CM5 Ethernet Switch

Thought for 7 sec

I could not retrieve or reconcile the executor’s completed report, and no further project changes were verified in this session.

The last confirmed requested scope remains:

180 × 120 mm board outline
Six-layer stackup
Preserved connector edge assignments
Restored/organized CM5 → LAN7431 → KSZ9477 → RJ45 schematic flow
U2/U3 placement inside the enlarged board
Post-change ERC, DRC, and connectivity verification

Execution stopped because your ACUs ran out.

dgobc

continue

Thought for 15 mins 58 sec

flux

The resumed implementation is still running; the executor is applying the board/stackup and coordinated schematic/PCB placement changes. I’ll continue through verification rather than stop mid-change.

Thought for 13 mins 9 sec

Awaiting 1 background task

Received notification from "Schematic PCB Layout" that it finished — picking the work back up.

Thought for 11 sec

flux

The Schematic PCB Layout executor reached completed status, but I could not retrieve and reconcile its final report before tool access ended. Therefore, I cannot safely confirm which board resize, six-layer stackup, schematic arrangement, U2/U3 placement, or verification changes actually landed.

Remaining work:

Retrieve the executor’s final report.
Inspect the board outline and stackup.
Confirm connector edge assignments and U1/U2/U3 placement.
Verify schematic connectivity, ERC, component bounds, overlaps, and DRC.
Fix any incomplete or failed items from that review.

Execution stopped because your ACUs ran out.

Inspect completed layout

Verify layout and checks

Review commit changes

Files

Pins

Symbol

Layout

Preview

Implementation Report

Scope status

Table

Item	Status	Result
180 × 120 mm rectangular PCB	Completed	Board changed from 160 × 100 mm to 180 × 120 mm, sharp-corner rectangle.
Standard 6 Layer stackup	Completed	Applied six copper layers: Signal / Ground Plane / Signal / Power Plane / Ground Plane / Signal. Standard 0.6 mm pad / 0.3 mm drilled through-vias span L1→L6.
PCB U1/U2/U3 placement	Completed	U1 brought inside the board; U2 placed beside U1; U3 placed to the right of U2 toward the LAN ports.
Connector preservation	Completed with necessary edge adjustment	J1/J2/J8 were left at their valid positions. J3–J6 were translated to the enlarged right edge without rotation changes. J7 was moved in-bounds on its existing bottom-side region.
Support-cluster placement	Completed	PCIe capacitors, clocks, reset/bias/strap parts, decouplers, and each MagJack LED/center-tap cluster were moved with their parent blocks.
Schematic U1 restoration and visual reflow	Unsupported / unattempted	The available project write tools do not expose schematic symbol/wire arrangement. U1 remains at schematic `(485, -18881.4)`, not requested `(96, -985)`. No schematic placement or wire geometry was changed.
Routing	Completed as prohibited action	No routing command was run and no logical connectivity was edited.

Exact board and primary placement mutations

Board

Size: 160 × 100 mm → 180 × 120 mm
Shape: rectangle, 0 mm corner radius
Stackup: 4 copper layers → Standard 6 Layer (Custom), total thickness 1.48112 mm
1. Top Copper — Signal
2. Mid-Layer 1 — Ground Plane
3. Mid-Layer 2 — Signal
4. Mid-Layer 3 — Power Plane
5. Mid-Layer 4 — Ground Plane
6. Bottom Copper — Signal
Via technology retained: through-hole, L1→L6, 0.6 mm pad / 0.3 mm drill

Primary components and connectors — final PCB state

Table

Ref	Final position (mm)	Rotation	Mutation
U1	`(-57.8787, 13.6213)`	270°	Moved from `(-74, 11.5)` because the former footprint extended beyond the new left board edge; final nudge cleared local overlaps.
U2	`(7, 10)`	unchanged	Moved from `(-23.77, 124.07)`.
U3	`(32, 10)`	unchanged	Moved from `(-34.15, 207.81)`.
J1	`(-35, -38.51)`	270°	Unchanged.
J2	`(-55, 32.93)`	90°	Unchanged.
J3	`(73, -5)`	90°	X moved from 58 mm to the enlarged right edge.
J4	`(73, 16.5)`	90°	X moved from 58 mm to the enlarged right edge.
J5	`(73, 38)`	90°	X moved from 62 mm to the enlarged right edge.
J6	`(73, -38)`	90°	X moved from 69 mm; kept separate as the CM5 native WAN port.
J7	`(-2.05, -43.9452)`	unchanged	Moved from out-of-bounds `(-2.0452, -81.7395)` and clamped in-bounds.
J8	`(15, 41.9476)`	unchanged	Unchanged.

