USB Sensor Node
Table
| Check Area | Result | Notes |
|---|---|---|
| Board size / placement | Pass | Components fit on 100 × 80 mm board |
| Stackup | Pass | 4-layer stackup confirmed after final board update |
| Component overlap / outside board | Pass | No reported component placement errors in final checked set |
| Airwires | Expected open | Board is placed but not routed; airwires remain until routing phase |
| Overlapping copper | Open issue | 12 errors on U3, U6, and U10 exposed-pad/thermal-mount footprint geometry |
| Missing footprints | Pass | No missing-footprint errors reported |
| BOM availability | Mixed | Main ICs/connectors have MPNs; generic passives/inductors still need final orderable MPNs |
Layout Work Completed
Placement Status
DRC / Layout Checks
Open DRC Issue: Exposed-Pad Footprint Copper
BOM Check Notes
Recommended Next Steps