I’ll verify the LAN7431 and KSZ9477 package land patterns against manufacturer documentation, correct only the faulty exposed-pad geometry, preserve pin mappings and placements, then rerun overlapping-copper DRC.

This requires live datasheet research and footprint editing in Agent mode.

I’ll verify both packages against Microchip’s authoritative land-pattern data, correct the exposed pads without changing signal-pad mappings, and rerun DRC to prove the 68 internal copper errors are resolved.

Manufacturer comparison is still in progress; the footprint geometry is being checked dimension-by-dimension before any pad override is accepted. I’ll continue through the DRC verification.

The footprint repair has completed. I’ll reconcile its manufacturer dimensions and edits against the board, then independently rerun overlapping-copper DRC and confirm U2/U3 placement and connectivity were preserved.

U3 was corrected against Microchip’s land pattern, clearing 64 of 68 copper errors while preserving placement and connectivity. U2 remains unchanged with four errors because its exact recommended PCB land dimensions could not be authoritatively retrieved; details are in U2/U3 Footprint Repair Report.

Open item: obtain Microchip package specification 00000049BZ for the LAN7431 YXX package, then correct U2 without guessing.