Resized the PCB to 100 × 75 mm, 4-layer, to add routing margin while staying within a common prototype size.
Re-placed the layout so DS1 remains top-side, while U4/MAX30102 and U5/MLX90614 are on the bottom wrist side, close together near the center beneath the OLED.
Kept the ESP32-C3 antenna at the edge facing outward, with USB-C, battery connector, switch, and power parts arranged away from the sensor cluster.
Success criteria review
✅ Skin-touch sensors are now bottom-side and centered under the OLED.
✅ OLED remains top-side and antenna placement was preserved at the board edge.
❌ Routing is not complete: the latest validation still reported 87 airwires and 12 overlapping-copper issues before the final re-placement, and I could not continue to reroute/validate further.
❌ Manufacturing export files were not generated, because export should only happen after DRC is clean.
Next steps
Run routing cleanup/autorouting next, then re-check DRC until airwires and copper conflicts are cleared.
After DRC is clean, generate the Gerber, BOM, and pick-and-place manufacturing package.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant