I’m blocked from executing project changes because the workspace has no remaining execution credits, so I could not add components, consult datasheets, wire the schematic, or run review.
Current project state:
Empty project
0 components
0 nets
No schematic work has been applied yet
Recommended design plan once execution is available:
MCU/radio: low-power Wi-Fi + BLE 5.x module, likely ESP32-C3/S3-class or similar 2.4 GHz 802.11 b/g/n + BLE device with integrated RF front end and antenna keepout.
Sensor: digital temperature/RH sensor over I²C, with local decoupling and pull-ups.
USB-C power input: USB-C receptacle configured for 5 V default sink using CC pull-downs.
Protection/power path:
Reverse-current / reverse-polarity protection
OVP clamp or protected load switch
UVLO thresholding
OCP / current limiting sized for 0.5–3 A USB-C sources
Input TVS / ESD protection
Fuse or eFuse-style protection
Regulation:
Protected 5 V input to efficient 3.3 V rail
Low quiescent-current regulator sized for Wi-Fi transmit bursts
Input/output capacitors per regulator datasheet
Consumer-use details:
USB-C ESD protection
RF antenna keepout
Programming/debug header or USB-UART path
Status LED with high-value resistor or optionally DNI for low power
Clean power/ground partitioning and decoupling at every IC
What remains:
Select exact MCU module, sensor, USB-C connector, protection IC/eFuse, and 3.3 V regulator using datasheets.
Create a power budget including Wi-Fi TX peak current and downstream loads.
Build and wire the schematic.
Add all required decoupling, pull-ups, CC resistors, protection parts, and programming/debug access.
Run ERC/review and fix violations.
After schematic approval, proceed to board sizing, placement, antenna keepout planning, and routing.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant