HTSSOP-14-1EP is a small surface-mount package commonly used for electronic components. It has a body size of approximately 4.4 mm x 5 mm (L x W) with 14 pins. The lead pitch between the pins is typically 0.65 mm. The package features an exposed pad (EP) with a size of 3.4 mm x 5 mm. The solder mask opening on the EP is approximately 3 mm x 3.1 mm. #part #template