Component, Material, %/wt
Bond Wire, Copper, 99.9884
Bond Wire, Proprietary Materials, 0.008189
Bond Wire, Iron, 0.000682
Bond Wire, Silver, 0.002047
Die Attach Adhesive, Silver, 81.099945
Die Attach Adhesive, Epoxy, 18.900057
Lead Frame, Copper, 99.25
Lead Frame, Chromium, 0.259999
Lead Frame, Tin, 0.250003
Lead Frame, Zinc, 0.240001
Lead Frame Plating, Nickel, 95.12008
Lead Frame Plating, Gold, 0.780019
Lead Frame Plating, Palladium, 4.099904
Mold Compound, Fused Silica, 90.5
Mold Compound, Carbon Black, 0.499998
Mold Compound, Epoxy, 8.999999
Semiconductor Device, Doped Silicon, 100