I’ll create a low‑power USB‑C 5 V environmental node with a digital T/RH sensor and a dual‑radio Wi‑Fi/BLE MCU, including robust input protection sized for 0.5–3 A sources.
Plan:
Add MCU, digital T/RH sensor, USB‑C receptacle, 3.3 V regulator, eFuse/load switch, and passives; include bidirectional USB data‑line TVS with capacitance below 1 pF per line.
Implement USB‑C sink (CC pull‑downs), VBUS reverse/OVP/UVLO/OCP, and ESD; size power path for up to 3 A sources.
Power: 5 V to 3.3 V with low quiescent current; observe minimum load requirements; decouple per ICs.
RF/I/O: choose antenna type and keepouts; route I2C with pull‑ups; add programming/status.
Connect nets, run ERC/DRC, and prep placement isolating switcher returns from sensor grounds to prevent ground bounce coupling.
Questions to finalize before I start:
Any preference for antenna (chip, PCB trace, or external connector)?
Target sensor accuracy (for RH/Temp) and measurement cadence?
Size constraints or enclosure considerations? Click Start on the plan bar when ready.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant