System architecture Mermaid diagram drafted and stored in project properties
Remaining tasks
Supporting Components and Power
Add power MOSFETs sized for 10 A
Place power inductor, bulk electrolytic/polymer and ceramic capacitors
Add decoupling capacitors for MCU, regulator, and gate drivers
Include bootstrap diodes and resistors for gate drivers
Connectivity
Place 3-pin UART header and wire to MCU USART TX/RX
Wire MCU clock, decoupling, SWDIO/SWCLK pads
Connect PWM outputs to gate driver inputs
Tie gate driver outputs to MOSFET gates and power stage
Route current shunt amplifier and voltage divider signals to MCU ADC
Add TVS diodes, input fuse, and reverse-polarity protection
Schematic review
Verify all functional blocks are complete
Check voltage ratings, resistor power ratings, MOSFET specs
Confirm ground and power nets are properly named and tied
Success criteria
Not yet met: the power stage, sensing/protection circuits, full interconnections, and net wiring are still missing.
Next step
Proceed to the Supporting Components and Power stage: select and add the four bidirectional MOSFETs, inductor, bulk and decoupling capacitors, and bootstrap components to implement the 10 A power stage.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant