Smart Relay Logic Board Design
Thought for 4 sec
- Removed Layout's layer layout rule
Execution stopped due to insufficient credits.
1:06
Editing layout rules.
Started: Cleaning invalid-layer traces and layout rules.
Editing layout rules.
Thought for 3 sec
- Set Layout's minTraceWidth to "0.20mm"
- Set Layout's traceWidth to "0.25mm"
- Set Layout's keepOut to "0.20mm"
- Set Layout's boardInsetMargin to "0.25mm"
Thought
Work done
- Reviewed the current schematic and layout state for U1, U2, P1, P2, passives, test points, and mounting holes.
- Confirmed the actual blocker in the layout: the board still contains many legacy route segments on invalid inner layers from an older 4-layer state, plus overlapping and floating copper.
- Reapplied conservative board-level layout rules for the current 2-layer board and removed one stale layout-level layer override.
- Verified that manufacturing MPN and footprint checks are clean, but PCB DRC is still not clean.
Success criteria review
- ✅ Identified the root cause of the remaining PCB issues.
- ✅ Verified the project is using a 2-layer stackup in the active layout view.
- ❌ Component placement was not completed in this session.
- ❌ Airwires, floating copper, and overlapping copper were not cleared.
- ❌ The antenna keepout and final silkscreen placement were not completed.
Next steps
The next step is to remove or regenerate the legacy invalid-layer route segments, then place U1 at the board edge with antenna clearance, place the remaining components per the placement plan, and re-run DRC until airwires and copper errors are resolved. I cannot continue that execution in this session.
The next step is to remove or regenerate the legacy invalid-layer route segments, then place U1 at the board edge with antenna clearance, place the remaining components per the placement plan, and re-run DRC until airwires and copper errors are resolved. I cannot continue that execution in this session.