High-speed and IC support placement

PCIe coupling capacitors:
- C1 (0, 7)
- C2 (0, 13)
LAN7431 clock:
- Y1 (7, 25)
- C86 (3, 25)
- C87 (11, 25)
KSZ9477 clock:
- Y2 (32, 31)
- C88 (28, 31)
- C89 (36, 31)
U2 bias/reset/config cluster: R1, R2, R5, C85, R27, R28, R29 arranged around anchor (7, -9).
U3 bias/reset/strap cluster: R3, R4, R6, R7, R8, C84 arranged around anchor (32, -10).
U2 decoupling was reflowed into four short rows, x approximately 1…15 mm, at y 17.5, 21, 2.5, and -1 mm, keeping the U1 body and U2–U3 corridor clear.
U3 decoupling was placed in four rows, x approximately 19…45 mm, at y 20.5, 24, -0.5, and -4 mm.

MagJack support clusters

J1: C90–C93, R17, R18 around (-7, -38)
J2: C94–C97, R19, R30 around (-27, 33)
J3: C98–C101, R31, R32 around (65, -19)
J4: C102–C105, R33, R34 around (46, 16.5)
J5: C106–C109, R35, R36 around (46, 38)
J6: C110–C113, R37, R38 around (46, -38)

Other in-bounds remediation

The placement pass also brought all previously out-of-bounds support parts inside the outline, including U8, J7, L1/L2/L4, F1, C2/C5/C6/C8/C11/C12/C14–C16/C18/C20/C21/C23–C25/C28–C30/C32–C34/C37/C39/C41/C42/C45/C47–C49/C51/C54/C65/C76/C78/C79/C87/C88, and associated resistors. U5/U6/U7/U8 support parts were regrouped sufficiently to remove movement-induced component overlaps.

Verification evidence

Connectivity

Project diff from baseline commit e3affc24 to final implementation commit 6bf5978d reports:
- SCHEMATIC (no textual changes)
Therefore net membership, no-connect state, labels, and logical connectivity were not altered by this batch.

Bounds, overlap, and keepout

Final deterministic placement result:
- Remaining overlaps: 0
- Remaining keepout violations: 0
- Remaining out-of-bounds: 0
Final component aggregate bounds for the primary moved set are within the x = -90…90 mm, y = -60…60 mm board outline.
Targeted DRC queries returned no findings for component-outside-board, component-body-overlap, keepout, edge-placement, invalid-layer, protected-intrusion, or stackup validation checks.

ERC

ERC reports exactly two errors:

U1:VBUS_EN power input not connected
U1:VBAT power input not connected

These are the previously identified baked U1 pin-metadata false positives. No fake circuitry was added.

Copper/footprint DRC

Baseline overlapping-copper count: 74
Final overlapping-copper count: 68
The remaining 68 findings are intrinsic to the existing U2/U3 library footprints: exposed-pad copper overlaps unnamed/mount pad primitives within the same footprints. They were present before this placement batch; component movement did not create them.
No final component-to-component body overlap remains.

Placement/routing-feasibility check

The board check reports 10 warnings and one informational item. They are not new logical-connectivity changes:

U5 duplicate same-net overlapping PGND/LX pads: three warnings, treated as merged pads.
U2 and U3 exposed-pad versus unnamed/mount-pad footprint conflicts: two warnings, matching the pre-existing copper DRC.
PCIe differential pair cannot be twinned from existing pin mapping: one warning.
Existing RGMII net metadata incorrectly classifies RXC/RX_CTL and TXD2/TXC as differential pairs, producing four unroutable-pair warnings.
Via-at-SMD on an exposed pad: one informational advisory.

No auto-route was started. The net/differential-pair and footprint definitions must be corrected before routing, but they are pre-existing upstream metadata/library issues rather than placement regressions.

Final assessment

The PCB setup and placement batch is complete: 180 × 120 mm, six layers, all components in bounds, zero component-body overlaps, zero keepout violations, preserved connector rotations, and unchanged schematic connectivity. The overall original brief is partially complete because schematic symbol/wire arrangement is blocked by the currently unavailable schematic placement mutation interface.

Scope status
Exact board and primary placement mutations
Board
Primary components and connectors — final PCB state
High-speed and IC support placement
MagJack support clusters
Other in-bounds remediation
Verification evidence
Connectivity
Bounds, overlap, and keepout
ERC
Copper/footprint DRC
Placement/routing-feasibility check
Final assessment