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Documents

    Documents are markdown text files which describe project goals, capture details, or even simulation outputs.

    Assets

    kicad_mod

    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm.kicad_mod

    F_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mmFootprint
    step

    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm.step

    3D_HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm3D Model
    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm.png

    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm.png

    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mmThumbnail
    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm

    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm

    defaultDefault

    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm

    HTSSOP-14-1EP_4.4x5mm_P0.65mm_EP3.4x5mm_Mask3x3.1mm thumbnail
    HTSSOP-14-1EP is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.4 mm x 5 mm (L x W) with 14 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with a size of 3.4 mm x 5 mm. The solder mask opening on the EP is approximately 3 mm x 3.1 mm. #part #template

    Properties

    U

    creativecommons.org/licenses/by/4.0/

    Pricing & Availability

    Distributor

    Qty 1

    Controls