DRC / Reroute Blocker Report
Baseline captured
Current board configuration:
- Board outline: 160 mm x 100 mm rectangle, 2 mm corner radius
- Copper layers: 6
- Components: 88 placed components
- Routing objects: 1219 route segments, 151 vias
- Component placement bounding box currently extends slightly beyond the nominal board envelope: about 162.68 mm x 106.61 mm aggregate component bounds.
Active review findings
Latest layout review shows:
- Airwires: 5 errors
- Dangling traces: 6 warnings
- Floating copper: 3 errors
- Overlapping copper: 131 errors
- Invalid layer: no active finding in the targeted baseline
- Missing footprints: no active finding in the targeted baseline
Required remediation sequence
The remediation sequence for this project is:
- Delete stale dangling trace segments first.
- Remove or reroute floating/orphan copper.
- Rip up and reroute overlapping trace regions with preservation of placement, board outline, stackup, and functional zones.
- Route remaining airwires on the existing 6-layer stackup.
- Re-run review until airwires, dangling traces, floating copper, and overlapping copper all report clean.
Current blocker
The current execution environment exposes review, layout inspection, placement, stackup, board size, and rule-editing capabilities, but it does not expose the required trace-deletion or routing operation needed for this task.
Specifically, the next required actions need direct PCB copper editing/routing capability:
- Delete dangling trace UIDs reported by review.
- Remove floating trace/copper islands.
- Rip up/reroute overlapping copper segments.
- Route the remaining 5 airwires.
Without those copper-edit/routing operations, changing placement or rules alone would not satisfy the requirement to preserve the existing placement and functional zoning while resolving the actual route-segment violations.
Manufacturing status
The board is not manufacturing-ready. Routing/copper cleanup must be completed before Gerber, ODB++, or assembly export.