Ekran goruntusune gore genel yerlesim dogru yonde (sol: J1/R_BURDEN, sag: J2), ama kablolama (airwire) uzunluklari ve izolasyon bariyeri etrafinda “blok” sirasi karismis. Asagidaki tasimalar, hem daha temiz routing hem de izolasyon kurallarina uyum icin en hizli iyilestirme olur:
1) Izolasyon bariyerini ortala ve yan yana yap
U3 ile U_DCDC’yi kartin tam ortasinda, birbirine cok yakin ve dikey slotu kopruleyecek sekilde yan yana konumlandirin.
Hedef: U3’nin sol pinleri “primary”, sag pinleri “secondary” tarafinda kalsin; U_DCDC icin de aynisi.
Su an ikisi ortada ama aralari ve baglantilari daginik; ortadaki airwire “yelpazesi” bu yuzden buyuyor.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant