Single-Layer PCB Design优化
Started implementing a plan
Goal: Update Camila’s PCB layout to fit within **100mm × 100mm max** and achieve a **fully routed, manufacturable** layout using **bottom-layer-only routing** (no top traces), prioritizing compact placement, short power/ground paths, edge-accessible connectors, minimal crossovers, **zero-via preference**, and **45° routing** where possible.
Work completed
- Resized PCB outline to **100mm × 100mm** and kept **Standard 2 Layer** stackup (pads may exist on both sides; routing will be constrained to bottom).
- Applied board-level manufacturability constraints: **0.25mm keepout/clearance**, **0.25mm min trace width**, **0.25mm min corner radius**.
- Enforced **bottom-layer default** on all nets by setting net routing layer to **Bottom**; strengthened power/return nets (**Net 1, Net 4, Net 7, Net 16, GND**) to **0.5mm trace width / 0.4mm min**, bottom-layer, high auto-layout priority.
- Updated project documentation with the agreed layout constraints and objectives in [Doc 1](https://www.flux.ai/inotreal/camilas-project~7g/files/camila-embedded-system-layout-requirements~sj).
- Verified current layout status: board is extremely dense (component area ~78.6% of 100×100), and **airwires remain** (routing incomplete).
Implementation plan (remaining)
1. Re-optimize PCB component placement for 100mm × 100mm single-layer routing
1. Run automated placement constrained to keep **24V-2A**, **PT100-T1**, **PT100-T2**, and **OLED I2C** on board edges.
2. Cluster the **LM2596 power section** and keep **C1** close to LM2596 output/return loop.
3. Group Arduino UNO (U1) with the LM358 stages (U2, U3) and the Wheatstone/trim network (R*, VR1/VR3) to reduce crossovers for bottom-only routing.
4. If density prevents routing, move small passives to the opposite side (bottom) while keeping connectors accessible and respecting the “no top traces” rule.
2. Configure routing policy for bottom-layer-only autorouting with minimal vias
1. Set autorouter available layers to **Bottom** only and select a strategy that minimizes/avoids vias.
2. Ensure routing style is 45° where supported (via corner radius/angle constraints).
3. Autoroute all nets and validate
1. Run autorouting to achieve **full electrical connectivity** (0 airwires).
2. Run DRC/ERC (at least: airwires, invalid layers, overlaps, missing footprints, acute-angle/corner checks) and fix issues by iterating placement + reroute.
4. Final manufacturability pass
1. Confirm there are **no top-layer traces** (pads allowed; routing must remain bottom).
2. Confirm power/ground routes are short and robust (0.5mm or wider on selected nets) and connectors remain at edges.
Notes / blockers
- Placement optimization tool call failed due to malformed proximity constraint schema (needs `near` and likely `nearPin` if using pin-targeted constraints). Must retry placement with valid constraint structures.
- Board density is flagged CRITICAL at 100×100; may require careful placement and/or bottom-side placement of passives to allow a bottom-only route.
Execution stopped due to insufficient credits.
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