Footprint Verification Request

0:22

Chat History

Project

Below is the summary review of the updated pad dimensions versus your design goals:

Table

Parameter	Target from Datasheet/Design Goals	Updated Value	Assessment
Pad Spacing	3.00 mm (center-to-center)	Unchanged	The pad spacing remains aligned with the datasheet and design goals.
Pad Size X (Width)	Originally set greater (e.g., ~4.25 mm typical) but revised for denser design or specific routing needs	2.5 mm	The updated width of 2.5 mm meets your directive; verify that this width still allows sufficient solder fillet and electrical connectivity based on manufacturing requirements.
Pad Size Y (Length)	As per previous (mechanical drawing)	Unchanged	No changes were made to the length; ensure it still satisfies the datasheet recommendations.

Review Notes:

The reduction of Size X to 2.5 mm appears to achieve a denser layout but should be double-checked for solderability and robustness in the footprint review.
Ensure that the overall solder mask and silkscreen clearances remain acceptable with the new pad width.

If these parameters meet the intended design criteria and manufacturing guidelines, your updated pad dimensions are aligned with your design goals. Please let me know if additional adjustments are required.

387 days

geoffw

Confirm the pad size adjustments in the PCB editor.

387 days

flux

0:11

Chat History

Project

All selected pads now have their Size X property set to 2.5 mm in the PCB editor. This adjustment aligns with your design goals for pad dimensions. Please verify in your PCB editor if the change meets your layout requirements and let me know if any further modifications are needed.

Check Pad Dimensions

Verify Dimensions

Review Pad Changes

387 days

Ready.

A02

BVD1

_WAIT

_REG

_IOWR

A09

D01

BVD2

A01

A07

_RESET

_VS2

_INPACK

A05

Vcc

A06

A08

A04

D08

_WE

A00

_RDY

Vcc

D00

_CSEL

A03

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