I’m blocked from executing design changes right now because this session has no remaining execution credits. I have not modified the project yet: it is still an empty draft project with 0 components and 0 nets.
What remains to be done:
Rename/spec the project as DizziGuard+ wearable health-monitoring PCB.
Build the full schematic: ESP32-C3FN4, MAX30102, MPU6050, OLED I2C connector, USB-C charging, LiPo protection, 3.3 V regulator, buttons, UART/debug/test pads, battery monitor, decoupling, crystal/RF network, and indicators.
Verify each IC against its datasheet, especially ESP32-C3 RF/crystal requirements, MAX30102 optical layout/power filtering, MPU6050 QFN pinout, charger/protection, and regulator passives.
Run ERC/review and resolve all schematic issues.
Create supporting documentation: project specification, power budget, firmware pin map, bring-up plan, and manufacturing notes.
After schematic validation, proceed to 46.9 mm × 17.9 mm 2-layer rounded-corner layout with bottom-side MAX30102 skin-contact placement, RF antenna clearance, separated sensor/digital areas, dual ground pours, side buttons, top OLED connector, USB-C/battery access, and production test pads.
Route and validate DRC, then prepare pilot-batch manufacturing recommendations.
When credits are available, the next step is to start with requirements capture, power budget, datasheet-grounded component selection, and complete schematic creation before moving to PCB layout.
Wirelessly connects nets on schematic. Used to organize schematics and separate functional blocks. To wirelessly connect net portals, give them same designator. #portal
General Purpose Thick Film Standard Power
and High-Power Chip Resistor
47 kOhms ±5% 0.125W, 1/8W Chip Resistor 0805 (2012 Metric) Automotive AEC-Q200 Thick Film
Features:
- RMCF – standard power ratings
- RMCP – high power ratings
- Nickel barrier terminations standard
- Power derating from 100% at 70ºC to zero at +155ºC
- RoHS compliant, REACH compliant, and halogen free
- AEC-Q200 compliant