CM5 Ethernet Switch

"Power Stage Placement" completed.

flux

Action 4 remains blocked: safe correction of the placed terminal metadata could not be verified, so no design changes were made. Fresh checks still show three Missing Power errors—U1 VBUS_EN/VBAT and U2 VDD12_SW_OUT—plus the incorrect U2/L2 association; placement and copper checks remain clear, with details in ERC Metadata Remediation.
Shall I proceed with action 5’s routing-constraint review only, keeping routing and geometry changes paused until the stackup is resolved?
D

dgobc

ok

flux

I’ll review the PCIe, RGMII, and Ethernet routing constraints only—pair definitions, impedance targets, timing/length requirements, and reference planes. I won’t change geometry or start routing while the stackup remains unresolved.
Thought for 17 mins 9 sec
Thought for 17 sec
Awaiting 1 task
"PCB Routing Constraint Review" completed.

flux

The routing-constraint review reported completion, but I could not retrieve its findings before tool access ended, so action 5 is not yet reconciled or verified.
This session requested a read-only review; no board edits or routing were applied by me. Next is to retrieve the report, assess its PCIe/RGMII/Ethernet findings, and present the results for your approval before any further action.
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Pins

Symbol

Layout

3D View

Implementation Report
Scope status

Table

ItemStatusResult
180 × 120 mm rectangular PCBCompletedBoard changed from 160 × 100 mm to 180 × 120 mm, sharp-corner rectangle.
Standard 6 Layer stackupCompletedApplied six copper layers: Signal / Ground Plane / Signal / Power Plane / Ground Plane / Signal. Standard 0.6 mm pad / 0.3 mm drilled through-vias span L1→L6.
PCB U1/U2/U3 placementCompletedU1 brought inside the board; U2 placed beside U1; U3 placed to the right of U2 toward the LAN ports.
Connector preservationCompleted with necessary edge adjustmentJ1/J2/J8 were left at their valid positions. J3–J6 were translated to the enlarged right edge without rotation changes. J7 was moved in-bounds on its existing bottom-side region.
Support-cluster placementCompletedPCIe capacitors, clocks, reset/bias/strap parts, decouplers, and each MagJack LED/center-tap cluster were moved with their parent blocks.
Schematic U1 restoration and visual reflowUnsupported / unattemptedThe available project write tools do not expose schematic symbol/wire arrangement. U1 remains at schematic (485, -18881.4), not requested (96, -985). No schematic placement or wire geometry was changed.
RoutingCompleted as prohibited actionNo routing command was run and no logical connectivity was edited.
Exact board and primary placement mutations
Board
  • Size: 160 × 100 mm → 180 × 120 mm
  • Shape: rectangle, 0 mm corner radius
  • Stackup: 4 copper layers → Standard 6 Layer (Custom), total thickness 1.48112 mm
    1. Top Copper — Signal
    2. Mid-Layer 1 — Ground Plane
    3. Mid-Layer 2 — Signal
    4. Mid-Layer 3 — Power Plane
    5. Mid-Layer 4 — Ground Plane
    6. Bottom Copper — Signal
  • Via technology retained: through-hole, L1→L6, 0.6 mm pad / 0.3 mm drill
Primary components and connectors — final PCB state

