Project Start
Worked for 2 mins 2 sec
Created 2 project docs
Project Specification
Project Specification
Project Overview
- Status: Review
- Device: Two-board thermal imaging platform using an ESP32-S3 main board and an MLX90640BAA 32x24 thermal sensor satellite.
- Purpose: Acquire, process, interpolate, and transmit thermal frames over Ethernet, Wi-Fi, BLE, or native USB.
- Debug-friendly first prototype for indoor integration in an enclosure.
- Sensor is separated from MCU, Ethernet, and power heat sources to reduce thermal measurement bias.
- Main-to-satellite cable length is at most 20 cm.
- Read MLX90640 thermal frames over 3.3 V I2C.
- Process frames on an ESP32-S3.
- Provide 10/100 Ethernet through a W5500 and RJ45 MagJack.
- Accept isolated IEEE 802.3af PoE power and USB-C power.
Power Budget
Power Budget
Scope
Pre-schematic budget for the ESP32-S3 thermal camera main board and MLX90640 satellite. Values are conservative engineering estimates pending confirmation against the exact selected part revisions and datasheets.
3.3 V Loads
Regulator Design Target
- Add approximately 25 percent peak-current engineering margin: 735 mA x 1.25 = approximately 919 mA.
- Select a 3.3 V regulator rated at least 1 A; 1.2-1.5 A is preferred for transient and thermal margin.
- Estimated 3.3 V output power:
- Typical: 3.3 V x 0.406 A = 1.34 W.
- Peak: 3.3 V x 0.735 A = 2.43 W.
For a 5 V to 3.3 V LDO:
- Typical dissipation: (5.0 V - 3.3 V) x 0.406 A = 0.69 W.
- Peak instantaneous dissipation: (5.0 V - 3.3 V) x 0.735 A = 1.25 W.
The Project Specification and Power Budget are created. The review selects a 1.2-1.5 A-class 3.3 V buck instead of a small LDO and flags legacy 500 mA USB operation as a peak-load constraint; I’m now building both schematic sections.
Thought for 5 mins 44 sec
Thought for 35 sec
Created a thread
Two Board Schematic
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Thought for 11 sec
Awaiting 1 background task
Received notification from "Two Board Schematic" that it finished — picking the work back up.
Thought for 6 sec
The executor populated 30 components covering the ESP32-S3, W5500, AG9905-MTB PoE module, USB-C, AP63203 buck regulator, power OR-ing, RJ45, and MLX90640 satellite hardware. I also created the Project Specification and Power Budget files.
Open items
- The project currently reports 0 nets, so the components are not yet electrically wired.
- Both board sections still need connectivity checks, ERC review, and correction.
- The power budget must be reconciled against the exact selected parts.
Execution is paused because no ACUs are currently available. Once ACUs are available, the next action is to wire both sections, verify every power/interface pin, and clear ERC findings before starting PCB layout.
Wire both sections
Check missing essentials
Verify power budget
Check ERC issues
