Work completed
- Project description updated and system architecture diagram defined
- All core modules added (MCU, GNSS, LoRa, charger, LDO, USB-C, u.FL, JST-PH) and auxiliary headers/test points placed
- Power subsystem wired: battery → charger → LDO → 3.3 V rail with decoupling capacitors
- USB-C VBUS and CC resistors connected
- MCU UART and SPI nets correctly routed to GNSS and LoRa modules
- SWD and UART debug headers/test points wired
- Status LEDs with series resistors connected
- Schematic reviewed; no missing passives or nets
- PCB outline enlarged, mounting holes added, and board auto-routed
- DRC and ERC cleared (no issues)
- Real MPNs assigned to all passive and active components
Tasks not performed
- Configuring PCB stackup to Standard 2-layer and ground fills
- Footprint verification for all components
- Classifying nets by type and setting proper impedance/trace widths
- Manual component placement refinement
- Finalizing BOM and generating pick-and-place file
- Exporting PDF schematic, Gerber/drill files, and other manufacturing outputs
Success criteria status
- ✅ Schematic completeness and rule-check compliance
- ⚠️ PCB layout exists but lacks controlled impedance routing and refined placement
- ❌ Manufacturing outputs (Gerbers, pick-and-place, PDF schematic) have not been generated
Recommended next step
Proceed with PCB preparation: configure the 2-layer stackup and ground pour, verify footprints, classify nets and set appropriate trace widths (especially for RF paths), then finalize the BOM and export the PDF schematic, Gerbers/drill files, and pick-and-place outputs.