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Reviews
TCA9555RGER
Properties
Integrated Circuit
Texas Instruments
TCA9555RGER
U
RoHS,Green
QFN50P500X500X100-29N
Component, Material, %/wt Bond Wire, Copper, 99.9884 Bond Wire, Proprietary Materials, 0.008189 Bond Wire, Iron, 0.000682 Bond Wire, Silver, 0.002047 Die Attach Adhesive, Silver, 81.099945 Die Attach Adhesive, Epoxy, 18.900057 Lead Frame, Copper, 99.25 Lead Frame, Chromium, 0.259999 Lead Frame, Tin, 0.250003 Lead Frame, Zinc, 0.240001 Lead Frame Plating, Nickel, 95.12008 Lead Frame Plating, Gold, 0.780019 Lead Frame Plating, Palladium, 4.099904 Mold Compound, Fused Silica, 90.5 Mold Compound, Carbon Black, 0.499998 Mold Compound, Epoxy, 8.999999 Semiconductor Device, Doped Silicon, 100
Pricing & Availability
Distributor | Qty 1 |
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