Project was named 35mm STM32 BLDC Controller and a specification file was created.
Added and wired the core schematic: STM32H725-family MCU, DRV8316-family motor driver, MA702 encoder, CAN transceiver, 5V buck, 3.3V LDO, USB-C + USB ESD, dual JST-GH CAN connectors, XT30 input, motor phase connector, and support passives.
Set the PCB to 35 x 35 mm with a 4-layer stackup intent: top signal/power, L2 ground plane, L3 power plane, bottom signal/encoder.
Enforced the critical MA702 placement: U3 is set to bottom layer at board center (0 mm, 0 mm).
Success criteria review
✅ Specified functional components were added, with documented substitutions where exact library MPNs were unavailable.
✅ ODrive Micro-style key schematic wiring was applied for PWM, current-sense outputs, MA702 SPI, CAN RX/TX, and USB DP/DM through ESD/series resistors.
✅ Board size and 4-layer stackup were configured.
✅ MA702 exact center/bottom placement was enforced.
❌ Full component placement, routing, dense DRV8316 via-in-pad thermal array, and ERC/DRC cleanup are still incomplete.
Next steps
Finish PCB placement for all remaining components, especially edge connectors and DRV8316 power-stage clustering.
Add/verify the DRV8316 thermal via-in-pad GND array.
Route USB/CAN/high-current motor and power nets, then review and clear ERC/DRC issues.
Note: execution stopped because credits were exhausted before layout/routing/final checks could be completed.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant