Solar Bee Monitor Schematic
Worked for 27 mins 24 sec
Focused recovery status: Regulator recovered; routing blocked by auto-route job state
Completed
Pre-route assessment
- Confirmed the original TPS56528DDA footprint was malformed, not a valid segmented PowerPAD:
- TI specifies one exposed GND PowerPAD.
- Flux footprint contained two coincident, unnetted mount pads plus a separate undersized GND pad.
- Project-local overrides could not disable the nested duplicate pads.
- Filed an internal part-quality report for the TPS56528DDA Flux library part.
- Replaced
U_5Vwith verified Texas Instruments TPS56637RPAR:- 4.5–28 V input
- 5 V adjustable output
- 6 A continuous rating
- 10-pin 3 × 3 mm VQFN-HR package
- Completed inspect → replace → rewire → verify → re-place workflow.
- Updated the support network to TI’s 5 V recommendations:
L_5V: 3.3 µH, reference-class 10.5 A peak / 9.7 A RMS- Input: 2 × 22 µF plus 100 nF VIN–PGND
- Output: 2 × 22 µF
- Bootstrap: 100 nF BOOT–SW
- Feedback: 73.2 kΩ / 10.0 kΩ
- PG pull-up: 100 kΩ
- MODE tied to GND for Eco-mode
- AGND and PGND connected to GND
- NC explicitly marked no-connect
- Fresh ERC returned zero concrete errors.
- Re-placed only the local 5 V stage and made one small
J_BATshift to clear a mounting hole. - Updated Project Specification, Bring-Up Plan, Safety Analysis and FMEA.
Table
| Item | Result |
|---|---|
| Final regulator | TPS56637RPAR |
| Regulator action | Replaced, not overridden |
| Components | 75 |
| Nets | 47 |
| Placed components | 75 / 75 |
| Board | 100 × 100 mm, 2 mm corners |
| Stackup | Standard 4-layer |
| Component fill | 16.6% |
| NodeMCU row spacing | 25.4 mm exact |
| Header positions | X = −12.7 mm and +12.7 mm; Y = 20 mm |
| Header orientation | Parallel, 0°, matching pin-1 direction |
| Airwires | 124 |
| Routed completion | Not completed |
The replacement footprint’s four overlapping VIN copper terminals are an intentional HotRod-QFN construction. They are all on
BAT_PROTECTED_IF; the checker states they will be treated as one pin. This is not the original malformed thermal-pad defect.No fresh errors were reported for:
- Missing footprints
- Component body overlap
- Components outside board
- Invalid layers
- Overlapping copper
- Dangling traces
A new auto-route job was started, but the Flux job remained cycling through
Fresh DRC counts
generating, stopped, resuming, and restarted states without persisting routes. The job could not be cleanly completed or restarted within this pass. I did not force routing or manually attempt 124 connections.- Errors: 124
- Airwires: 124
- Warnings: 1
- Component override on
U_5V:VIN_1; this originates from the replacement library footprint’s HotRod-QFN copper construction.
- Component override on
- Other requested manufacturing-critical categories: no findings returned.
- NodeMCU header geometry remains exact and unchanged.
- USB and antenna ends remain identified.
- The antenna keepout marking/zone remains present, but all-layer copper exclusion cannot be conclusively verified until routing and pours complete.
- Four 3.2 mm NPTH mounting holes remain present.
- Connector edge placement and safety markings were preserved.
Not manufacturing-ready.
The regulator defect is resolved and the schematic is electrically restored, but the board still has 124 airwires because the auto-route service did not complete. Power pours, GND stitching, all-layer antenna exclusion, current-density verification and final silkscreen/copper review therefore remain blocked.
Thought for 9 sec
The 100 × 100 mm, 4-layer PCB is fully placed with 75 components, four mounting holes, exact 25.4 mm NodeMCU header spacing, connector labels, and antenna keepout. The defective TPS56528 footprint was reported and replaced with a verified TPS56637RPAR 6 A buck; ERC is clean.
Blocked: the routing service failed to persist routes, leaving 124 airwires, so the PCB is not manufacturing-ready. Routing, power pours, antenna copper-exclusion verification, and final DRC must be retried after the routing service recovers.
Retry routing later
Explain blocker
Review placement
Check manufacturability
Export docs only
