Capacitor Specifications and Guidance

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Looking for "Capacitance value and tolerance" in GCM1885C2A151FA16-01.pdf

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Here are the key specs and usage notes for GCM1885C2A151FA16D, sourced directly from Murata’s datasheet.

Key specifications (from Murata datasheet)

Table

Parameter	Value
Capacitance	150 pF
Tolerance	±1%
Rated voltage	DC 100 V
Dielectric / Temp. characteristic	C0G (EIA), 0 ±30 ppm/°C (25 to 125 °C)
Operating temperature range	−55 to +125 °C
Insulation resistance (IR), 25 °C	≥ 10,000 MΩ or 500 Ω·F (whichever is smaller)
Q / DF measurement conditions	Cap/Q/DF measured at 1.0 ±0.1 MHz, 0.5–5.0 Vrms
Q spec (C ≥ 30 pF)	Q ≥ 1000 (at 1 MHz per table conditions)
Size (0603 / 1608 metric)	L 1.6 ± 0.1 mm, W 0.8 ± 0.1 mm, T 0.8 ± 0.1 mm
Qualification	Datasheet states applicability to “Chip MLCCs for Automotive” and includes “AEC‑Q200 Murata Standard Specification and Test Methods”

Design/derating guidance (quoted from the datasheet)

Operating temperature and self-heating
- “The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.”
- For DC rated voltage products less than 100 VDC: “The load should be contained so that the self-heating of the capacitor body remains below 20°C when measuring at an ambient temperature of 25°C.”
- Practical takeaway: Regardless of rating, verify the part’s surface temperature in your actual AC/pulse/RF conditions and keep it within the −55 to +125 °C operating range (including any self-heating).
AC/pulse/high-frequency use
- When used with AC or pulse voltages, “check the self-heating condition” as dielectric loss can generate heat. Confirm the capacitor’s surface temperature remains within limits.
DC-bias and aging notes in the datasheet apply to “high dielectric constant type” capacitors. This part is C0G (Class 1), so the strong DC-bias reduction and aging behavior discussed for Class 2 types (e.g., X7R) are not the concern here. Still measure in-circuit if your environment is extreme.
Mounting/mechanical stress (board flex crack prevention)
- Minimize board bending near the part; orient chips to reduce stress relative to the panel break direction; keep adequate distance from V-grooves/score lines and screw holes; use support pins during test/probing; avoid excessive solder volume that increases crack risk.

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