Yes. Here’s a concise summary of current issues flagged by the design reviews:
Design Rule Check (layout)
Overlapping copper (shorts): Multiple items, including around BT1 pad P1 and areas of U4. Resolve by removing trace overlaps and ensuring proper clearances.
Airwire (unrouted): One missing connection between a fill and IC1 VSS. Complete the route or add a via into the pour.
Manufacturing (BOM completeness)
Missing MPNs (18 parts): Assign real parts or set MPNs for:
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant