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1. NFC Functionality: The business card uses an NFC (Near Field Communication) chip, specifically the NT3H2111W0FTTJ, to link to your Flux page. This allows people to tap their NFC-compatible devices to your card and be directed to your online portfolio.
2. Components and Connections:
   • IC1, the NFC chip, is at the heart of this project. It has several pins for power, I2C communication, and an output pin that connects to other parts of the circuit.
   • R5 is a resistor with a resistance of 47 ohms.
   • C16 is a capacitor with a capacitance of 220 nF, likely used for power supply filtering or stability.
   • C15 is another capacitor with a very small capacitance of 7 pF, possibly for RF tuning or decoupling.
3. Visual and Educational Elements: There are notes included in the project design, reminding you to refer to additional resources or instructions, such as adding a QR code (Note 1) and finding modules in the Flux Library (Note 2).
4. Power and Ground Management: The design uses virtual components for power (VCC) and ground (GND) connections to manage the flow of electricity through the components.
5. Design Considerations:
   • The project involves modifications like a 13.56 MHz tuning, which is the standard NFC frequency.
   • Some components and notes are excluded from the BOM and PCB, indicating that they might be placeholders or non-physical elements intended for layout purposes.

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• MCU Boilerplate: This acts as the central component in your schematic, representing the microcontroller connections.
• **NFC IC $NT3H2111W0FTTJ$: The NFC IC connected via I2C to the MCU.
• Power Supply: Represents power and ground connections shared by the components.
• Components: R5, C15, C16, and LED9 are additional components in the schematic. R5, C15, and C16 values are included where applicable.

febrilumanga

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Mermaid
graph TD;

    MCU["MCU BoilerplateUnknown MPN"]
    DC-Reg("DC Regulator")
    NFC[IC1 - "NFC Controller[NT3H2111W0FTTJ](https://www.flux.ai/search?type=components&q=NT3H2111W0FTTJ)"]
    LED["LED9"]
    Resistor[R5 - "Resistor47Ω"]
    Capacitor[C15 - "Capacitor7pF[04025A7R0CAT2A](https://www.flux.ai/search?type=components&q=04025A7R0CAT2A)"]
    Capacitor2[C16 - "Capacitor220nF"]

    %% Connections

    DC-Reg --> MCU
    NFC --> MCU
    NFC --> Resistor
    Resistor --> LED
    Capacitor --> NFC
    Capacitor2 --> NFC

• MCU Boilerplate: This is a generic placeholder block with the essential pins exposed.
• NFC: Communicates with the MCU and might be connected via I2C or a similar interface using the SCL and SDA pins.
• LED9 and R5: Represent a simple LED circuit where R5 acts as a current-limiting resistor.
• Capacitors C15 and C16 are placed as decoupling capacitors around the NFC controller for signal integrity and power stability.

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1. Net GND:
   • Connect IC1:VSS to GND.
   • Connect LED9:K to GND.
   • Connect C16:P1 to GND.
2. Net $IC1 - VOUT$:
   • Connect IC1:VOUT to IC1:VCC, R5:P2, VCC:P1, and C16:P2.
3. Net $LED9 - A$:
   • Connect LED9:A to R5:P1.

• Jika Anda mempertimbangkan penggunaan modul NFC (IC1 adalah modul NT3H2111W0FTTJ), Anda perlu memastikan bahwa pin SCL dan SDA terhubung ke pin komunikasi sesuai dengan mikrokontroler atau perangkat Anda yang lain.

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• Purpose: This PCB business card showcases the user's portfolio with functionality using NFC to link to their Flux page. It incorporates various components and modules to enhance its features.
• Features:
  • NFC functionality for linking to a webpage.
  • Additional electronic components to add more features.
  • Instructions and templates for personalizing the design with a QR code.

1. NFC Chip:
   • NT3H2111W0FTTJ: An NFC IC used to store and transmit data through Near Field Communication. It's connected via I2C interface with pins like SCL, SDA, and power pins.
2. Capacitors and Resistors:
   • Capacitors: $C16$ (220nF) and $C15$ (7pF) are used for decoupling and tuning the circuit.
   • Resistor: $R5$ has a resistance value of 47 ohms, possibly used for current limiting or other purposes.
3. LED:
   • $LED9$ provides visual feedback and indicates power or operational status.
4. Microcontroller Boilerplate:
   • This component includes multiple pin connections for interfacing with other modules, providing a platform for further development and integration of features.
5. Boost Converter:
   • Used to regulate and boost the voltage supply to the circuit if necessary.

• NFC Interface: The NFC IC ($IC1$) is connected to various components through defined nets such as:
  • VOUT and VCC: These power the components ($IC1:VOUT$ to $VCC$).
  • GND: A common ground connection ($IC1:VSS$ to $LED9:K$).
  • Other Logic: Connections for controlling LEDs and managing signals between the microcontroller and other components.

• Links to Resources: The project includes links to build instructions and additional project documentation such as a Bill of Materials (BoM).
• Licensing: Creative Commons license allows for sharing and adaptation with attribution.

febrilumanga

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• The project is a PCB business card featuring various components, including an NFC module, LEDs, resistors, capacitors, and a microcontroller.
• The NFC module is based on the NT3H2111W0FTTJ.
• The card may also include notes or instructions, likely related to assembly or use.

• NFC Module: Uses the NT3H2111W0FTTJ IC.
• LED: LED9 is included for indication.
• Resistors & Capacitors: Includes R5 $47$ ohms and capacitors like C15 $7pF$ and C16 $220nF$.
• Microcontroller Boilerplate: Basic microcontroller pin configuration is set up as a boilerplate.

• Ground (GND) is connected to various components like the NFC IC and LED.
• VCC (Power) is distributed among the NFC IC, resistor R5, and capacitor C16.
• NFC Interface is routed through connections between IC1 LA, LB, and capacitor C15.
• LED Connection: Connects R5:P1 to LED9:A.

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1. Transistor atau Modul Amplifikasi: Untuk daya 5000 watt, Anda mungkin perlu menggunakan beberapa transistor daya tinggi atau modul amplifikasi seperti MOSFET atau IGBT yang dirangkai secara paralel.
2. Power Supply: Power supply harus mampu menyediakan tegangan dan arus cukup besar. Anda mungkin perlu menggunakan transformator besar dan rangkaian penyearah untuk menyesuaikan tegangan ke level yang sesuai.
3. Pendinginan: Gunakan heat sink besar dan/atau kipas untuk menghilangkan panas dari komponen utama, terutama transistor.
4. Proteksi: Sertakan sirkuit proteksi untuk mencegah arus berlebih dan panas berlebih, yang dapat menyebabkan kerusakan pada sirkuit.

1. Pre-amplifier: Untuk mengelola sinyal masuk dan memastikan kualitas suara yang baik sebelum penguatan utama.
2. Stage Penguatan Utama: Di sinilah sebagian besar penguatan daya terjadi. Menggunakan konfigurasi Class AB atau Class D mungkin lebih efisien untuk daya tinggi.
3. Output Stage: Mengatur output akhir ke speaker, memastikan impedansi yang sesuai untuk mencocokkan daya keluaran dan keselamatan speaker.

• Efisiensi: Efisiensi sirkuit sangat penting untuk mengurangi panas yang dihasilkan dan memperpanjang umur komponen.
• Pengelolaan Panas: Sistem pendingin yang dirancang dengan baik sangat penting.
• Komponen: Mendapatkan komponen berkualitas yang dapat menangani arus dan tegangan tinggi.

febrilumanga

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1. Transistor Daya: Beberapa pasangan transistor MOSFET atau IGBT yang dirangkai paralel. Misalnya, MOSFET seperti IRFP240 dan IRFP9240.
2. Power Supply: Transformator besar dengan kapasitas hingga 5000 VA, dioda penyearah, kapasitor filter (seperti 10,000 µF/80V atau sesuai kebutuhan tegangan).
3. Pendingin: Heat sink besar dan kipas pendingin untuk setiap transistor daya.
4. Pre-amplifier IC: IC seperti NE5532 atau LM358 untuk tahap amplifikasi awal.
5. Resistor, kapasitor, dan induktor: Berbagai nilai untuk biasing dan filter.
6. Proteksi: Termistor dan saklar otomatis untuk proteksi arus berlebih.
7. Output Transformer (opsional): Tergantung pada desain, jika menggunakan Class D, tidak selalu diperlukan.

Plaintext
+--------------------+
| Power Supply       |
| +------$$T$$-------+ |
| | Bridge Rectifier| |
| +------$$R$$-------+ |
| | Large Caps     | |
+-----$$C$$ $$C$$------->|
      |     $$R$$     |
+-----+     $$O$$     |
| Amplifier Module  |-----+-----$$Speaker$$
| (Class D)         |     |     
| +---$$MOSFET$$----+ |     |
| |   $$MOSFET$$    | |     +---$$Protection$$
| +-------------->+ |
| | Low Pass Filter | 
+----------------->|

• Power Supply: Memberikan daya DC ke amplifier. Gunakan dioda penyearah untuk menghasilkan tegangan DC dari transformator AC besar, dan tambahkan kapasitor smoothing untuk mengurangi noise pada tegangan output.
• Amplifier Stage: Gunakan modul Class D untuk efisiensi tinggi. Class D amplifier bekerja dengan cara PWM (Pulse Width Modulation) untuk mengoperasikan transistor daya hanya dalam kondisi sepenuhnya ON atau OFF, mengurangi kehilangan daya.
• Low Pass Filter: Menghilangkan komponen frekuensi tinggi dari modul Class D, hanya menyisakan sinyal audio asli untuk diberikan ke speaker.
• Pendingin: Penting untuk menjaga suhu transistor tetap rendah.

1. Pencocokan Impedansi: Penting agar impedansi output dari amplifier sesuai dengan impedansi speaker untuk menghindari kerusakan.
2. Stabilitas: Pastikan sirkuit memiliki proteksi terhadap arus pendek dan pemanasan berlebih.
3. Konstruksi Fisik: Mengatur tata letak komponen dengan baik untuk menghindari interferensi dan memastikan disipasi panas yang efisien.

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