Table

RefFinal position (mm)RotationMutation
U1(-57.8787, 13.6213)270°Moved from (-74, 11.5) because the former footprint extended beyond the new left board edge; final nudge cleared local overlaps.
U2(7, 10)unchangedMoved from (-23.77, 124.07).
U3(32, 10)unchangedMoved from (-34.15, 207.81).
J1(-35, -38.51)270°Unchanged.
J2(-55, 32.93)90°Unchanged.
J3(73, -5)90°X moved from 58 mm to the enlarged right edge.
J4(73, 16.5)90°X moved from 58 mm to the enlarged right edge.
J5(73, 38)90°X moved from 62 mm to the enlarged right edge.
J6(73, -38)90°X moved from 69 mm; kept separate as the CM5 native WAN port.
J7(-2.05, -43.9452)unchangedMoved from out-of-bounds (-2.0452, -81.7395) and clamped in-bounds.
J8(15, 41.9476)unchangedUnchanged.
High-speed and IC support placement
  • PCIe coupling capacitors:
    • C1 (0, 7)
    • C2 (0, 13)
  • LAN7431 clock:
    • Y1 (7, 25)
    • C86 (3, 25)
    • C87 (11, 25)
  • KSZ9477 clock:
    • Y2 (32, 31)
    • C88 (28, 31)
    • C89 (36, 31)
  • U2 bias/reset/config cluster: R1, R2, R5, C85, R27, R28, R29 arranged around anchor (7, -9).
  • U3 bias/reset/strap cluster: R3, R4, R6, R7, R8, C84 arranged around anchor (32, -10).
  • U2 decoupling was reflowed into four short rows, x approximately 1…15 mm, at y 17.5, 21, 2.5, and -1 mm, keeping the U1 body and U2–U3 corridor clear.
  • U3 decoupling was placed in four rows, x approximately 19…45 mm, at y 20.5, 24, -0.5, and -4 mm.
MagJack support clusters
  • J1: C90–C93, R17, R18 around (-7, -38)
  • J2: C94–C97, R19, R30 around (-27, 33)
  • J3: C98–C101, R31, R32 around (65, -19)
  • J4: C102–C105, R33, R34 around (46, 16.5)
  • J5: C106–C109, R35, R36 around (46, 38)
  • J6: C110–C113, R37, R38 around (46, -38)
Other in-bounds remediation
The placement pass also brought all previously out-of-bounds support parts inside the outline, including U8, J7, L1/L2/L4, F1, C2/C5/C6/C8/C11/C12/C14–C16/C18/C20/C21/C23–C25/C28–C30/C32–C34/C37/C39/C41/C42/C45/C47–C49/C51/C54/C65/C76/C78/C79/C87/C88, and associated resistors. U5/U6/U7/U8 support parts were regrouped sufficiently to remove movement-induced component overlaps.
Verification evidence
Connectivity
  • Project diff from baseline commit e3affc24 to final implementation commit 6bf5978d reports:
    • SCHEMATIC (no textual changes)
  • Therefore net membership, no-connect state, labels, and logical connectivity were not altered by this batch.
Bounds, overlap, and keepout
  • Final deterministic placement result:
    • Remaining overlaps: 0
    • Remaining keepout violations: 0
    • Remaining out-of-bounds: 0
  • Final component aggregate bounds for the primary moved set are within the x = -90…90 mm, y = -60…60 mm board outline.
  • Targeted DRC queries returned no findings for component-outside-board, component-body-overlap, keepout, edge-placement, invalid-layer, protected-intrusion, or stackup validation checks.
ERC
ERC reports exactly two errors:
  1. U1:VBUS_EN power input not connected
  2. U1:VBAT power input not connected
These are the previously identified baked U1 pin-metadata false positives. No fake circuitry was added.
Copper/footprint DRC
  • Baseline overlapping-copper count: 74
  • Final overlapping-copper count: 68
  • The remaining 68 findings are intrinsic to the existing U2/U3 library footprints: exposed-pad copper overlaps unnamed/mount pad primitives within the same footprints. They were present before this placement batch; component movement did not create them.
  • No final component-to-component body overlap remains.
Placement/routing-feasibility check
The board check reports 10 warnings and one informational item. They are not new logical-connectivity changes:
  • U5 duplicate same-net overlapping PGND/LX pads: three warnings, treated as merged pads.
  • U2 and U3 exposed-pad versus unnamed/mount-pad footprint conflicts: two warnings, matching the pre-existing copper DRC.
  • PCIe differential pair cannot be twinned from existing pin mapping: one warning.
  • Existing RGMII net metadata incorrectly classifies RXC/RX_CTL and TXD2/TXC as differential pairs, producing four unroutable-pair warnings.
  • Via-at-SMD on an exposed pad: one informational advisory.
No auto-route was started. The net/differential-pair and footprint definitions must be corrected before routing, but they are pre-existing upstream metadata/library issues rather than placement regressions.
Final assessment
The PCB setup and placement batch is complete: 180 × 120 mm, six layers, all components in bounds, zero component-body overlaps, zero keepout violations, preserved connector rotations, and unchanged schematic connectivity. The overall original brief is partially complete because schematic symbol/wire arrangement is blocked by the currently unavailable schematic placement mutation interface.

  • Scope status

  • Exact board and primary placement mutations

  • Board

  • Primary components and connectors — final PCB state

  • High-speed and IC support placement

  • MagJack support clusters

  • Other in-bounds remediation

  • Verification evidence

  • Connectivity

  • Bounds, overlap, and keepout

  • ERC

  • Copper/footprint DRC

  • Placement/routing-feasibility check

  • Final assessment