomes available. Standard capacitor values: 1.0pF 10pF 100pF 1000pF 0.01uF 0.1uF 1.0uF 10uF 100uF 1000uF 10,000uF 1.1pF 11pF 110pF 1100pF 1.2pF 12pF 120pF 1200pF 1.3pF 13pF 130pF 1300pF 1.5pF 15pF 150pF 1500pF 0.015uF 0.15uF 1.5uF 15uF 150uF 1500uF 1.6pF 16pF 160pF 1600pF 1.8pF 18pF 180pF 1800pF 2.0pF 20pF 200pF 2000pF 2.2pF 22pF 20pF 2200pF 0.022uF 0.22uF 2.2uF 22uF 220uF 2200uF 2.4pF 24pF 240pF 2400pF 2.7pF 27pF 270pF 2700pF 3.0pF 30pF 300pF 3000pF 3.3pF 33pF 330pF 3300pF 0.033uF 0.33uF 3.3uF 33uF 330uF 3300uF 3.6pF 36pF 360pF 3600pF 3.9pF 39pF 390pF 3900pF 4.3pF 43pF 430pF 4300pF 4.7pF 47pF 470pF 4700pF 0.047uF 0.47uF 4.7uF 47uF 470uF 4700uF 5.1pF 51pF 510pF 5100pF 5.6pF 56pF 560pF 5600pF 6.2pF 62pF 620pF 6200pF 6.8pF 68pF 680pF 6800pF 0.068uF 0.68uF 6.8uF 68uF 680uF 6800uF 7.5pF 75pF 750pF 7500pF 8.2pF 82pF 820pF 8200pF 9.1pF 91pF 910pF 9100pF #generics #CommonPartsLibraryjharwinbarrozo1.5M
- A generic fixed inductor for rapid developing circuit topology. *You can now change the footprint and 3D model at the top level anytime you want. This is the power of #genericsjharwinbarrozo15.5k
- An electrical connector acting as reusable interface to a conductor and creating a point where external circuits can be connected.Terminal
- 47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film #forLedBlinkjharwinbarrozo1.2M
- 10uF Capacitor Aluminum Polymer 20% 16V SMD 5x5.3mm #forLedBlink #commonpartslibrary #capacitor #aluminumpolymer #radialcanjharwinbarrozo1.2M
- Yellow 595nm LED Indication - Discrete 1.7V 1206 (3216 Metric) #forLedBlinkjharwinbarrozo1.1M
Pricing & Availability
Distributor | Qty 1 |
|---|
Assets
BGA624CP80_25X25_2100X2100X160B50N.kicad_mod
FP_BGA624CP80_25X25_2100X2100X160B50NFootprint
MCIMX6D4AVT08ADR.png
MCIMX6D4AVT08ADRThumbnailMCIMX6D5EYM10AD.STEP
3D_MCIMX6D5EYM10AD3D ModelControls
Welcome 👋
Flux helps you build PCBs faster with an AI teammate!
Create your account to collaborate, stay updated, fork your own version, and get instant answers from our AI agent.